专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP4354469A1 THERMALLY PROTECTED METAL OXIDE VARISTOR 审中-公开
公开(公告)号：EP4354469A1
公开(公告)日：2024-04-17
申请号：EP23203715.0
申请日：2023-10-16
申请人： Dongguan Littelfuse Electronics Company Limited
发明人： Tang, Jacky , Song, Dongjian , Hu, Charles
IPC分类号： H01C1/144 , H01C7/102 , H01C7/112 , H01C7/12 , H01C1/14
CPC分类号： H01C7/102 , H01C7/112 , H01C1/144 , H01C1/14 , H01C7/126
摘要： A metal oxide varistor (MOV) includes an MOV body, a first electrode, a second electrode, and a thermal cut-off insulation shell. The MOV body is a crystalline microstructure with zinc oxide mixed with one or more other metal oxides. The first electrode is adjacent one side of the MOV body and is connected to a first radial lead. The second electrode is adjacent a second side of the MOV body and is connected to a second radial lead having a curved portion. The thermal cut-off insulation shell is adjacent the second electrode and has a protrusion, with the curved portion of the second radial lead being adjacent the protrusion.

2. 发明公开

EP3404675A1 LEISTUNGSWIDERSTAND 审中-公开
公开(公告)号：EP3404675A1
公开(公告)日：2018-11-21
申请号：EP17171188.0
申请日：2017-05-15
申请人： EBG Elektronische Bauelemente GmbH
发明人： Lindner, Christian Rene , Praschk, Josef
IPC分类号： H01C1/144 , H05K1/16 , H05K3/40 , H01C7/00
CPC分类号： H01C1/144 , H01C1/012 , H01C1/084 , H01C3/12 , H01C7/003 , H05K1/165 , H05K3/4015 , H05K2201/09263 , H05K2201/10318
摘要： Es wird ein Leistungswiderstand (1) mit mindestens einem elektrischen Anschluss (2.1, 2.2, 2.3), mit einem Trägersubstrat (3), das mindestens ein Widerstandselement (4.1, 4.2) aus einem Dickschichtmaterial und mindestens eine Kontaktelektrode (5.1, 5.2, 5.3) aufweist, an die das Widerstandselement (4.1, 4.2) elektrisch anschließt, mit wenigstens einem elektrischen Leiter (7.1, 7.2, 7.3), der mit der Kontaktelektrode (5.1, 5.2, 5.3) verlötet ist und eine elektrische Verbindung zwischen der Kontaktelektrode (5.1, 5.2, 5.3) und dem elektrischen Anschluss (2.1, 2.2, 2.3) herstellt, und mit einem, zumindest teilweise mit mindestens einer Vergussmasse (17) gefüllten Gehäuse (8), das Widerstandselement (4.1, 4.2) und Kontaktelektrode (5.1, 5.2, 5.3) vergossen aufnimmt, wobei der elektrische Leiter (7.1, 7.2, 7.3) durch die Vergussmasse (17) ragt. Um einen konstruktiv einfachen und leicht handhabbaren Leistungswiderstand (1) zu schaffen, wird vorgeschlagen, dass ein Stift, insbesondere ein Löt- oder Einpressstift, den elektrischen Leiter (7.1, 7.2, 7.3) ausbildet, welcher Stift (9.1, 9.2, 9.3) auf die Kontaktelektrode (5.1, 5.2, 5.3) aufgesetzt und mit dieser verlötet ist sowie den elektrischen Anschluss (2.1, 2.2, 2.3) des Leistungswiderstands (1) ausbildet.

