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1. 发明公开

EP3403267A1 BAUELEMENTTRAEGER MIT ESD SCHUTZFUNKTION UND VERFAHREN ZUR HERSTELLUNG 无效
公开(公告)号：EP3403267A1
公开(公告)日：2018-11-21
申请号：EP17700228.4
申请日：2017-01-10
申请人： TDK Electronics AG
发明人： BRUNNER, Sebastian , FAISTAUER, Christian , PUDMICH, Günter , PAYR, Edmund , WIESBAUER, Kurt
IPC分类号： H01C1/14 , H01C1/144 , H01C7/102 , H01C17/065 , H05K1/00 , H01C17/28 , H01C7/10
CPC分类号： H01C7/1006 , H01C1/14 , H01C1/144 , H01C7/102 , H01C17/065 , H01C17/281
摘要： A green sheet consisting of varistor material is laminated on a ceramic base body (GK), which is provided on both sides with metallizations (EP1, AF), and is sintered to form a varistor layer (VS). A closing pair of electrodes (EP1, EP2) completes the arrangement, allowing the varistor layer to be operated as a varistor. The upper second pair of electrodes (EP2) can directly be used as a connection contact for mounting an electrical component.

2. 发明公开

EP3371564A1 SENSORANORDNUNG UND VERFAHREN ZUR HERSTELLUNG EINER SENSORANORDNUNG 审中-公开
公开(公告)号：EP3371564A1
公开(公告)日：2018-09-12
申请号：EP16782249.3
申请日：2016-10-18
申请人： Epcos AG
发明人： IHLE, Jan , WEIDENFELDER, Anke
IPC分类号： G01K7/16
CPC分类号： G01K7/22 , B28B3/02 , B28B11/243 , G01K7/16 , G01K7/18 , H01C7/008 , H01C7/043 , H01C17/075 , H01C17/281
摘要： The invention relates to a sensor system (10) for measuring temperatures, comprising a sensor element (1) with at least one electrode (2, 3) and at least one contacting element (4), said contacting element (4) is designed and arranged to wirelessly contact the sensor element (1). The invention also relates to a method for producing a sensor arrangement (10).

3. 发明公开

EP3093856A4 RESISTOR AND PRODUCTION METHOD FOR RESISTOR 有权
标题翻译： WIDERSTAND UND HERSTELLUNGSVERFAHRENFÜRWIDERSTAND
公开(公告)号：EP3093856A4
公开(公告)日：2017-09-13
申请号：EP15735609
申请日：2015-01-07
申请人： MITSUBISHI MATERIALS CORP
发明人： NAGASE TOSHIYUKI , ISHIZUKA HIROYA
IPC分类号： H01C1/084 , H01C1/01 , H01C1/142 , H01C1/144 , H01C17/00 , H01C17/28
CPC分类号： H01C1/084 , H01C1/01 , H01C1/14 , H01C1/142 , H01C1/144 , H01C17/006 , H01C17/28 , H01C17/281 , H01C17/283 , H01L2224/40 , H01L2924/181 , H01L2924/00012
摘要： In this resistor, a heat sink (Al member) (23) and the other surface (11b) of a ceramic substrate (11) are joined together using an Al-Si-based brazing filler material. The Al-Si-based brazing filler material has a melting point in a range of approximately 600°C to 700°C. When the heat sink (23) and the ceramic substrate (11) are joined together using the Al-Si-based brazing filler material, it is possible to prevent the derogation of the heat resistance and thermal deterioration during joining at the same time.
摘要翻译：在该电阻器中，使用Al-Si基硬钎料材料将陶瓷基板（11）的散热器（Al构件）（23）和另一表面（11b）接合在一起。 Al-Si基钎料填料具有约600℃至700℃范围内的熔点。当使用Al-Si基钎料填料将散热器（23）和陶瓷基板（11）接合在一起时，可以同时防止接合过程中的耐热性降低和热劣化。

