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    • 7. 发明公开
    • A novel SyAF structure to fabricate Mbit MTJ MRAM
    • Neuartige SyAF-Struktur zur Herstellung von Mbit-MTJ-MRAM
    • EP1968130A2
    • 2008-09-10
    • EP08368008.2
    • 2008-03-07
    • MagIC Technologies Inc.
    • Horng, Cheng T.Ru-Ying, TongTorng, Chyu-JiuhLiu, Guangli
    • H01L43/10H01L43/12H01F10/32
    • H01L43/10B82Y25/00B82Y40/00G11C11/16H01F10/3254H01F10/3272H01F41/307H01L43/12
    • A MTJ that minimizes error count (EC) while achieving high MR value, low magnetostriction, and a RA of about 1100 Ω-µm 2 for 1 Mbit MRAM devices is disclosed. The MTJ has a composite AP1 pinned layer made of a lower amorphous Co 60 Fe 20 B 20 layer and an upper crystalline Co 75 Fe 25 layer to promote a smoother and more uniform AlOx tunnel barrier. A "stronger oxidation" state is realized in the AlOx layer by depositing a thicker than normal Al layer or extending the ROX cycle time for Al oxidation and thereby reduces tunneling hot spots. The NiFe free layer has a low Fe content of about 8 to 21 atomic % and the Hf content in the NiFeHf capping layer is from 10 to 25 atomic %. A Ta hard mask is formed on the capping layer. EC (best) is reduced from >100 ppm to
    • 公开了一种MTJ,其对于1Mbit MRAM设备实现了最大限度地减少误差计数(EC),同时实现了高MR值,低磁致伸缩以及约1100Ω-2的RA。 MTJ具有由较低的无定形Co 60 Fe 20 B 20层和上部结晶Co 75 Fe 25层制成的复合AP1钉扎层,以促进更平滑和更均匀的AlOx隧道屏障。 在AlOx层中通过沉积比普通的Al层更厚或延长了RO氧化循环时间,从而减少了隧道的热点,实现了“更强的氧化”状态。 NiFe自由层的Fe含量低,为约8〜21原子%,NiFeHf覆盖层的Hf含量为10〜25原子%。 在封盖层上形成Ta硬掩模。 通过使用优选的MTJ构型,EC(最佳)从> 100ppm降低到<10ppm。
    • 10. 发明公开
    • A high performance MTJ element for STT-RAM and method for making the same
    • Hochleistungs-MTJ-ElementfürSTT-RAM und Herstellungsverfahrendafür
    • EP2073285A2
    • 2009-06-24
    • EP08392010.8
    • 2008-07-09
    • MagIC Technologies Inc.
    • Horng, Cheng T.Tong, Ru-YingTorng, Chyu-JiuhKula, Witold
    • H01L43/08H01L43/12
    • H01L43/08B82Y25/00B82Y40/00G11C11/161H01F10/3272H01F10/329H01F10/3295H01F41/307H01L43/10H01L43/12
    • We describe the structure and method of forming a STT-MTJ MRAM cell that utilizes transfer of spin angular momentum as a mechanism for changing the magnetic moment direction of a free layer. The device includes an IrMn pinning layer, a SyAP pinned layer, a naturally oxidized, crystalline MgO tunneling barrier layer that is formed on an Ar-ion plasma smoothed surface of the pinned layer and, in one embodiment, a free layer that comprises an amorphous layer of Co 60 Fe 20 B 20 .of approximately 20 angstroms thickness formed between two crystalline layers of Fe of 3 and 6 angstroms thickness respectively. The free layer is characterized by a low Gilbert damping factor and by very strong polarizing action on conduction electrons. The resulting cell has a low critical current, a high dR/R and a plurality of such cells will exhibit a low variation of both resistance and pinned layer magnetization angular dispersion.
    • 我们描述了形成使用自旋角动量转移作为改变自由层的磁矩方向的机制的STT-MTJ MRAM单元的结构和方法。 该装置包括形成在钉扎层的Ar离子等离子体平滑表面上的IrMn钉扎层(2),SyAP钉扎层(345),天然氧化的结晶MgO隧道势垒层(6),并且在一个 实施例中,自由层(7)包括分别在3和6埃厚度的Fe的两个结晶层(71,73)之间形成的约20埃厚度的Co 60 Fe 20 B 20的非晶层(72)。 自由层的特征在于低吉尔伯特阻尼因子和对传导电子的非常强的偏振作用。 所得到的电池具有低临界电流,高dR / R,并且多个这样的电池将呈现电阻和钉扎层磁化角分散的低变化。