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1. 发明授权

EP2082834B1 Method of operating substrate processing apparatus 有权
标题翻译： Verfahren zum Betrieb einer Substratverarbeitungsvorrichtung
公开(公告)号：EP2082834B1
公开(公告)日：2017-01-04
申请号：EP09000972.1
申请日：2009-01-23
申请人： EBARA CORPORATION
发明人： Torii, Hiroomi , Nishida, Hiroaki , Kaneko, Hiroyuki , Date, Misao , Mitsuya, Takashi , Nakamura, Takamasa
IPC分类号： B24B37/04 , H01L21/677
CPC分类号： H01L21/67751 , B24B37/345

2. 发明公开

EP3012859A1 DEVICE AND METHOD FOR TRANSFERRING SUBSTRATE FOR FORMING COMPOUND SEMICONDUCTOR FILM, AND SYSTEM AND METHOD FOR FORMING COMPOUND SEMICONDUCTOR FILM 审中-公开
标题翻译：设备和方法制备基片，生产复合半导体膜的系统和方法，生产复合半导体膜
公开(公告)号：EP3012859A1
公开(公告)日：2016-04-27
申请号：EP14814010.6
申请日：2014-04-22
申请人： Tokyo Electron Limited
发明人： MORISAKI, Eisuke , KIMOTO, Tomohisa
IPC分类号： H01L21/677 , C23C16/458 , H01L21/205 , H01L21/683
CPC分类号： H01L21/6875 , C23C16/4581 , C23C16/4584 , C23C16/4585 , H01L21/02529 , H01L21/0254 , H01L21/02546 , H01L21/0262 , H01L21/67742 , H01L21/67748 , H01L21/67751 , H01L21/68742 , H01L21/68764 , H01L21/68771 , H01L21/68785
摘要： A transferring device includes a supporting part configured to support a substrate holder, an elevation member configured to raise and lower a substrate at a substrate holding portion of the substrate holder, and a shielding member configured to be raised and lowered by the elevation member. The shielding member is interposed between the substrate and the elevation member when the elevation member receives the substrate. When the substrate is held on the substrate holding portion, the shielding member shields, at a backside of the substrate, a hole in the substrate holder through which the elevation member is inserted. In a state where the elevation member is raised, the substrate is mounted on the shielding member, or the substrate on shielding member is transferred therefrom.

3. 发明公开

EP2893557A1 SUBSTRATE PROCESSING SYSTEM AND METHOD OF PROCESSING SUBSTRATES 审中-公开
标题翻译：基板处理系统及方法，用于处理衬底
公开(公告)号：EP2893557A1
公开(公告)日：2015-07-15
申请号：EP12769979.1
申请日：2012-09-10
申请人： Applied Materials, Inc.
发明人： GRAW, Oliver , KOPARAL, Erkan
IPC分类号： H01L21/677 , H01L21/67
CPC分类号： H01L21/67745 , C23C14/34 , H01L21/67173 , H01L21/67715 , H01L21/67742 , H01L21/67748 , H01L21/67751 , H01L21/6776
摘要： A substrate processing system is provided. The substrate processing system includes a front end module, a load module, and a process module. The modules are arranged for substrate transfer between these modules along a transport direction. At least one of the front end module, load module and process module includes a transfer device providing at least two individual tracks for supporting a substrate or substrate carrier. Two or more of the at least two tracks of the transfer device may be movable relatively to each other in a switch direction perpendicular to the transport direction. At least the first load module, the second load module and the process module may each include a dual-track transfer device.

4. 发明公开

EP2892834A1 SUBSTRATE TRANSFER DEVICE AND METHOD OF MOVING SUBSTRATES 有权
标题翻译： VERFAHREN ZUM BEWEGEN VON底座SUBSTRATÜBERTRAGUNGSVORRICHTUNG
公开(公告)号：EP2892834A1
公开(公告)日：2015-07-15
申请号：EP12766015.7
申请日：2012-09-10
申请人： Applied Materials, Inc.
发明人： LINDENBERG, Ralph
IPC分类号： B65G49/06 , C23C14/50 , C23C14/56 , H01L21/67 , H01L21/677
CPC分类号： H01L21/67748 , B65G13/00 , B65G47/52 , B65G49/063 , B65G49/067 , B65G2201/02 , C23C14/50 , C23C14/568 , H01L21/67173 , H01L21/677 , H01L21/67751 , H01L21/6776
摘要： A transfer device is provided for substrate transfer along a transport direction and for change between a first transport path and a second transport path extending along the transport direction. The first transport path is displaced with respect to the second transport path in a switch direction perpendicular to the transport direction. The transfer device includes a first substrate support assembly defining a first track to support a substrate or substrate carrier in a chamber. The transfer device further includes a second substrate support assembly defining a second track to support a substrate or substrate carrier in the chamber. The first substrate support assembly and the second substrate support assembly are moveable relative to each other at least in the switch direction.
摘要翻译：提供了一种传送装置，用于沿输送方向的基板传送，并且用于在沿输送方向延伸的第一输送路径和第二输送路径之间的变化。第一输送路径在垂直于输送方向的开关方向上相对于第二输送路径移位。转移装置包括限定用于支撑腔室中的基底或基底载体的第一轨道的第一基底支撑组件。转移装置还包括限定第二轨道以支撑腔室中的衬底或衬底载体的第二衬底支撑组件。第一基板支撑组件和第二基板支撑组件至少在开关方向上可相对于彼此移动。