4. 发明公开

EP2014143A2 CONDUCTIVE POLYMER ELECTRONIC DEVICES WITH SURFACE MOUNTABLE CONFIGURATION AND METHODS FOR MANUFACTURING SAME 有权
标题翻译：开展与表面高分子电子设备的安装结构和方法及其制备
公开(公告)号：EP2014143A2
公开(公告)日：2009-01-14
申请号：EP07760729.9
申请日：2007-04-16
申请人： Bourns, Inc.
发明人： BOURNS, Gordon L. , CHU, Stelar , GRINDELL, Daniel E. , HUANG, David , KELLY, John , MEIJER, Erik
IPC分类号： H05K1/00
CPC分类号： H01C7/021 , H01C1/016 , H01C1/1406 , H01C1/1413 , H01C7/005 , H01C7/028 , H01C7/041 , H01C7/049 , H01C7/18 , H01C17/02 , H01C17/281 , Y10T29/49165
摘要： Surface-mountable conductive polymer electronic devices include at least one conductive polymer active layer laminated between upper and lower electrodes. Upper and lower insulation layers, respectively, sandwich the upper and lower electrodes. First and second planar conductive terminals are formed on the lower insulation layer. First and second cross-conductors are provided by plated through-hole vias, whereby the cross-conductors connect each of the electrodes to one of the terminals. Certain embodiments include two or more active layers, arranged in a vertically-stacked configuration and electrically connected by the cross-conductors and electrodes in parallel. Several embodiments include at least one cross-conductor having a chamfered or beveled entry hole through the upper insulation layer to provide enhanced adhesion between the cross-conductor and the insulation layer. Several methods for manufacturing the present surface-mountable conductive polymer electronic devices are also provided.
摘要翻译：表面安装的导电性高分子的装置包括第一和第二电极，在其上布置的第一和第二绝缘层之间分别一个导电聚合物层。第一和第二平面的导电端子是第二绝缘层上。第一横导体的第二电极连接到第一端子，并且由第一绝缘层的一部分与所述第一电极隔开。第二横导体的第一电极连接到第二端子，并且由所述第二绝缘层的一部分从所述第二电极隔开。在一些实施方案中，至少一个横导体包括穿过所述第一绝缘层上的倾斜部分，以提供跨导体和第一绝缘层之间的粘附增强，同时允许没有不适当的应力更大的热膨胀。在其它实施方案中，本文的优点通过具有与所述第一绝缘层上的金属化锚定垫的物理接触的至少一个交叉的导体来实现的。

5. 发明公开

EP1101228A4 POLYMER THICK-FILM RESISTOR PRINTED ON PLANAR CIRCUIT BOARD SURFACE 有权
标题翻译：在平坦的SCHALTUNGSPLATTE聚合物厚膜电阻
公开(公告)号：EP1101228A4
公开(公告)日：2007-11-07
申请号：EP00910349
申请日：2000-02-25
申请人： MOTOROLA INC
发明人： DUNN GREGORY
IPC分类号： H01C17/06 , H01C1/14 , H01C7/00 , H01C17/28 , H05K1/09 , H05K1/16 , H05K3/00 , H05K3/24 , H05K3/46
CPC分类号： H05K1/167 , H01C1/14 , H01C7/005 , H01C17/281 , H05K1/095 , H05K3/0023 , H05K3/243 , H05K3/4664 , H05K2203/1453 , H05K2203/1461 , Y10T29/49099 , Y10T29/49101 , Y10T29/49128 , Y10T29/49156
摘要： A method of manufacturing a printed circuit board with a polymer thick-film (PTF) resistor (30) whose dimension can be defined with an improved precision by providing a circuit board (10) construction having a planar surface where the resistor is to be deposited. To achieve the desired board construction, the interconnect for the resistor (30) is pattern plated using a permanent photodielectric layer (18) as a plating mask instead of a sacrificial plating resist. The interconnect can be patterned before or after the (PTF) resistor is printed. The x and z dimensions (width and thickness, respectively) of the resistor are determined by the deposition process, while the y dimension (electrical length) is accurately determined by copper termination (26).

