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1. 发明公开

EP4435813A1 CAPACITOR AND METHOD FOR MANUFACTURING SAME 审中-实审
公开(公告)号：EP4435813A1
公开(公告)日：2024-09-25
申请号：EP22895560.5
申请日：2022-11-14
申请人： Rubycon Corporation
发明人： MORIMITSU, Norimasa , KAKO, Tomonao
IPC分类号： H01G4/30 , H01G4/228 , H01G4/232 , H01G4/252 , H01G4/32
CPC分类号： H01G4/228 , H01G4/232 , H01G4/30 , H01G4/32 , H01G4/252
摘要： There is provided a capacitor (1) including a main body (10), in which a plurality of dielectric layers (13) and a plurality of electrode layers (11) are alternatively laminated, and an external electrode (20) that is connected to at least part of the main body. Before forming an external electrode by metal spraying (metallikon) on the main body, at least part of a connection surface (30) where the metal spraying is performed is scanned with a laser beam (51) so that scanning marks (55) composed of concave-convex structures (35) are formed by the laser beam on at least part of the connection surface.

2. 发明授权

EP3023999B1 ELECTRODE COMPONENT AND METHOD FOR FABRICATING THE SAME 有权转让
标题翻译：电极组件及其制造方法
公开(公告)号：EP3023999B1
公开(公告)日：2017-05-31
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252

3. 发明公开

EP3023999A1 Electrode component and method for fabricating the same 有权转让
标题翻译：电极成分和方法及其生产
公开(公告)号：EP3023999A1
公开(公告)日：2016-05-25
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronics Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate (1), two electrode layers (3) formed on two opposite surfaces of the ceramic substrate (1), two pins (2) respectively connected to the two electrode layers (3), and an insulating layer (4) enclosing the ceramic substrate (1), the electrode layers (3) and each pin (2). Each electrode layer (3) is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer (3). Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer (3) is shortened without compromising bonding strength between the electrode layers (3) and the ceramic substrate (1) and solderability between the electrode layers (3) and the pins (2).

4. 发明公开

EP2824682A4 ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件
公开(公告)号：EP2824682A4
公开(公告)日：2015-09-23
申请号：EP13757761
申请日：2013-02-12
申请人： MURATA MANUFACTURING CO
发明人： TAKAOKA HIDEKIYO , NAKANO KOSUKE , OTA YUTAKA , KAWASAKI KENICHI
IPC分类号： H01G4/30 , H01G4/232 , H01G4/252
CPC分类号： H01G4/12 , H01G2/04 , H01G4/008 , H01G4/2325 , H01G4/252 , H01G4/30

5. 发明公开

EP2817835A1 VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCHEN KONTAKTIERUNG EINES VIELSCHICHTBAUELEMENTS UND VIELSCHICHTBAUELEMENT MIT EINER ELEKTRISCHEN KONTAKTIERUNG 有权转让
标题翻译：一种用于生产多层组件的电接触
公开(公告)号：EP2817835A1
公开(公告)日：2014-12-31
申请号：EP13707133.8
申请日：2013-02-19
申请人： Epcos AG
发明人： SOMITSCH, Dieter , RINNER, Franz , GALLER, Martin , RAMLER, Johann , GABL, Reinhard , BRUNNER, Sebastian
IPC分类号： H01L41/047 , H01L41/083 , H01L41/293
CPC分类号： H01L41/0472 , H01G4/232 , H01G4/252 , H01G4/30 , H01G4/306 , H01G4/308 , H01G4/33 , H01G13/006 , H01L24/27 , H01L41/083 , H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： The invention relates to a method for producing an electric contact of a multilayer component. A main part (11) with internal electrode layers (5a, 5b), an insulating material (3), an electrically conductive material (6), and a photosensitive material are provided. The insulating material (3) and the electrically conductive material (6) are arranged in a structured manner on an outer face (10a, 10b) of the multilayer component (1) in order to alternately contact the internal electrode layers (5a, 5b). The structured arrangement is produced by the photosensitive material (2). The invention further relates to a multilayer component with such a contact.

6. 发明授权

EP2817835B1 VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCHEN KONTAKTIERUNG EINES VIELSCHICHTBAUELEMENTS 有权转让
标题翻译：一种用于生产多层组件的电接触
公开(公告)号：EP2817835B1
公开(公告)日：2016-07-27
申请号：EP13707133.8
申请日：2013-02-19
申请人： Epcos AG
发明人： SOMITSCH, Dieter , RINNER, Franz , GALLER, Martin , RAMLER, Johann , GABL, Reinhard , BRUNNER, Sebastian
IPC分类号： H01L41/047 , H01L41/083 , H01L41/293
CPC分类号： H01L41/0472 , H01G4/232 , H01G4/252 , H01G4/30 , H01G4/306 , H01G4/308 , H01G4/33 , H01G13/006 , H01L24/27 , H01L41/083 , H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/43 , Y10T29/435

7. 发明授权

EP2034496B1 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：EP2034496B1
公开(公告)日：2013-10-23
申请号：EP07741923.2
申请日：2007-04-19
申请人： Murata Manufacturing Co. Ltd.
发明人： KAYATANI, Takayuki c/o (A170) Intellectual Property Department
IPC分类号： H01G4/252 , H01G4/232 , H01G4/30 , H01G13/00
CPC分类号： H01G13/006 , H01G4/2325 , H01G4/252 , H01G4/30
摘要： In the case where a terminal electrode of a laminated ceramic capacitor includes a thick film layer which is a thick film formed from an electrically conductive metal by baking, an electrically conductive resin layer which is disposed on the thick film layer and which contains a thermosetting resin and electrically conductive fillers, and a plating layer which is disposed on the electrically conductive resin layer and which is formed from an electrically conductive metal plating film, and a stress is configured to be relaxed by peeling of the electrically conductive resin layer, if the electrically conductive layer is peeled, the stress relaxation ability of the electrically conductive resin layer may not be exerted and cracking may occur in the laminated ceramic capacitor when a large stress is applied after mounting. An electrically conductive resin layer (32) is disposed in such a way as to cover a thick film layer (31) and extend beyond the end edge (34) of the thick film layer (31) by a dimension (A) of 100 µm or more and a plating layer (33) is disposed in such a way as to cover the electrically conductive resin layer (32) except a region (35) having a width (B) of 50 µm or more and extending along the end edge (37) of the electrically conductive resin layer (32). Consequently, concentration of the stress is relaxed.