3. 发明公开

EP2874159A3 Base metal combination electrode of electronic ceramic component and manufacturing method thereof 审中-公开
标题翻译：的电子陶瓷部件和制造方法的基体金属电极组合它们
公开(公告)号：EP2874159A3
公开(公告)日：2015-10-07
申请号：EP13184153.8
申请日：2013-09-12
申请人： Longke Electronics (Huiyang) Co., Ltd.
发明人： Tseng, Chinglung
IPC分类号： H01C1/142 , H01C1/144 , H01C17/28 , H01C7/102 , H01G4/252 , H01G4/232 , H05K1/18 , H01C1/14
CPC分类号： H01C1/142 , H01C1/14 , H01C1/144 , H01C7/102 , H01C17/281 , H01C17/283 , H01G4/2325 , H01G4/252
摘要： The present invention provides a base metal combination electrode (113,114) of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode (113,114) comprises a first base metal electrode layer (113) covering on two sides of said electronic ceramic chip (111) and a second base metal electrode layer (114) covering on said first base metal electrode layer (113), the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.

4. 发明公开

EP2874159A2 Base metal combination electrode of electronic ceramic component and manufacturing method thereof 审中-公开
标题翻译：的电子陶瓷部件和制造方法的基体金属电极组合它们
公开(公告)号：EP2874159A2
公开(公告)日：2015-05-20
申请号：EP13184153.8
申请日：2013-09-12
申请人： Longke Electronics (Huiyang) Co., Ltd.
发明人： Tseng, Chinglung
IPC分类号： H01C1/142 , H01C1/144 , H01C17/28 , H01C7/102 , H01G4/252 , H01G4/232 , H05K1/18 , H01C1/14
CPC分类号： H01C1/142 , H01C1/14 , H01C1/144 , H01C7/102 , H01C17/281 , H01C17/283 , H01G4/2325 , H01G4/252
摘要： The present invention provides a base metal combination electrode (113,114) of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode (113,114) comprises a first base metal electrode layer (113) covering on two sides of said electronic ceramic chip (111) and a second base metal electrode layer (114) covering on said first base metal electrode layer (113), the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.
摘要翻译：本发明提供电子陶瓷部件和制造方法的碱金属的组合电极（113,114）其worin所述碱金属的组合电极（113,114）包括第一基体金属电极层（113），其覆盖在所述电子陶瓷芯片的两侧（ 111）和第二基体金属电极层（114）覆盖在所述第一基体金属电极层（113），用于电子陶瓷部件的基体金属复合电极的制造方法包括使用热喷涂设备，以电极材料喷到表面电子陶瓷芯片。利用银膏或铜膏仅比较，它减少了电极材料的成本而不破坏电极的功能。对于本发明的基体金属复合电极的制造方法具有工艺简单，制备高效率和低成本，并且它减少了整体上的电子陶瓷部件的电极的生产成本。

5. 发明公开

EP1947656A4 PTC DEVICE 失效转让
标题翻译： PTC安排
公开(公告)号：EP1947656A4
公开(公告)日：2012-08-22
申请号：EP06823006
申请日：2006-11-06
申请人： TYCO ELECTRONICS RAYCHEM KK
发明人： TANAKA ARATA , KOYAMA HIROYUKI , MIYAGI HARUHISA
IPC分类号： H01C7/02
CPC分类号： H01C1/1406 , H01C1/144 , H01C7/027

6. 发明授权

EP2085983B1 Electronic device with external terminals 有权
标题翻译：带有外部端子的电子装置
公开(公告)号：EP2085983B1
公开(公告)日：2012-04-04
申请号：EP09158351.8
申请日：2003-04-07
申请人： TDK Corporation
发明人： Yoshii, Akitoshi , Kikuchi, Kazuhiko , Kamiya, Takashi , Kikuchi, Hiromi
IPC分类号： H01G4/228
CPC分类号： H01G4/248 , H01C1/144 , H01C17/28 , H01G2/065 , H01G4/2325 , H05K3/3426