5. 发明公开

EP2355132A1 Klappen-Transferventil mit schwenkbarem Ventilverschlussbalken 有权
公开(公告)号：EP2355132A1
公开(公告)日：2011-08-10
申请号：EP10152682.0
申请日：2010-02-04
申请人： VAT Holding AG
发明人： Geiser, Friedrich
IPC分类号： H01L21/00 , H01L21/677 , F16K1/20 , F16K51/02 , E05F15/04
CPC分类号： H01L21/67126 , F16K1/2007 , F16K1/2028 , F16K1/205 , F16K51/02 , H01L21/67751 , H01L21/67772
摘要： Die Erfindung betrifft ein Klappen-Transferventil für den Transfer von Halbleiterelementen oder Substraten in eine gasdicht isolierbare Halbleiter- oder Substratbearbeitungs-Prozesskammer, mit einer langgestreckten ersten Öffnung (1), die von einer in einer ersten Dichtebene (41) liegenden ersten Dichtfläche (3) rahmenförmig umschlossen ist, und einem langgestreckten Ventilverschlussbalken (4), der eine mit der ersten Dichtfläche (3) korrespondierende und mit ihr in gasdichten Kontakt bringbare, in einer zweiten Dichtebene (42) liegende zweite Dichtfläche (9) aufweist. Auf der Rückseite (7) des Ventilverschlussbalkens (4) ist eine Abstützung (40) angeordnet, an welcher der Ventilverschlussbalken (4) über eine schwenkbare Verbindung (43) um Kippachse (44) um einen begrenzten Schwenkwinkel schwenkbar angeordnet ist. Mittels einer Schwenklagerung (60) ist die Abstützung (40) mit dem Ventilverschlussbalken (4) um eine Schwenkachse (10) zwischen einer Geschlossenstellung (C) und einer Offenstellung (O) schwenkbar. Die Schwenkachse (10) liegt in der ersten Dichtebene (41) und die Kippachse (44) in der zweiten Dichtebene (42).
摘要翻译：阀具有枢转轴承（60）和阀闭合梁（4），其沿着在闭合位置（C）和打开位置之间平行于纵向轴线（5）的枢转轴线（10）枢转。阀闭合梁的闭合表面（8）在闭合位置覆盖并闭合开口（1）。阀门关闭梁在打开位置中从开口枢转离开以释放开口。枢转轴线位于密封平面（41）上，倾斜轴线（44）位于另一个密封平面（42）上。

6. 发明公开

EP2216277A1 SUBSTRATE HOLDING MECHANISM, SUBSTRATE DELIVERY/RECEPTION MECHANISM, AND SUBSTRATE PROCESSING DEVICE 审中-公开
标题翻译：机制ZUM HALTEN VON SUBSTRATEN，SUBSTRATABGABE - / - AUFNAHMEMECHANISMUS UNDSTRATBEARBEITUNGSVORRICHTUNG
公开(公告)号：EP2216277A1
公开(公告)日：2010-08-11
申请号：EP08836514.3
申请日：2008-09-29
申请人： Evatech Co., Ltd.
发明人： ISHIHARA, Shinichiro , ASHIDA, Hajime , WATANABE, Akira
IPC分类号： B65G49/06 , H01L21/677
CPC分类号： H01L21/67236 , B65G49/063 , B65G49/064 , B65G49/067 , B65G2249/02 , H01L21/67706 , H01L21/67712 , H01L21/67718 , H01L21/67748 , H01L21/67751
摘要： The present invention provides a substrate holding mechanism capable of assuredly holding a substrate and delivering/receiving it: a substrate holding mechanism including a substrate holding unit for holding a rectangular substrate W, comprising: a plurality of substrate holding rollers 120 provided at positions corresponding to two opposite sides of the substrate W on the substrate holding unit and pivotally supported by the substrate holding unit; and a roller driver for rotating the substrate holding rollers 120, wherein: the substrate holding roller 120 comprises a cylinder part 121 and a holding flange 123a or 123b provided along a portion of a circumference of each end of the cylinder part 121; and each of the substrate holding rollers 120 is rotated by the roller driver so that a state of holding edges of the substrate W by the holding flange 123a or 123b and a state of releasing the edges can be switched in accordance with a rotation angle of the substrate holding rollers 120.
摘要翻译：本发明提供一种能够可靠地保持基板并传送/接收基板的基板保持机构：具有用于保持矩形基板W的基板保持单元的基板保持机构，包括：多个基板保持辊120，其设置在与基板保持单元上的基板W的两个相对侧并由基板保持单元枢转地支撑; 以及用于旋转基板保持辊120的辊驱动器，其中：基板保持辊120包括沿着圆筒部121的每个端部的圆周的一部分设置的圆筒部121和保持凸缘123a或123b; 并且每个基板保持辊120被辊驱动器旋转，使得通过保持凸缘123a或123b保持基板W的保持边缘的状态和释放边缘的状态可以根据旋转角度基板保持辊120。

