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1. 发明公开

EP4434060A1 HERSTELLUNGSVERFAHREN FÜR EINEN ELEKTRISCHEN WIDERSTAND 审中-实审
公开(公告)号：EP4434060A1
公开(公告)日：2024-09-25
申请号：EP23725701.9
申请日：2023-05-09
申请人： Isabellenhütte Heusler GmbH & Co. KG
发明人： DEGEN, Stefan
IPC分类号： H01C1/142 , H01C1/148 , H01C17/00 , H01C17/28 , H01C7/00 , H01C17/07 , H01C1/14
CPC分类号： H01C1/142 , H01C1/14 , H01C1/148 , H01C17/281 , H01C17/006 , H01C7/003 , H01C17/07 , H01C17/28 , G01R1/203 , G01R3/00

2. 发明授权

EP3087571B1 METHOD FOR FABRICATING A VARISTOR DEVICE AND VARISTOR DEVICE 有权转让
公开(公告)号：EP3087571B1
公开(公告)日：2023-12-27
申请号：EP14796530.5
申请日：2014-11-13
发明人： SUN, Dennis , JING, Jamie , LI, Qirong
IPC分类号： H01C7/102 , H01C1/142

3. 发明授权

EP2791949B1 ELEKTRISCHES BAUELEMENT UND VERFAHREN ZUR HERSTELLUNG EINES ELEKTRISCHEN BAUELEMENTS 有权转让
公开(公告)号：EP2791949B1
公开(公告)日：2022-11-30
申请号：EP12778650.7
申请日：2012-10-02
发明人： FEICHTINGER, Thomas , LAUENSTEIN, Jörg
IPC分类号： H01C1/142 , H01C7/18 , H01G4/232 , H01G4/30

4. 发明公开

EP4066980A1 LASER-TRIMMED RESISTOR AND MANUFACTURING METHOD THEREOF 审中-公开
公开(公告)号：EP4066980A1
公开(公告)日：2022-10-05
申请号：EP22154123.8
申请日：2022-01-29
申请人： Viking Tech Corporation
发明人： LU, CHI-YU , CHIU, CHENG-CHUNG
IPC分类号： B23K26/351 , H01C1/034 , H01C1/142 , H01C7/00 , H01C17/242
摘要： The present invention proposes a resistor with a transparent protective layer, which is formed by a chemical vapor deposition (CVD) process. The laser is able to penetrate the transparent protective layer to reach and trim the resistance layer.

5. 发明授权

EP2237287B1 CHIP-TYPE SEMICONDUCTOR CERAMIC ELECTRONIC COMPONENT 有权转让
公开(公告)号：EP2237287B1
公开(公告)日：2019-01-23
申请号：EP09706226.9
申请日：2009-01-23
申请人： Murata Manufacturing Co., Ltd.
发明人： KATSUKI, Takayo , ABE, Yoshiaki
IPC分类号： H01C1/142 , H01C7/02 , H01C7/04 , H01C7/10

6. 发明公开

EP3369100A1 SURFACE MOUNT RESISTORS AND METHODS OF MANUFACTURING SAME 审中-公开
公开(公告)号：EP3369100A1
公开(公告)日：2018-09-05
申请号：EP16860663.0
申请日：2016-10-26
申请人： Vishay Dale Electronics, LLC
发明人： SMITH, Clark , WYATT, Todd
IPC分类号： H01C1/14 , H01C1/142 , H01C17/28
CPC分类号： H01C1/032 , H01C1/144 , H01C1/148 , H01C7/06 , H01C7/18 , H01C17/00 , H01C17/065 , H01C17/281
摘要： Resistors and a method of manufacturing resistors are described herein. A resistor includes a resistive element and a plurality of conductive elements. The plurality of conductive elements are electrically insulated from one another via a dielectric material and thermally coupled to the resistive element via an adhesive material disposed between each of the plurality of conductive elements and a surface of the resistive element. The plurality of conductive elements is coupled to the resistive element via conductive layers and solderable layers.