6. 发明公开

EP0923085A4 RESISTANCE WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 失效
标题翻译：电路板电阻及其制造方法
公开(公告)号：EP0923085A4
公开(公告)日：2005-12-28
申请号：EP98924600
申请日：1998-06-12
申请人： MATSUSHITA ELECTRIC IND CO LTD
发明人： INUZUKA TSUTOMU , TOMIOKA SATOSHI , FURUKAWA SHIGEO , HIMORI TSUYOSHI , KIMURA SUZUSHI
IPC分类号： H01C1/012 , H01C7/00 , H01C17/06 , H01C17/065 , H01C17/28 , H05K1/16 , H05K3/10
CPC分类号： H01C17/06533 , H01C17/281 , H05K1/167 , H05K3/107
摘要： A resistance wiring board which can be reduced in height and has a high accuracy of resistance value and excellent overload characteristics. The wiring board is obtained by forming a stepped pattern between electrode patterns formed on a green sheet and baking the green sheet after filling up the recessed section formed of the stepped pattern with a resistance paste. In addition, the height of the wiring board can be reduced by making the levels of the surfaces of electrodes (1) and a resistor (3) equal to or lower than that of the surface of an insulating substrate (2) by polishing the surface of the wiring board for improving the accuracy of thickness of the resistor (3). In addition, since the green sheet containing 1.5-2.5 wt.% TiO2, 1.5-2.5 wt.% MnO, and 1.5-4.5 wt.% SiO2 is used as a board material and a Pd-Ag electrode paste containing 60 wt.% Pd is used as an electrode material, the board material and electrode paste can be baked collectively at the same time without sacrificing the balance of the coefficients of thermal conductivity of the material and the paste.

7. 发明公开

EP1283528A3 Niederohmiger elektrischer Widerstand und Verfahren zur Herstellung solcher Widerst-nde 有权
标题翻译：低阻抗电阻和制造这种电阻器的方法动手
公开(公告)号：EP1283528A3
公开(公告)日：2003-07-16
申请号：EP02015940.6
申请日：2002-07-17
申请人： Isabellenhütte Heusler GmbH KG
发明人： Hetzler, Ullrich, Dr.
IPC分类号： H01C17/00 , H01C1/142
CPC分类号： H01C7/06 , H01C1/142 , H01C7/003 , H01C17/003 , H01C17/281
摘要： Zur Herstellung niederohmiger elektrischer Widerstände aus einem Blech (1') oder einer Folie aus einer metallischen Widerstandslegierung wird auf eine Vielzahl photolithographisch definierter paralleler Streifen, die sich mit gleichmäßigen gegenseitigen Abständen über die gesamte Blech- bzw. Folienoberfläche erstrecken, galvanisch ein die Anschlusskontakte (4', 4'') der Widerstände bildendes Metall abgeschieden. Zum Vereinzeln der Widerstände wird das galvanisierte Metallstück (1') längs senkrecht zueinander verlaufender Schnittebenen zersägt, von denen die Schnittebenen der einen Gruppe jeweils einen der Anschlusskontaktstreifen in deren Längsrichtung zerteilen.