8. 发明公开

EP2034496A4 CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME 有权
标题翻译：陶瓷电子元件及其制造方法
公开(公告)号：EP2034496A4
公开(公告)日：2010-12-15
申请号：EP07741923
申请日：2007-04-19
申请人： MURATA MANUFACTURING CO
发明人： KAYATANI TAKAYUKI
IPC分类号： H01G4/252 , H01G4/12 , H01G4/232 , H01G4/30 , H01G13/00
CPC分类号： H01G13/006 , H01G4/2325 , H01G4/252 , H01G4/30
摘要： In the case where a terminal electrode of a laminated ceramic capacitor includes a thick film layer which is a thick film formed from an electrically conductive metal by baking, an electrically conductive resin layer which is disposed on the thick film layer and which contains a thermosetting resin and electrically conductive fillers, and a plating layer which is disposed on the electrically conductive resin layer and which is formed from an electrically conductive metal plating film, and a stress is configured to be relaxed by peeling of the electrically conductive resin layer, if the electrically conductive layer is peeled, the stress relaxation ability of the electrically conductive resin layer may not be exerted and cracking may occur in the laminated ceramic capacitor when a large stress is applied after mounting. An electrically conductive resin layer (32) is disposed in such a way as to cover a thick film layer (31) and extend beyond the end edge (34) of the thick film layer (31) by a dimension (A) of 100 µm or more and a plating layer (33) is disposed in such a way as to cover the electrically conductive resin layer (32) except a region (35) having a width (B) of 50 µm or more and extending along the end edge (37) of the electrically conductive resin layer (32). Consequently, concentration of the stress is relaxed.

9. 发明公开

EP1548767A4 METALLIZED FILM CAPACITOR 有权转让
标题翻译： METALLFILMKONDENSATOR
公开(公告)号：EP1548767A4
公开(公告)日：2009-03-11
申请号：EP03751405
申请日：2003-10-09
申请人： PANASONIC CORP
发明人： SHIOTA KOHEI , SAITO TOSHIHARU , TAKEOKA HIROKI
IPC分类号： H01G4/012 , H01G4/18 , H01G2/16 , H01G4/005 , H01G4/228 , H01G4/252
CPC分类号： H01G4/228 , H01G2/16 , H01G4/012 , H01G4/145 , H01G4/252
摘要： A metallized film capacitor has a slit (5a) almost at the center, in a width (W) direction, of an effective electrode portion contributing to the capacity formation of a pair of vapor-deposition electrodes (110, 210), and is provided, on the sides extending toward insulation margins (4a, 4b) from the center, with split electrodes (2a, 2b) connected in parallel by fuses (7a, 7b), whereby such a construction as having fuses located away from metallikons (6a, 6b) can reduce the values of currents supplied from meallikons and passing through the fuses to thereby reduce heating by the fuses and restrict the temperature rise of the metallized film capacitor.
摘要翻译：金属化薄膜电容器在有助于一对蒸镀电极（110,210）的电容形成的有效电极部分的宽度（W）方向的大致中央具有狭缝（5a），在从中心向绝缘边缘（4a，4b）延伸的侧面上具有由熔断器（7a，7b）并联连接的分开的电极（2a，2b），由此具有远离金属线（6a， 6b）可以降低从中子通过并通过熔丝的电流值，从而减少熔丝的发热并限制金属化薄膜电容器的温升。

10. 发明公开

EP3350819A1 ELEKTRONISCHES BAUELEMENT UND ELEKTRONISCHE SIGNALVERARBEITUNGSEINHEIT MIT EINEM SOLCHEN BAUELEMENT 审中-公开
公开(公告)号：EP3350819A1
公开(公告)日：2018-07-25
申请号：EP16756607.4
申请日：2016-08-03
申请人： SnapTrack, Inc.
发明人： VOROTNIKOV, Borys , RUBAN, Oleksander , SHEVELOV, Mykola , FREISLEBEN, Stefan , SEVSKIY, Georgiy , HEIDE, Patric
IPC分类号： H01G4/38 , H03H9/15
CPC分类号： H01G4/385 , H01G4/01 , H01G4/252
摘要： The invention relates to an electronic component (1) comprising a first and a second base plate (2a, 2b) and a coupling plate (3). The coupling plate (3) is divided into a plurality (N) of strips (6) which do not contact one another, and the strips of the coupling plate extend in their longitudinal direction (L) such that each strip is congruent with both a part of the first base plate (2a) as well as a part of the second base plate (2b) so as to form electric elementary capacitors (Ce). By means of the strips (6), a plurality (N) of electric elementary series capacitors (Cse) connected in parallel are formed between the first and the second base plate (2a, 2b). In this manner, a short circuit (K) at a specific strip (6') causes only a negligible change in the entire series capacitance (Cs) of the component (1).

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