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1. 发明授权

EP3023999B1 ELECTRODE COMPONENT AND METHOD FOR FABRICATING THE SAME 有权
标题翻译：电极组件及其制造方法
公开(公告)号：EP3023999B1
公开(公告)日：2017-05-31
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252

2. 发明公开

EP3023999A1 Electrode component and method for fabricating the same 有权
标题翻译：电极成分和方法及其生产
公开(公告)号：EP3023999A1
公开(公告)日：2016-05-25
申请号：EP15156854.0
申请日：2015-02-27
申请人： Thinking Electronics Industrial Co., Ltd.
发明人： Huang, Jen-Heng
IPC分类号： H01C17/28 , H01C7/102 , H01C1/142 , H01G4/232 , H01G4/252
CPC分类号： H01C1/142 , H01B1/02 , H01C1/014 , H01C1/144 , H01C7/102 , H01C7/12 , H01C17/06 , H01C17/281 , H01C17/283 , H01G4/232 , H01G4/252
摘要： An electrode component includes a ceramic substrate (1), two electrode layers (3) formed on two opposite surfaces of the ceramic substrate (1), two pins (2) respectively connected to the two electrode layers (3), and an insulating layer (4) enclosing the ceramic substrate (1), the electrode layers (3) and each pin (2). Each electrode layer (3) is formed of two or more base metal materials or alloys thereof, and the concentrations of the base metal materials progressively vary across the electrode layer (3). Accordingly, the production cost is lowered, environmental pollution caused by evaporation and thermal dissolution of organic solvent can be prevented, risk of separable electrode interface at high-voltage discharge is mitigated, and the fabrication process of the electrode layer (3) is shortened without compromising bonding strength between the electrode layers (3) and the ceramic substrate (1) and solderability between the electrode layers (3) and the pins (2).

3. 发明公开

EP2824682A4 ELECTRONIC COMPONENT 审中-公开
标题翻译：电子元件
公开(公告)号：EP2824682A4
公开(公告)日：2015-09-23
申请号：EP13757761
申请日：2013-02-12
申请人： MURATA MANUFACTURING CO
发明人： TAKAOKA HIDEKIYO , NAKANO KOSUKE , OTA YUTAKA , KAWASAKI KENICHI
IPC分类号： H01G4/30 , H01G4/232 , H01G4/252
CPC分类号： H01G4/12 , H01G2/04 , H01G4/008 , H01G4/2325 , H01G4/252 , H01G4/30

4. 发明公开

EP2817835A1 VERFAHREN ZUR HERSTELLUNG EINER ELEKTRISCHEN KONTAKTIERUNG EINES VIELSCHICHTBAUELEMENTS UND VIELSCHICHTBAUELEMENT MIT EINER ELEKTRISCHEN KONTAKTIERUNG 有权转让
标题翻译：一种用于生产多层组件的电接触
公开(公告)号：EP2817835A1
公开(公告)日：2014-12-31
申请号：EP13707133.8
申请日：2013-02-19
申请人： Epcos AG
发明人： SOMITSCH, Dieter , RINNER, Franz , GALLER, Martin , RAMLER, Johann , GABL, Reinhard , BRUNNER, Sebastian
IPC分类号： H01L41/047 , H01L41/083 , H01L41/293
CPC分类号： H01L41/0472 , H01G4/232 , H01G4/252 , H01G4/30 , H01G4/306 , H01G4/308 , H01G4/33 , H01G13/006 , H01L24/27 , H01L41/083 , H01L41/273 , H01L41/293 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： The invention relates to a method for producing an electric contact of a multilayer component. A main part (11) with internal electrode layers (5a, 5b), an insulating material (3), an electrically conductive material (6), and a photosensitive material are provided. The insulating material (3) and the electrically conductive material (6) are arranged in a structured manner on an outer face (10a, 10b) of the multilayer component (1) in order to alternately contact the internal electrode layers (5a, 5b). The structured arrangement is produced by the photosensitive material (2). The invention further relates to a multilayer component with such a contact.

