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1. 发明授权

EP3093856B1 RESISTOR AND PRODUCTION METHOD FOR RESISTOR 有权
公开(公告)号：EP3093856B1
公开(公告)日：2019-05-29
申请号：EP15735609.8
申请日：2015-01-07
申请人： Mitsubishi Materials Corporation
发明人： NAGASE, Toshiyuki , ISHIZUKA, Hiroya
IPC分类号： H01C1/084 , H01C17/00 , H01C17/28 , H01C1/142 , H01C1/144 , H01C1/01

2. 发明公开

EP3451352A1 HIGH-PRECISION ADDITIVE FORMATION OF ELECTRICAL RESISTORS 有权
公开(公告)号：EP3451352A1
公开(公告)日：2019-03-06
申请号：EP17188183.2
申请日：2017-08-28
申请人： Hochschule für angewandte Wissenschaften München
发明人： Moosheimer, Ulrich
IPC分类号： H01C1/142 , H01C7/00 , H01C17/065 , H01C17/075 , H01C17/28
摘要： Shown herein is a method of forming an electrical resistor (10) comprising the steps of: forming an electrically resistive layer (14) on a substrate (12);
measuring an electrical resistance-related parameter of the electrically resistive layer (14) and determining a target length (L) of the electrically resistive layer (14) corresponding to a target electrical resistance; and
forming first and second electrically conductive terminals (16a, 16b) contacting the electrically resistive layer (14), said first and second electrically conductive terminals (16a, 16b) being separated by a distance corresponding to the target length (L). In an alternative embodiment, an electrically isolating layer is formed on the electrically resistive layer having first and second ends, wherein the electrically isolating layer covers the electrically resistive layer in an overlap region extending between said and second ends, such that a length of the electrically resistive layer covered by the electrically isolating layer corresponds to the target length (L). First and second electrically conductive terminals are formed directly adjacent to the first and second ends of the electrically insulating layer, respectively. Corresponding arrangements for forming the electrical resistors are likewise disclosed.

3. 发明公开

EP3196904A4 CHIP-TYPE CERAMIC SEMICONDUCTOR ELECTRONIC COMPONENT 有权
公开(公告)号：EP3196904A4
公开(公告)日：2018-05-09
申请号：EP15842099
申请日：2015-07-03
申请人： MURATA MANUFACTURING CO
发明人： ISOGAI KEISUKE , IMAMURA SATOSHI
IPC分类号： H01G4/30 , H01C1/14 , H01C1/142 , H01C7/02 , H01C7/04 , H01C7/10 , H01G4/232 , H01G4/252
CPC分类号： H01G4/2325 , H01C1/1406 , H01C1/1413 , H01C1/142
摘要： Provided is a chip-type ceramic semiconductor electronic component where the variation in the rate of change in resistance value is small between before and after mounting. Provided is a chip-type ceramic semiconductor electronic component including: a ceramic body including a ceramic semiconductor; a pair of first external electrodes formed on both end surfaces of the ceramic body; and a pair of second external electrodes formed to cover the first external electrodes and extend partially on side surfaces of the ceramic body, where the second external electrodes include a conductive agent and a thermosetting resin hardened at a temperature of 500°c or lower.

4. 发明公开

EP3146536A1 ELEKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权转让
标题翻译： EERKTRONISCHES BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
公开(公告)号：EP3146536A1
公开(公告)日：2017-03-29
申请号：EP15727321.0
申请日：2015-05-18
申请人： Epcos AG
发明人： RINNER, Franz , WANG, Yongli
IPC分类号： H01C7/102 , H01C7/105 , H01C1/142
摘要： The invention relates to an electronic component (100) having a functional body (1) und a contact (4a, 4b) which is electrically connected to a first surface (5) of the functional body (1), wherein the contact (4a, 4b) has an edge region (7) und a central region (8). The functional body (1) is designed in such a way that the electrical resistance of the functional body (1) between the first surface (5) und a second surface (6) of the functional body (1) facing away from the first surface (5) in a first functional body section (3), which in a plan view of the electronic component (100) overlaps the edge region (7), is greater than in a second functional body portion (2), which overlaps the central region (8) of the contact (4a, 4b).
摘要翻译：公开了电子部件和电气部件的制造方法。在一个实施例中，电子部件包括具有第一表面和第二表面的功能体，其中第二表面背离第一表面，以及电连接到第一表面的触点，触点具有边缘区域和中心区域，其中所述功能体在所述第一功能体部分中的所述第一表面和所述第二表面之间具有第一电阻，所述第一功能体部分在所述电子部件的平面图中与所述接触的边缘区域重叠，所述第一电阻大于第二功能体部分中的第一表面和第二表面之间的第二电阻，其与电子部件的平面图中的接触的中心区域重叠。