7. 发明授权

EP2472529B1 THERMISTOR AND METHOD FOR PRODUCING SAME 有权
标题翻译：热敏元件及其制造方法
公开(公告)号：EP2472529B1
公开(公告)日：2017-09-27
申请号：EP10811774.8
申请日：2010-08-20
申请人： Murata Manufacturing Co., Ltd.
发明人： MIURA Tadamasa
IPC分类号： H01C17/00 , G01K7/22 , H01C1/14 , H01C1/142 , H01C7/00 , H01C7/04 , H01C17/065 , H01C17/28
CPC分类号： H01C17/00 , G01K7/22 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C17/065 , H01C17/281 , Y10T29/49085

8. 发明授权

EP3023999B1 ELECTRODE COMPONENT AND METHOD FOR FABRICATING THE SAME 有权转让
标题翻译：电极组件及其制造方法
公开(公告)号：EP3023999B1
公开(公告)日：2017-05-31
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252

9. 发明公开

EP3023999A1 Electrode component and method for fabricating the same 有权转让
标题翻译：电极成分和方法及其生产
公开(公告)号：EP3023999A1
公开(公告)日：2016-05-25
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronics Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate (1), two electrode layers (3) formed on two opposite surfaces of the ceramic substrate (1), two pins (2) respectively connected to the two electrode layers (3), and an insulating layer (4) enclosing the ceramic substrate (1), the electrode layers (3) and each pin (2). Each electrode layer (3) is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer (3). Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer (3) is shortened without compromising bonding strength between the electrode layers (3) and the ceramic substrate (1) and solderability between the electrode layers (3) and the pins (2).

10. 发明公开

EP2980806A1 ELECTRODE COMPONENT WITH PRETREATED LAYERS 审中-公开
标题翻译： ELEKTRODENBAUTEIL MIT VORBEHANDELTEN SCHICHTEN
公开(公告)号：EP2980806A1
公开(公告)日：2016-02-03
申请号：EP15164363.2
申请日：2015-04-21
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： Xu, Xun , Huang, Jen-Heng , Jia, Zhiwei
IPC分类号： H01C1/142 , H01C7/10 , H01C7/102 , H01C17/10 , H01C17/12 , H01C17/28
CPC分类号： H01C1/14 , H01C1/142 , H01C1/144 , H01C7/10 , H01C7/102 , H01C17/281 , H01C17/285 , H01C17/288
摘要： An electrode component with pretreated layers includes a ceramic substrate (1), two pretreated layers (22) formed on two opposite surfaces of the ceramic substrate (1), two electrode layers (22) respectively formed on the two pretreated layers (22), two pins (3) respectively connected to the electrode layers (22), and an insulating layer (4) enclosing portions of the two pins (3) and all foregoing elements. The pretreated layer (22) formed between the ceramic substrate (1) and the electrode layer (22) replaces the fabrication means for conventional silver electrode layer to provide good binding strength between the ceramic substrate (1) and the electrode layer (22). Besides same electrical characteristics for original products, the electrode component gets rid of the use of precious silver in screen printed silver electrode, and also lowers the ohmic contact resistance between the electrode layer (22) and the ceramic substrate (1).
摘要翻译：具有预处理层的电极组件包括陶瓷衬底（1），形成在陶瓷衬底（1）的两个相对表面上的两个预处理层（22），分别形成在两个预处理层（22）上的两个电极层（22）分别连接到电极层（22）的两个引脚（3）和封闭两个引脚（3）的部分和所有前述元件的绝缘层（4）。形成在陶瓷基板（1）和电极层（22）之间的预处理层（22）代替常规银电极层的制造装置，以在陶瓷基板（1）和电极层（22）之间提供良好的结合强度。除了原始产品的相同的电气特性外，电极组件除去了丝网印刷银电极中贵金属的使用，并降低了电极层（22）和陶瓷衬底（1）之间的欧姆接触电阻。

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