5. 发明授权

EP3454352B1 MULTILAYER CERAMIC CAPACITOR 有权
公开(公告)号：EP3454352B1
公开(公告)日：2024-04-24
申请号：EP18192999.3
申请日：2018-09-06
IPC分类号： H01G4/30 , H01G4/38 , H01G2/06 , H01G4/232 , H01G4/252
CPC分类号： H01G4/385 , H01G2/065 , H01G4/232 , H01G4/2325 , H01G4/252 , H05K1/181 , H05K3/3442 , H05K2201/1001520130101 , H01G4/30

6. 发明公开

EP2874159A3 Base metal combination electrode of electronic ceramic component and manufacturing method thereof 审中-公开
标题翻译：的电子陶瓷部件和制造方法的基体金属电极组合它们
公开(公告)号：EP2874159A3
公开(公告)日：2015-10-07
申请号：EP13184153.8
申请日：2013-09-12
申请人： Longke Electronics (Huiyang) Co., Ltd.
发明人： Tseng, Chinglung
IPC分类号： H01C1/142 , H01C1/144 , H01C17/28 , H01C7/102 , H01G4/252 , H01G4/232 , H05K1/18 , H01C1/14
CPC分类号： H01C1/142 , H01C1/14 , H01C1/144 , H01C7/102 , H01C17/281 , H01C17/283 , H01G4/2325 , H01G4/252
摘要： The present invention provides a base metal combination electrode (113,114) of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode (113,114) comprises a first base metal electrode layer (113) covering on two sides of said electronic ceramic chip (111) and a second base metal electrode layer (114) covering on said first base metal electrode layer (113), the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.

7. 发明公开

EP2874159A2 Base metal combination electrode of electronic ceramic component and manufacturing method thereof 审中-公开
标题翻译：的电子陶瓷部件和制造方法的基体金属电极组合它们
公开(公告)号：EP2874159A2
公开(公告)日：2015-05-20
申请号：EP13184153.8
申请日：2013-09-12
申请人： Longke Electronics (Huiyang) Co., Ltd.
发明人： Tseng, Chinglung
IPC分类号： H01C1/142 , H01C1/144 , H01C17/28 , H01C7/102 , H01G4/252 , H01G4/232 , H05K1/18 , H01C1/14
CPC分类号： H01C1/142 , H01C1/14 , H01C1/144 , H01C7/102 , H01C17/281 , H01C17/283 , H01G4/2325 , H01G4/252
摘要： The present invention provides a base metal combination electrode (113,114) of electronic ceramic component and manufacturing method thereof, wherein said base metal combination electrode (113,114) comprises a first base metal electrode layer (113) covering on two sides of said electronic ceramic chip (111) and a second base metal electrode layer (114) covering on said first base metal electrode layer (113), the manufacturing method for base metal combination electrode of electronic ceramic component comprises using thermal spray equipment to spray the electrode material to the surface of electronic ceramic chip. Comparing with using silver paste or copper paste only, it reduces the cost of electrode material without destroying the function of the electrode. The manufacturing method for base metal combination electrode of the present invention has simple technological process, high preparation efficiency and low cost, and it reduces the production cost of electrode of the electronic ceramic component on the whole.
摘要翻译：本发明提供电子陶瓷部件和制造方法的碱金属的组合电极（113,114）其worin所述碱金属的组合电极（113,114）包括第一基体金属电极层（113），其覆盖在所述电子陶瓷芯片的两侧（ 111）和第二基体金属电极层（114）覆盖在所述第一基体金属电极层（113），用于电子陶瓷部件的基体金属复合电极的制造方法包括使用热喷涂设备，以电极材料喷到表面电子陶瓷芯片。利用银膏或铜膏仅比较，它减少了电极材料的成本而不破坏电极的功能。对于本发明的基体金属复合电极的制造方法具有工艺简单，制备高效率和低成本，并且它减少了整体上的电子陶瓷部件的电极的生产成本。