7. 发明公开

EP2085983A1 Electronic device with external terminals and method of production of the same 有权
标题翻译： End。ten ten。。。。
公开(公告)号：EP2085983A1
公开(公告)日：2009-08-05
申请号：EP09158351.8
申请日：2003-04-07
申请人： TDK Corporation
发明人： Yoshii, Akitoshi , Kikuchi, Kazuhiko , Kamiya, Takashi , Kikuchi, Hiromi
IPC分类号： H01G4/228
CPC分类号： H01G4/248 , H01C1/144 , H01C17/28 , H01G2/065 , H01G4/2325 , H05K3/3426
摘要： A multilayer ceramic capacitor with external terminals having terminal electrodes and external terminals of the electronic device body electrically bonded through a solder layer, wherein the solder layer is comprised of an Sn-Sb high temperature lead-free solder, the ratio between the Sn and Sb in this solder layer is, by ratio by weight percent, in a range of Sn/Sb = 70/30 to 90/10, and the solder layer and terminal electrodes are formed between them with a diffusion layer formed by diffusion of a conductive ingredient of the terminal electrodes into the solder layer.
摘要翻译：具有端子电极的外部端子和电子器件主体的外部端子通过焊料层电连接的多层陶瓷电容器，其中焊料层由Sn-Sb高温无铅焊料构成，Sn与Sb之间的比例在该焊料层中，以Sn / Sb = 70/30〜90/10的范围内，以重量％计，焊料层和端子电极之间形成有通过导电成分的扩散形成的扩散层的端子电极进入焊料层。

8. 发明公开

EP1357563A4 RESISTOR CONNECTOR AND ITS MANUFACTURING METHOD 审中-公开
标题翻译：电阻连接器及其制造方法
公开(公告)号：EP1357563A4
公开(公告)日：2008-09-24
申请号：EP02710370
申请日：2002-01-29
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： MATSUMOTO YOSHIFUMI , YABUTANI HIROMI
IPC分类号： H01C1/016 , H01C1/144 , H01C1/028 , H01C1/032
CPC分类号： H01C1/144 , H01C1/028 , H05K3/202 , H05K3/284 , H05K3/3442 , Y10S439/907 , Y10T29/49082 , Y10T29/49085 , Y10T29/49087 , Y10T29/49099
摘要： A resistor connector (C) comprises a pair of parallel lead frames (1, 1), a resistor (10) having a pair of electrodes (14, 14), and a mold resin (2). Each of the lead frames (1) has a terminal section (1a) and an electrode connecting section. The pair of electrodes (14, 14) are electrically connected to the electrode connecting sections of the pair of lead frames (1, 1), respectively, via solder (b). The mold resin (2) coats the resistor (10) so as to expose the terminal sections (1a, 1a). The lead frames (1) have solder flow preventing means (40, 41), which prevent the solder (b) from flowing to the terminal section (1a), between the electrode connecting section and the terminal section (1a).

9. 发明授权

EP1243005B1 MONOLITHIC HEAT SINKING RESISTOR 有权
标题翻译：散热MONOLITH阻力
公开(公告)号：EP1243005B1
公开(公告)日：2004-12-29
申请号：EP00982599.3
申请日：2000-09-07
申请人： Vishay Dale Electronics, Inc.
发明人： SZWARC, Joseph , SMEJKAL, Joel, J.
IPC分类号： H01C1/084
CPC分类号： H01C1/144 , H01C1/084
摘要： A monolithic resistor is provided with a central resistive metallic foil strip positioned between and attached to a pair of wings formed from an electrically conductive metallic foil. The wings include large surface areas to dissipate heat. A plurality of terminal pins are formed in the conductive strips for connection to an integrated circuit board, as well as a current source.

10. 发明授权

EP0716427B1 Surface mount resistor and method for making same 有权
标题翻译：相同的表面安装电阻器及其制造方法
公开(公告)号：EP0716427B1
公开(公告)日：1999-02-17
申请号：EP95308780.6
申请日：1995-12-05
申请人： DALE ELECTRONICS, INC.
发明人： Rainer, Walter , Hendricks, Steve , Smejkal, Joel , Bougger, Gary
IPC分类号： H01C17/00
CPC分类号： H01C17/006 , H01C1/14 , H01C1/144 , Y10T29/49101

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式