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    • 2. 发明公开
    • Dry etching method for magnetic material
    • 干法蚀刻磁性材料的方法
    • EP2184381A1
    • 2010-05-12
    • EP10001014.9
    • 2004-07-26
    • Canon Anelva Corporation
    • Kodaira, YoshimitsuHiromi, Taichi
    • C23F4/00H01F41/30H01F1/14H01F1/34H01L21/3213G11B5/31
    • B82Y25/00B82Y40/00C23F4/00G11C11/161H01F10/3254H01F41/308H01J2237/3343H01L43/12Y10T29/49052
    • A method for manufacturing a tunneling magnetoresistance (TMR) device comprises providing with an element comprising a first ferromagnetic layer, a second ferromagnetic layer, an insulating layer positioned between the first ferromagnetic layer and the second ferromagnetic layer and an antiferromagnetic layer, and then forming a non-organic layer positioned at the top surface of the element, and then forming a photo-resist mask on the non-organic layer, thereby providing with a pre-TMR device; providing with a container 2 having a plasma generating means 1, an exhausting means 21, a first gas feeding means 3 and second gas feeding means; exhausting an inner space of the container by using the exhausting means 21; introducing the pre-TMR device into the exhausted inner space of the container 2; a first etching for etching the non-organic layer by using a process comprising: feeding a first etching gas into said exhausted inner space by using the first gas feeding means 3 and generating a plasma by using the plasma generating means 1, thereby forming a pattern of the non-organic layer according to the photo-resist mask pattern; and a second etching for etching the element by using a process comprising: feeding a second etching gas selected from the group consisting of an alcohol gas, a ketone gas and a non-substituted hydrocarbon gas into said exhausted inner space by using the second gas feeding means and generating a plasma by using the plasma generating means 1, thereby forming a pattern of the element according to the patterned non-organic layer.
    • 一种用于制造隧穿磁阻(TMR)器件的方法包括提供包括第一铁磁层,第二铁磁层,位于第一铁磁层和第二铁磁层之间的绝缘层和反铁磁层的元件,然后形成 非有机层,然后在非有机层上形成光致抗蚀剂掩模,由此提供预先TMR器件; 该容器2具有等离子体发生装置1,排气装置21,第一气体供给装置3和第二气体供给装置; 通过使用排气装置21排出容器的内部空间; 将预TMR装置引入容器2的排空内部空间; 通过使用包括以下工艺的用于蚀刻非有机层的第一蚀刻:通过使用第一气体馈送装置3将第一蚀刻气体馈送到所述排出的内部空间中,并且通过使用等离子体发生装置1产生等离子体,由此形成图案 根据所述光致抗蚀剂掩模图案形成所述非有机层; 以及通过使用包括以下工艺的用于蚀刻所述元件的第二蚀刻:通过使用所述第二气体馈送将从由醇气体,酮气体和未被取代的烃气体组成的组中选择的第二蚀刻气体馈送到所述排空的内部空间中 意味着通过使用等离子体发生装置1产生等离子体,由此根据图案化的非有机层形成元件的图案。