8. 发明公开

EP1128398A2 Resistance element and method of production of same 审中-公开
标题翻译： Widerstandselement和dessen Herstellungsverfahren
公开(公告)号：EP1128398A2
公开(公告)日：2001-08-29
申请号：EP01103579.7
申请日：2001-02-20
申请人： TDK Corporation
发明人： Sawamura, Kentaro
IPC分类号： H01C7/02
CPC分类号： H01C17/281 , C04B35/5626 , C04B35/597 , C04B37/026 , C04B2235/3217 , C04B2235/3225 , C04B2235/3227 , C04B2235/3229 , C04B2235/3865 , C04B2235/3869 , C04B2235/3878 , C04B2235/6581 , C04B2235/767 , C04B2235/79 , C04B2237/125 , C04B2237/368 , C04B2237/403 , C04B2237/405 , C04B2237/407 , C04B2237/408 , C04B2237/68 , C04B2237/82 , C04B2237/84 , H01C1/146 , H01C7/008 , Y10T428/24917 , Y10T428/30
摘要： A resistance element comprising at least a resistance element body comprised of a ceramic including β-SIALON of a composition expressed by Si 6-z Al z O z N 8-z (where, in the formula, z = 0.3 to 1.0) and an internal conductor embedded inside the resistance element body, wherein the internal conductor includes a conductor material containing tungsten and carbon and having an atomic ratio of carbon to tungsten of 0.4 to 1,1 and an insulator material and the volume ratio of the insulator material to the conductor material is 0.25 to 1.5. Such a resistance element can be used over a long time under a high temperature environment, has little fluctuation in resistance even with repeated rises and falls between room temperature and a high temperature, can withstand oxidation at a high temperature, and is otherwise superior in durability.
摘要翻译：一种电阻元件，至少包括电阻元件主体，该电阻元件由包含由Si6-zAlzOzN8-z表示的组成的β-SIALON（其中，在该公式中，z = 0.3至1.0）和嵌入电阻元件内部的内部导体其特征在于，所述内部导体包括含有碳与钨的原子比为0.4〜1.1的导体材料和绝缘体材料，并且所述绝缘体材料与所述导体材料的体积比为0.25〜1.5。这种电阻元件可以在高温环境下长时间使用，即使在室温和高温之间重复上升和下降也几乎没有电阻波动，可以承受高温下的氧化，否则其耐久性优异。

9. 发明公开

EP1101228A1 POLYMER THICK-FILM RESISTOR PRINTED ON PLANAR CIRCUIT BOARD SURFACE 有权
标题翻译： ON电平电路板印制聚合物厚膜电阻
公开(公告)号：EP1101228A1
公开(公告)日：2001-05-23
申请号：EP00910349.0
申请日：2000-02-25
申请人： MOTOROLA, INC.
发明人： DUNN, Gregory
IPC分类号： H01C17/28
CPC分类号： H05K1/167 , H01C1/14 , H01C7/005 , H01C17/281 , H05K1/095 , H05K3/0023 , H05K3/243 , H05K3/4664 , H05K2203/1453 , H05K2203/1461 , Y10T29/49099 , Y10T29/49101 , Y10T29/49128 , Y10T29/49156
摘要： A method of manufacturing a printed circuit board with a polymer thick-film (PTF) resistor (30) whose dimension can be defined with an improved precision by providing a circuit board (10) construction having a planar surface where the resistor is to be deposited. To achieve the desired board construction, the interconnect for the resistor (30) is pattern plated using a permanent photodielectric layer (18) as a plating mask instead of a sacrificial plating resist. The interconnect can be patterned before or after the (PTF) resistor is printed. The x and z dimensions (width and thickness, respectively) of the resistor are determined by the deposition process, while the y dimension (electrical length) is accurately determined by copper termination (26).

10. 发明授权

EP0517372B1 Method of manufacturing a PTC device 失效
标题翻译：一种用于生产PTC器件的工艺
公开(公告)号：EP0517372B1
公开(公告)日：1997-08-06
申请号：EP92304051.3
申请日：1992-05-06
申请人： DAITO COMMUNICATION APPARATUS CO. LTD.
发明人： Hanada, Toshiyuki, c/o Daito Communication , Takata, Mayumi, c/o Daito Communication , Yamazaki, Naoki, c/o Daito Communication , Morooka, Isao , Harazaki, Kazuhiko
IPC分类号： H01C1/14 , H01C7/02 , H01C17/28 , B32B15/04
CPC分类号： H01C17/281 , H01C1/1406 , H01C7/027 , Y10T428/12014 , Y10T428/12028 , Y10T428/12049 , Y10T428/12056 , Y10T428/12063 , Y10T428/12069 , Y10T428/12111

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