专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP3252781A1 RESISTOR DEVICE AND METHOD FOR PRODUCING RESISTOR DEVICE 审中-公开
标题翻译：电阻器装置和用于制造电阻器装置的方法
公开(公告)号：EP3252781A1
公开(公告)日：2017-12-06
申请号：EP16743441.4
申请日：2016-01-27
申请人： Mitsubishi Materials Corporation
发明人： NAGASE Toshiyuki , KOMASAKI Masahito
IPC分类号： H01C1/084 , H01C1/142 , H01C17/02 , H01C17/28
CPC分类号： H01C1/144 , H01C1/012 , H01C1/028 , H01C1/084 , H01C1/142 , H01C7/003 , H01C17/006 , H01C17/02 , H01C17/28
摘要： The resistor includes a chip resistive element which includes a resistive element and metal electrodes and which is formed on first surface of a ceramic substrate, metal terminals electrically joined to the metal electrodes, and an Al member formed on the second surface side of the ceramic substrate, wherein the ceramic substrate and the Al member are joined using an Al-Si-based brazing filler metal, the metal electrodes and the metal terminals are joined to each other using a solder, and a degree of bending of an opposite surface of the Al member opposite to a surface on the ceramic substrate side is in a range of -30 µm/50 mm to 700 µm/50 mm.
摘要翻译：该电阻器包括芯片电阻元件，该芯片电阻元件包括电阻元件和金属电极并且形成在陶瓷衬底的第一表面上，金属端子电连接到金属电极，以及Al元件形成在陶瓷衬底的第二表面侧上其中，所述陶瓷基板和所述Al构件使用Al-Si系钎料接合，所述金属电极和所述金属端子通过焊料接合，所述Al的相反面的弯曲程度与陶瓷基板侧的面相对的部件的厚度为-30μm/ 50mm〜700μm/ 50mm。

2. 发明授权

EP2221834B1 Lastwiderstand mit definierter Kurzschluss-Sicherung 有权
标题翻译：具有定义的短路保护负载电阻
公开(公告)号：EP2221834B1
公开(公告)日：2011-09-21
申请号：EP10001882.9
申请日：2010-02-24
申请人： Türk + Hillinger GmbH
发明人： Schlipf, Andreas
IPC分类号： H01C1/012 , H01C1/028 , H01C3/14
CPC分类号： H01C1/028 , H01C1/012 , H01C3/14

3. 发明公开

EP0847585A1 LOW PROFILE RESISTOR 失效
标题翻译：尤其是抗FLAT
公开(公告)号：EP0847585A1
公开(公告)日：1998-06-17
申请号：EP96916522.0
申请日：1996-05-21
申请人： EMC Technology, Inc.
发明人： MAZZOCHETTE, Joseph, B.
IPC分类号： H01C7 , H01C1
CPC分类号： H01C1/012
摘要： A low profile load resistor (10) includes a base plate (12) of an electrically conductive material having a pair of opposed flat surfaces (14, 16) and a central hole (18) therethrough. A chip resistor (22) is mounted on one of the surfaces of the base plate (12). The chip resistor (22) includes a substrate (24) of an electrical insulating material having a pair of opposed flat surfaces (26, 28) and a central hole (30) therethrough which is aligned with the central hole (18) in the base plate (12). A resistance film (38) is on one of the surfaces (26) of the substrate (24) and has termination films (32, 34) at opposite ends thereof. A termination tab (42) is electrically connected to one (32) of the termination films (32, 34) and extends through the holes (18, 30) in the substrate (24) and the base plate (12). The other termination film (34) is electrically connected to the base plate (12). A cover plate (48) of an electrical insulating material is over the resistor film (38) and is mechanically connected to the substrate (24).

4. 发明公开

EP2365493A1 Method of manufacturing a flexible PTC heating element 有权
标题翻译： Verfahren zur Herstellung eine flexiblen PTC-Heizelements
公开(公告)号：EP2365493A1
公开(公告)日：2011-09-14
申请号：EP11003984.9
申请日：2003-06-16
申请人： Panasonic Corporation
发明人： Ishii, Takahito , Yasui, Keiko , Terakado, Seishi , Kohara, Kazuyuki , Yoneyama, Mitsuru
IPC分类号： H01C7/02 , H05B3/14 , H05B3/34 , H05B3/20
CPC分类号： H05B3/342 , H01C1/01 , H01C1/012 , H01C1/1406 , H01C7/02 , H01C7/027 , H01C17/065 , H01C17/06586 , H05B2203/006 , H05B2203/013 , H05B2203/017 , H05B2203/02 , H05B2203/029
摘要： The flexible PTC heating element according to the invention has one of the following constitutions. A portion of an electrode (2) and a PTC resistor (3) is impregnated into a flexible substrate (1). A flexible substrate is made of resin foam or rubber material having a concave/convex shape formed on the surface. The flexible PTC heating element has an elongation deformation portion disposed to at least one of an electrode and a PTC resistor. A flexible substrate has adhesiveness and either a flexible substrate or a flexible cover material has an elongation control portion. Therefore, the flexible PTC heating element is highly flexible and excellent in vibration durability.
摘要翻译：根据本发明的柔性PTC加热元件具有以下构造之一。将一部分电极（2）和PTC电阻（3）浸渍到柔性基板（1）中。柔性基板由在表面上形成有凹凸形状的树脂发泡体或橡胶材料制成。柔性PTC加热元件具有设置在电极和PTC电阻器中的至少一个上的伸长变形部分。柔性基材具有粘合性，柔性基材或柔性覆盖材料具有伸长率控制部分。因此，柔性PTC加热元件具有高度柔性并且具有优异的振动耐久性。

