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    • 1. 发明公开
    • HIGH VOLTAGE HIGH CURRENT REGULATOR CIRCUIT
    • HOCHSPANNUNGS- / HOCHSTROM-REGELSCHALTUNG
    • EP2625581A1
    • 2013-08-14
    • EP11831549.8
    • 2011-10-05
    • Advanced Fusion Systems LLC
    • BIRNBACH, Curtis, A.
    • G05F1/26
    • H01G4/35G05F1/10H01J5/02H01J7/16H01J19/24H01J19/42H01J19/54H01J19/70H01J19/82H01J21/10H02H3/08H02H9/02H02H9/08
    • High voltage high current regulator circuit for regulating current is interposed between first and second terminals connected to an external circuit and comprises at least one main-current carrying cold-cathode field emission electron tube conducting current between the first and second terminals. First and second grid-control cold-cathode field emission electron tubes provide control signals for first and second grids of the at least one main-current carrying cold-cathode field emission electron tube for positive and negative excursions of voltage on the first and second terminals, respectively. The current regulator circuit may be accompanied by a voltage-clamping circuit that includes at least one cold-cathode field emission electron tube. At least two cold- cathode field emission electron tubes, configured to operate at high voltage and high current, are preferably contained within a single vacuum enclosure and are interconnected to provide a circuit function, so as to form a high voltage high current vacuum integrated circuit.
    • 用于调节电流的高电压大电流调节器电路插入连接到外部电路的第一和第二端子之间,并且包括在第一和第二端子之间传导电流的至少一个主电流负载冷阴极场致发射电子管。 第一和第二格栅控制冷阴极场致发射电子管提供用于至少一个主电流负载冷阴极场发射电子管的第一和第二栅极的控制信号,用于在第一和第二端子上的正和负偏移电压 , 分别。 电流调节器电路可以伴随着包括至少一个冷阴极场发射电子管的电压钳位电路。 配置为在高电压和高电流下操作的至少两个冷阴极场发射电子管优选地包含在单个真空外壳内并且互连以提供电路功能,以便形成高压大电流真空集成电路 。
    • 3. 发明公开
    • Kapselung einer Vakuumschaltröhre
    • Kapselung einerVakuumschaltröhre。
    • EP0196503A1
    • 1986-10-08
    • EP86103177.1
    • 1986-03-10
    • SIEMENS AKTIENGESELLSCHAFT
    • Zdora, Heinz
    • H01H33/66
    • H01H33/66207H01H2033/6623H01J5/03H01J19/54
    • Offenbart wird eine Kapselung einer Vakuumschaltröhre. Die Kapselung besteht aus einem die Schaltröhre (1) umschließenden druckfesten Mantel (2) aus armiertem härtbaren Kunststoff, ferner aus einer Hohlräume zwischem dem Mantel (2) und der Vakuumschaftröhre (1) ausfüllenden Einlage (3) aus Kunststoff sowie aus zwei jeweils eine Stirnseite des Mantels (2) abschließenden Flanschen (4). Die Einlage (3) besteht aus vorgeformten Elementen, die in ihrer Bestimmungslage die von ihnen nicht bedeckten Abschnitte der Schaltröhre (1) zu einem rotationssymmetrischen Kemkörper ergänzen, der etwa die Geometrie eines sogenannten Bomben-oder Einschmelzrohres aufweist. Der Mantel (2) ist ein erst auf dem aus der Vakuumschaltröhre (1) und der Einlage (3) bestehenden Kemkörper gebildeter Wickelkörper, dessen Kontur in der Art eine Hüllkurve der Kontur des Kemkörpers folgt Unter Wickelkörper wird hier ein Körper verstanden der dadurch gebildet ist, daß mit härtbarem Kunststoff getränkte Fäden oder Bänder auf einen Kern aufgewickelt werden und der Kunststoff sodann ausgehärtet wird. Durch seine Form und seine Ausbildung weist der Mantel (2) eine besonders hohe Druckfestigkeit auf.