5. 发明公开

EP3109868A1 PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER 有权
标题翻译： HERSTELLUNGSVERFAHRENFÜRELEKTRONISCHE KOMPONENTEN MIT EINER LEGIERUNGSELEKTRODENSCHICHT
公开(公告)号：EP3109868A1
公开(公告)日：2016-12-28
申请号：EP15180676.7
申请日：2015-08-12
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： XU, Xun , JIA, Zhiwei
IPC分类号： H01C1/142 , H01C7/102 , H01C17/28
CPC分类号： H01C17/065 , H01C1/142 , H01C7/102 , H01C17/281 , H01C17/283 , H05K3/1225 , H05K3/1291 , H05K3/14 , H05K3/28 , H05K3/4007 , H05K3/4664
摘要： A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer (21) on each of the two opposite surfaces of a ceramic substrate (1) with the metal layer (21) made from aluminum, spraying an alloy layer (22) being a copper alloy layer (22) on an outer surface of each metal layer (21), connecting a pin (3) to each alloy layer (22), and enclosing the ceramic substrate (1), the metal layers (21), the alloy layers (22) and a portion of each pin (3) with an insulating layer (4). With the adoption of copper alloy for the alloy layer (22), the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method.
摘要翻译：一种具有合金电极层的电子部件的制备方法，包括以下步骤：在由铝制成的金属层（21）的陶瓷基板（1）的两个相对面的每一面上印刷金属层（21），喷涂合金层（22）是每个金属层（21）的外表面上的铜合金层（22），将销（3）连接到每个合金层（22），并包围陶瓷基板（1），金属层（21），合金层（22）和每个销（3）的具有绝缘层（4）的部分。随着合金层（22）采用铜合金，该制备方法具有生产成本低，可靠性高的优点。

6. 发明公开

EP2472529A4 THERMISTOR AND METHOD FOR PRODUCING SAME 有权
标题翻译： HERMTELLUNGSVERFAHRENDAFÜR的热忱
公开(公告)号：EP2472529A4
公开(公告)日：2016-04-27
申请号：EP10811774
申请日：2010-08-20
申请人： MURATA MANUFACTURING CO
发明人： MIURA TADAMASA
IPC分类号： H01C7/00 , G01K7/22 , H01C1/14 , H01C1/142 , H01C7/04 , H01C17/065 , H01C17/28
CPC分类号： H01C17/00 , G01K7/22 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C17/065 , H01C17/281 , Y10T29/49085

7. 发明授权

EP2332152B1 RESISTOR AND METHOD FOR MAKING SAME 有权
标题翻译：电阻及其制造方法
公开(公告)号：EP2332152B1
公开(公告)日：2012-04-04
申请号：EP08876406.3
申请日：2008-09-30
申请人： Vishay Dale Electronics, Inc.
发明人： SMITH, Clark L., , BERTSCH, Thomas L., , WYATT, Todd L., , VEIK, Thomas L., , BRUNE, Rodney,
IPC分类号： H01C3/10 , H01C1/142 , H01C17/24
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor (10) is provided. The metal strip resistor includes a metal strip (18) forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating (28) on each of the first and second opposite terminations. There is also an insulating material (20) overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the' conductive pattern, and adjusting resistance of the metal strip.

8. 发明公开

EP2332152A1 RESISTOR AND METHOD FOR MAKING SAME 有权
标题翻译：电阻及其制造方法
公开(公告)号：EP2332152A1
公开(公告)日：2011-06-15
申请号：EP08876406.3
申请日：2008-09-30
申请人： Vishay Dale Electronics, Inc.
发明人： SMITH, Clark L., , BERTSCH, Thomas L., , WYATT, Todd L., , VEIK, Thomas L., , BRUNE, Rodney,
IPC分类号： H01C3/10 , H01C1/142 , H01C17/24
CPC分类号： H01C17/003 , H01C1/142 , H01C3/00 , H01C17/24 , H01C17/288 , Y10T29/49082 , Y10T29/49098
摘要： A metal strip resistor (10) is provided. The metal strip resistor includes a metal strip (18) forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating (28) on each of the first and second opposite terminations. There is also an insulating material (20) overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the' conductive pattern, and adjusting resistance of the metal strip.

9. 发明公开

EP1357771A4 ELECTRONIC PARTS 审中-公开
标题翻译：电子元件
公开(公告)号：EP1357771A4
公开(公告)日：2008-05-21
申请号：EP02800729
申请日：2002-10-02
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： SHIMOYAMA KOJI , TAKASE YOSHIHISA
IPC分类号： H05K1/09 , H01C1/142 , H01G4/008 , H01G4/228 , H01G4/33 , H01L23/498 , H01L23/50 , H05K3/24
CPC分类号： H01G4/228 , H01C1/142 , H01G4/008 , H01G4/33 , H01L23/498 , H01L23/49816 , H01L2224/48463 , H05K3/244
摘要： Electronic parts which have an electrode comprising a substrate and a plurality of nickel layers, wherein an outer nickel layer has a phosphorus content which is lower than that of an inner nickel layer. The electrode exhibits improved solder joint strength with no reduction of flexural strength.

10. 发明授权

EP0841668B1 Elektrischer Widerstand und Verfahren zu seiner Herstellung 失效
标题翻译：电阻和过程及其制备
公开(公告)号：EP0841668B1
公开(公告)日：2007-01-10
申请号：EP97119468.3
申请日：1997-11-06
申请人： Isabellenhütte Heusler GmbH & Co.KG
发明人： Hetzler, Ullrich, Dr.
IPC分类号： H01C1/084 , H01C1/142 , H01C17/07 , H01C17/00
CPC分类号： H01C1/084 , H01C1/142 , H01C17/006 , H01C17/07

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