5. 发明公开

EP1544869A4 FLEXIBLE PTC HEATING ELEMENT AND METHOD OF MANUFACTURING THE HEATING ELEMENT 审中-公开
标题翻译：灵活PTC发热元件和制造方法加热器
公开(公告)号：EP1544869A4
公开(公告)日：2009-02-18
申请号：EP03733429
申请日：2003-06-16
申请人： PANASONIC CORP
发明人： ISHII TAKAHITO , YASUI KEIKO , TERAKADO SEISHI , KOHARA KAZUYUKI , YONEYAMA MITSURU
IPC分类号： H01C1/01 , H01C1/012 , H01C1/14 , H01C7/02 , H01C17/065 , H05B3/34 , H05B3/36 , H05B3/14 , H05B3/20
CPC分类号： H05B3/342 , H01C1/01 , H01C1/012 , H01C1/1406 , H01C7/02 , H01C7/027 , H01C17/065 , H01C17/06586 , H05B2203/006 , H05B2203/013 , H05B2203/017 , H05B2203/02 , H05B2203/029
摘要： A flexible PTC heating element, wherein parts of an electrode and a PTC resistance body are sunk in a flexible base material and the flexible base material is formed of a resin foam body or a rubber material having an irregular shape on the surface thereof, or an extendably deforming part is provided at least on either of the electrode and the PTC resistance body and the flexible base material has an adhesiveness and the flexible base material or a flexible coating material has an extension resisting part, whereby a high flexibility and an excellent durability against excitation can be provided to the flexible PCT heating element.

6. 发明授权

EP0833349B1 Clip for PTC devices 失效
标题翻译：为PTC装置保持钳
公开(公告)号：EP0833349B1
公开(公告)日：2005-03-09
申请号：EP97630056.6
申请日：1997-09-12
申请人： EMERSON ELECTRIC CO.
发明人： West, Jeffrey A.
IPC分类号： H01C1/012 , H01C1/022
CPC分类号： H01C1/012 , H01C1/022

7. 发明授权

EP0874374B1 Résistance électrique formant une ceinture résistive souple et appareil comportant cette résistance. 失效
标题翻译：电阻更弹性的柔性带，并与该电阻器装置提供的
公开(公告)号：EP0874374B1
公开(公告)日：2002-10-16
申请号：EP98400955.5
申请日：1998-04-17
申请人： Vishay SA
发明人： Serpolet, Stéphane , Fillion, Pascale
IPC分类号： H01C1/012 , H01C1/034 , H01C3/06 , H01C3/12 , H02K23/66
CPC分类号： H01C3/12 , H01C1/012 , H01C1/034 , H01C3/06 , H02K11/33

8. 发明公开

EP3230486A1 THERMALLY SPRAYED THIN FILM RESISTOR AND METHOD OF MAKING 审中-公开
标题翻译：热喷涂薄膜电阻器及其制造方法
公开(公告)号：EP3230486A1
公开(公告)日：2017-10-18
申请号：EP15868328.4
申请日：2015-12-04
申请人： Vishay Dale Electronics, LLC
发明人： MARTIN, Tom J. , SMITH, Clark , TRAIKOFF, Jeff
IPC分类号： C23C4/12 , H01C1/148 , H01C17/10
CPC分类号： H01C17/075 , H01C1/012 , H01C1/142 , H01C7/006 , H01C17/283
摘要： A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.
摘要翻译：提供了在制造过程中使用热喷涂技术形成的薄膜电阻器。公开了包括热喷涂电阻元件的薄膜电阻器和制造薄膜电阻器的方法。合金结合层可以施加到基板上，并且通过热喷涂工艺将热喷涂电阻层施加到合金结合层以形成热喷涂电阻元件。合金结合层和热喷涂电阻层可以具有相同的化学组成。

9. 发明授权

EP2680278B1 MOUNTING STRUCTURE FOR ELECTRONIC COMPONENTS 有权
标题翻译：安装结构，电子元件
公开(公告)号：EP2680278B1
公开(公告)日：2016-11-09
申请号：EP12749937.4
申请日：2012-02-08
申请人： Murata Manufacturing Co., Ltd.
发明人： MIURA, Tadamasa
IPC分类号： H01C7/04
CPC分类号： H01L35/02 , H01C1/012 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C7/042 , H01C17/06533 , H01L35/34

10. 发明公开

EP2801098A4 HIGH VOLTAGE RESISTOR AND METHODS OF FABRICATION 审中-公开
标题翻译：耐高电压及其制造方法
公开(公告)号：EP2801098A4
公开(公告)日：2015-06-24
申请号：EP11879155
申请日：2012-01-04
申请人： SERVICES PÉTROLIERS SCHLUMBERGER , SCHLUMBERGER HOLDINGS , SCHLUMBERGER TECHNOLOGY BV , PRAD RES & DEV LTD
发明人： FREREJEAN GUILLAUME
IPC分类号： H01C7/02 , H01C1/012 , H01C7/22 , H01C17/04 , H01C17/06 , H01C17/24 , H01C17/242 , H01C17/30
CPC分类号： H01C7/22 , H01C1/012 , H01C3/12 , H01C17/06 , H01C17/2416 , H01C17/242 , H01C17/30

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式