    • 1.一种具有封闭灭弧室(1)的具有可加强的可硬化塑料材料的防火夹套(2)的真空灭弧室的套管,其中所述护套(2)和所述真空灭弧室(1)之间的空间用塑料材料填充, 并且具有密封所述护套(2)的两端的凸缘(4),其特征在于,所述护套(2)和所述真空断路器(1)之间的空间填充有预成型件的插入件(3) 断路器(1)的未被它们覆盖的圆形,旋转对称的芯体,其具有所谓的炸弹或Carius管或熔接管的几何形状,并且护套(2)是形成在 通过缠绕到芯体并与其相邻的位置。
    • 5. 发明公开
    • FIELD EMISSION APPARATUS AND HAND-HELD NONDESTRUCTIVE INSPECTION APPARATUS
    • FELDEMISSIONSVORRICHTUNG SOWIE TRAGBARE VORRICHTUNGFÜRZERSTÖRUNGSFREIEPRÜFUNGEN
    • EP2642505A1
    • 2013-09-25
    • EP11839819.7
    • 2011-06-08
    • Micro-X Japan Ltd.
    • ISHIGURO, YoshihisaHABA, Masanori
    • H01J5/02G21K5/00G21K5/02H01J1/46H01J7/24H01J35/16H05G1/04
    • H01J19/54H01J19/42H01J35/065H01J2201/30469H01J2235/062H01J2237/16
    • In the present invention, heat dissipation is improved by extending the creepage distance in a vacuum vessel according to the size of a flange portion, without lengthening the vacuum vessel in the direction in which an electron beam is emitted.
      A vacuum vessel (20) in which a flange portion (20a) having a hollow portion between a cold cathode (9) and an anode (11) is formed is used.
      One example is a vacuum vessel (20) in which a cold cathode vessel (21) and an anode vessel (22), both cylindrically shaped, are communicated with each other and a hollow flange portion (20a) is formed between the vessels (21, 22).
      A focusing electrode (14) and a getter material (15), for example, are disposed in the hollow portion of the flange portion (20a).
      A cold cathode (9) which has a guard electrode on the outer side of the periphery of a carbon film structure (10) formed on a substrate (7) may be used. The carbon film structure (10) may be formed in the middle of an electrode surface of the substrate (7).
    • 在本发明中,通过根据凸缘部分的尺寸扩大真空容器中的爬电距离,而不会使电子束发射方向上的真空容器延长,从而提高散热。 使用其中形成有在冷阴极(9)和阳极(11)之间具有中空部分的凸缘部分(20a)的真空容器(20)。 一个例子是真空容器(20),其中两个圆柱形的冷阴极容器(21)和阳极容器(22)彼此连通,并且在容器(21)之间形成中空的凸缘部分(20a) ,22)。 例如,聚光电极(14)和吸气材料(15)设置在凸缘部分(20a)的中空部分中。 可以使用在基板(7)上形成的碳膜结构(10)的外周的外侧具有保护电极的冷阴极(9)。 碳膜结构(10)可以形成在基板(7)的电极表面的中间。
    • 6. 发明公开
    • A high-vacuum substrate enclosure
    • HochvakuumdichtesSubstratgehäuse。
    • EP0529392A1
    • 1993-03-03
    • EP92113618.0
    • 1992-08-10
    • MOTOROLA, INC.
    • Wiemann, David A.Kane, Robert C.Jaskie, James E.Summers, John
    • H01J9/26H01J19/54
    • H01J9/261H01J19/54H01J29/862H01L2224/48091H01L2924/00014
    • An enclosure providing an evacuated region about an array of microelectronic vacuum devices including a substrate (501), a first encapsulation member (505) defining a cavity (507), a second encapsulation member (503, 504) defining a cavity (508) and mating with the first encapsulation member (505) so as to define an encapsulated region, a ledge formed in the first encapsulation member (505) for supporting the substrate (501) and defining a communicating passage (520) between the cavities (507 and 508) and a sealing agent (210) disposed between the mating surfaces of the encapsulation members to effect a vacuum seal such that when the encapsulated region is evacuated it will be at the same vacuum levels throughout to eliminate differential pressure induced deformation of the substrate (501). The evacuated substrate enclosure further provides for assembly without an evacuated environment.
    • 围绕微电子真空装置阵列提供抽真空区域的外壳,包括基板(501),限定空腔(507)的第一密封构件(505),限定空腔(508)的第二密封构件(503,504)和 与第一密封构件(505)配合以限定封装区域,形成在第一密封构件(505)中的用于支撑衬底(501)并且在空腔(507和508)之间限定连通通道(520)的凸缘 )和密封剂(210),其设置在所述密封构件的配合表面之间以实现真空密封,使得当所述封装区域被抽空时,其将处于相同的真空水平以消除所述衬底(501)的压差引起的变形 )。 抽空的衬底外壳进一步提供组装而没有抽真空的环境。