7. 发明公开

EP1496543A4 POLISHING DEVICE AND SUBSTRATE PROCESSING DEVICE 有权
标题翻译：抛光装置及基板处理装置
公开(公告)号：EP1496543A4
公开(公告)日：2010-01-13
申请号：EP03746438
申请日：2003-04-09
申请人： EBARA CORP
发明人： WAKABAYASHI SATOSHI , TOGAWA TETSUJI , KOSUGE RYUICHI , ATO KOJI , SOTOZAKI HIROSHI
IPC分类号： H01L21/304 , B24B37/04 , C23F1/00 , H01L21/00 , H01L21/677 , H01L21/68 , H01L21/687
CPC分类号： B24B37/345 , H01L21/67219 , H01L21/67745 , H01L21/67751 , H01L21/67766 , H01L21/68707

8. 发明公开

EP1855794A2 ETCHING CHAMBER WITH SUBCHAMBER 有权转让
标题翻译：较低的腔体刻蚀室
公开(公告)号：EP1855794A2
公开(公告)日：2007-11-21
申请号：EP06735657.6
申请日：2006-02-22
申请人： Xactix, Inc.
发明人： LEBOUITZ, Kyle, S. , HINDS, Edward, F.
IPC分类号： B01J15/00
CPC分类号： H01L21/67069 , H01L21/67063 , H01L21/67745 , H01L21/67751
摘要： In an apparatus for etching a semiconductor wafer or sample (101), the semiconductor wafer or sample is placed on a sample holder (104) disposed in a first chamber (103). The combination of the semiconductor wafer or sample and the sample holder is enclosed within a second chamber (130) inside the first chamber. Gas is evacuated from the second chamber and an etching gas is introduced into the second chamber, but not into the first chamber, to etch the semiconductor wafer or sample.

9. 发明公开

EP1741130A1 VORRICHTUNG UND VERFAHREN FÜR DIE BEARBEITUNG EINES SUBSTRATS IN DER HALBLEITERTECHNIK SOWIE SYSTEM, DAS EINE VORRICHTUNG FÜR DIE BEARBEITUNG EINES SUBSTRATS UMFASST 有权转让
标题翻译：设备和方法处理的半导体技术基材和系统具有装置用于加工基板包括
公开(公告)号：EP1741130A1
公开(公告)日：2007-01-10
申请号：EP05735966.3
申请日：2005-04-19
申请人： SSE Sister Semiconductor Equipment GmbH
发明人： HOFFMANN, Dirk
IPC分类号： H01L21/68 , H01L21/00 , G03F7/16
CPC分类号： H01L21/67155 , H01L21/6719 , H01L21/67751
摘要： The invention relates to a device for treating a substrate (2) comprising a process station (1, 4), wherein a substrate is processed, in addition to an individual substrate handling robot for transporting an individual substrate from the inlet station to the process station and to the outlet station. According to the invention, a buffer station comprising a handling robot, which is used to transport a substrate (2) to the buffer station, is provided. The individual substrate handling robot is configured in such a manner that a substrate can be transported from an inlet station to the process station and from the buffer station to an outlet station. The invention also relates to a method for treating a substrate, in particular with the above-mentioned device, in addition to a system containing the above-mentioned device.

10. 发明公开

EP1647614A2 Plating system for semiconductor materials 失效
标题翻译：半导体材料的电镀系统
公开(公告)号：EP1647614A2
公开(公告)日：2006-04-19
申请号：EP05077392.8
申请日：1997-07-15
申请人： SEMITOOL, INC.
发明人： Schmidt, Wayne J. , Berner, Robert W. , Woodruff, Daniel J.
IPC分类号： C25D7/12 , H01L21/00
CPC分类号： H01L21/6715 , C25D7/12 , C25D17/001 , C25D17/02 , H01L21/67751 , H01L21/68707
摘要： A semiconductor workpiece processing tool (10) includes a processing module (20) having particular applicability to an electroplating process for semiconductor wafers. The processing module (20) has plural processing bowls assemblies (603) each having an outer bowl (616) and an inner cup (620). Fluid is provided to the cup (620) through an opening (628) in the bottom. Fluid overflows the cup (620) and drains into a fluid reservoir (604). Reservoir (604) is preferably used as both the supply and the return for the process fluid. Filters (630) can be included in each cup to filter process fluid entering the cup. The plurality of the processing bowls can have a common reservoir.
摘要翻译：一种半导体工件加工工具（10）包括处理模块（20），该处理模块特别适用于半导体晶片的电镀工艺。处理模块（20）具有多个处理碗组件（603），每个处理碗组件具有外碗（616）和内杯（620）。流体通过底部的开口（628）提供给杯子（620）。流体溢出杯（620）并排出到流体贮存器（604）中。储存器（604）优选用作过程流体的供应和返回。过滤器（630）可以被包括在每个杯子中以过滤进入杯子的过程流体。多个加工碗可以具有共同的储存器。

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