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    • 7. 发明公开
    • A method of manufacturing a flat panel display apparatus
    • Verfahren zur Herstellung einer flachen Anzeigevorrichtung
    • EP0714114A1
    • 1996-05-29
    • EP96101002.2
    • 1991-12-19
    • SONY CORPORATION
    • Konishi, Morikazu, c/o Sony Corporation
    • H01J9/02
    • H01J29/862B82Y10/00H01J9/022H01J9/025H01J31/127
    • The flat panel display using a field emission type cathode array (204), comprises a flat fluorescent screen (205, 206) arranged between the cathode array (204) formed on a flat substrate (201) and a screen comprising a glass plate (207) having a convex curved shape in parallel with the substrate (201). The space between the fluorescent screen (205, 206) and the cathode array (204) and the space between the fluorescent screen (205, 206) and the substrate (201) are set to be vacuum.
      The method of manufacturing said flat panel after forming the plurality of cathodes (204) on a conductive substrate (201), provides for a field evaporation caused from tips of the plurality of cathodes (204) by applying a predetermined voltage to said plurality of cathodes.
    • 使用场发射型阴极阵列(204)的平板显示器包括布置在形成在平坦基板(201)上的阴极阵列(204)和包括玻璃板(207)的屏幕之间的平面荧光屏(205,206) )具有与所述基板(201)平行的凸形弯曲形状。 荧光屏(205,206)和阴极阵列(204)之间的空间以及荧光屏(205,206)和基板(201)之间的空间被设定为真空。 在导电基板(201)上形成多个阴极(204)之后制造所述平板的方法通过向所述多个阴极施加预定电压来提供由多个阴极(204)的尖端引起的场蒸发 。
    • 9. 发明公开
    • Manufacturing method of image display apparatus, and bonding method of base materials
    • Herstellungsverfahrenfüreine Bildanzeigevorrichtung und Bindungsverfahren von Basismaterialien
    • EP2296162A2
    • 2011-03-16
    • EP10175756.5
    • 2010-09-08
    • Canon Kabushiki Kaisha
    • Hasegawa, MitsutoshiMatsumoto, MamoSaito, Tomohiro
    • H01J9/26
    • H01J9/261H01J29/862H01J31/127H01J2329/8675
    • A method comprises: arranging a bonding material between a pair of base materials; and bonding, as mutually pressing the pair of the base materials, the pair of the base materials by the bonding material, by irradiating an electromagnetic wave while moving an irradiation position along the bonding material to melt and then harden the bonding material, wherein the arranging includes arranging the bonding material on one of faces of the pair of the base materials so as to have a convex portion which continuously extends in a direction along which the bonding material extends and in which its central region in a width direction protrudes toward the other of the faces of the pair of the base materials. Thus, a stress according to heating and cooling of the base material is reduced and crack does not occur easily in a bonding portion.
    • 一种方法包括:在一对基材之间布置接合材料; 以及通过所述接合材料相互压接所述一对基材,通过在沿着所述接合材料移动照射位置的同时照射电磁波而熔化所述接合材料并使所述接合材料硬化,其中所述布置 包括将所述接合材料布置在所述一对基材的一个表面上,以具有在所述接合材料延伸的方向上连续延伸的凸部,并且其中,在宽度方向上的中心区域朝向另一个的另一方突出 一对基材的面。 因此,根据基材的加热和冷却的应力减小,并且在接合部分中不容易发生裂纹。