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    • 8. 发明公开
    • Method of forming MRAM devices
    • 元素von einer MRAM矩阵
    • EP1793400A2
    • 2007-06-06
    • EP07005378.0
    • 2003-04-21
    • MICRON TECHNOLOGY, INC.
    • Hineman, MaxSignorini, KarenHoward, Brad J.
    • H01F41/30
    • H01L27/222B82Y25/00B82Y40/00G11C11/15G11C11/16H01F10/3254H01F41/302H01F41/308H01F41/34
    • A method of forming a magnetic random access memory (MRAM) using a sacrificial cap layer (20) on top of the memory cells (10) and the structure resulting therefrom are described. A plurality of individual magnetic memory devices (10) with cap layers (20) are fabricated on a substrate. A continuous first insulator layer (20, 22) is deposited over the substrate and the magnetic memory devices. Portions of the first insulator layer are removed at least over the magnetic memory devices (10) and then the cap layers (20) are selectively removed from the magnetic memory devices (10), thus exposing active top surfaces of the magnetic memory devices (10). The top surfaces of the magnetic memory devices (10) are recessed below the top surface of the first insulator layer (22). Top conductors are formed in contact with the active top surfaces of the magnetic memory devices (10). In an illustrated embodiment, spacers (36) are also formed along the sides of the magnetic memory devices (10) before the first insulator layer (20, 22) is deposited.
    • 描述了使用在存储单元(10)的顶部上的牺牲帽层(20)形成磁性随机存取存储器(MRAM)的方法以及由此产生的结构。 在衬底上制造具有盖层(20)的多个单个磁存储器件(10)。 连续的第一绝缘体层(20,22)沉积在衬底和磁存储器件上。 至少在磁存储器件(10)上除去第一绝缘体层的部分,然后从磁存储器件(10)中选择性地移除盖层(20),从而暴露磁存储器件(10)的有效顶表面 )。 磁存储器件(10)的顶表面在第一绝缘体层(22)的顶表面下方凹入。 顶部导体形成为与磁存储器件(10)的有效顶表面接触。 在图示的实施例中,在沉积第一绝缘体层(20,22)之前,还沿着磁存储器件(10)的侧面形成间隔物(36)。