8. 发明授权

EP1548767B1 METALLIZED FILM CAPACITOR 有权转让
标题翻译：金属化电影电容器
公开(公告)号：EP1548767B1
公开(公告)日：2011-06-29
申请号：EP03751405.6
申请日：2003-10-09
申请人： Panasonic Corporation
发明人： SHIOTA, Kohei , SAITO, Toshiharu , TAKEOKA, Hiroki
IPC分类号： H01G4/012 , H01G4/18
CPC分类号： H01G4/228 , H01G2/16 , H01G4/012 , H01G4/145 , H01G4/252
摘要： A metallized film capacitor has a slit (5a) almost at the center, in a width (W) direction, of an effective electrode portion contributing to the capacity formation of a pair of vapor-deposition electrodes (110, 210), and is provided, on the sides extending toward insulation margins (4a, 4b) from the center, with split electrodes (2a, 2b) connected in parallel by fuses (7a, 7b), whereby such a construction as having fuses located away from metallikons (6a, 6b) can reduce the values of currents supplied from meallikons and passing through the fuses to thereby reduce heating by the fuses and restrict the temperature rise of the metallized film capacitor.
摘要翻译：金属化薄膜电容器在有助于一对蒸镀电极（110,210）的电容形成的有效电极部分的宽度（W）方向的大致中央具有狭缝（5a），在从中心向绝缘边缘（4a，4b）延伸的侧面上具有由熔断器（7a，7b）并联连接的分开的电极（2a，2b），由此具有远离金属线（6a， 6b）可以降低从中子通过并通过熔丝的电流值，从而减少熔丝的发热并限制金属化薄膜电容器的温升。

9. 发明公开

EP1743347A4 EMI FILTER TERMINAL ASSEMBLY WITH WIRE BOND PADS FOR HUMAN IMPLANT APPLICATIONS 有权
标题翻译：与引线键合联络点人体植入应用EMI过滤器连接组件
公开(公告)号：EP1743347A4
公开(公告)日：2009-06-24
申请号：EP04794932
申请日：2004-10-12
申请人： GREATBATCH SIERRA INC
发明人： STEVENSON ROBERT A , BRENDEL RICHARD L , FRYSZ CHRISTINE , HUSSEIN HAYTHAM , KNAPPEN SCOTT , STEVENSON RYAN A
IPC分类号： H01G4/35 , A61N1/16 , A61N1/36 , A61N1/37 , A61N1/375 , H01G2/22 , H01G4/228 , H01J5/00 , H02H9/06
CPC分类号： A61N1/3754 , A61N1/3718 , A61N1/375 , H01G4/236 , H01G4/252 , H01G4/35 , H01L2224/45144 , H01L2224/4847 , H01L2924/00
摘要： An electro-magnetic interference filter terminal assembly (136) for active implantable medical devices includes a structural pad (140) in the form of a substrate or attached wire bond pad (122), for convenient attachment of wires (124) from the circuitry inside the implantable medical device to the capacitor structure (110) via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

10. 发明公开

EP1548767A1 METALLIZED FILM CAPACITOR 有权转让
标题翻译：金属化电影电容器
公开(公告)号：EP1548767A1
公开(公告)日：2005-06-29
申请号：EP03751405.6
申请日：2003-10-09
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SHIOTA, Kohei , SAITO, Toshiharu , TAKEOKA, Hiroki
IPC分类号： H01G4/18
CPC分类号： H01G4/228 , H01G2/16 , H01G4/012 , H01G4/145 , H01G4/252
摘要： A metallized-film capacitor includes a slit (5a) at approx. center of the width (W) of an effective electrode which actually forms a capacitance of a pair of deposited electrodes (110, 210). Divisional electrodes (2a, 2b) exist at a place between the center and insulation margins (4a, 4b), and the electrodes (2a, 2b) are coupled in parallel to each other by fuses (7a, 7b) disposed away from metallized contacts (6a, 6b). Such a structure as placing fuses (7a, 7b) away from the contacts (6a, 6b) allows reducing a current supplied from the contacts (6a, 6b) and running through fuses (7a, 7b), thereby lowering heat generated from fuses (7a, 7b). As a result, a temperature rise in the metallized-film capacitor can be suppressed.
摘要翻译：一个金属化薄膜电容器包括一个大约5μm的狭缝（5a）。实际上形成一对沉积电极（110,210）的电容的有效电极的宽度（W）的中心。分电极（2a，2b）存在于中心和绝缘边缘（4a，4b）之间的一个位置上，并且电极（2a，2b）通过熔断器（7a，7b）相互并联连接，熔断器远离金属化触点（6a，6b）。这种将熔断器（7a，7b）远离触点（6a，6b）的结构允许减少从触点（6a，6b）供应并穿过熔断器（7a，7b）的电流，从而降低熔断器 7a，7b）。结果，能够抑制金属化膜电容器的温度上升。

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