专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP4374147A1 METHOD OF MANUFACTURING NTC SENSORS 审中-实审
公开(公告)号：EP4374147A1
公开(公告)日：2024-05-29
申请号：EP22730891.3
申请日：2022-05-30
申请人： TDK Electronics AG
发明人： HOJAS, Gerhard , RAVICHANDRAN, Subramanian , CHAVAN, Dhananjay , FAIL, Wolfgang
IPC分类号： G01K7/22
CPC分类号： G01K7/22 , H01C17/281 , H01C17/02 , H01C1/1413 , H01C1/144

3. 发明公开

EP3282455A1 RESISTOR DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：电阻器装置及其制造方法
公开(公告)号：EP3282455A1
公开(公告)日：2018-02-14
申请号：EP16183502.0
申请日：2016-08-10
申请人： Walsin Technology Corporation
发明人： Wang, Kao-Yuan , Chuang, Nai-Chuan , Wei, Shih-Long
IPC分类号： H01C17/24 , H01C1/148
CPC分类号： H01C17/24 , H01C1/148 , H01C17/006 , H01C17/281
摘要： The present invention provides a wafer resistor device and a manufacturing method thereof. The manufacturing method of the wafer resistor device comprises the following steps: a first cutting step of magnetically attracting a magnetic metal contact of the wafer resistor device to cut a resistive layer for a first time; a second step of magnetically attracting the magnetic metal contact of the wafer resistor device to cut the resistive layer for a second time. Through the above steps, each wafer resistor device is heading in the same direction during the cutting steps to allow the cutting marks to appear in the same position on each wafer resistor device to reduce the amount of variation of the resistance value of each resistor due to the cutting steps.
摘要翻译：本发明提供一种晶圆电阻器装置及其制造方法。晶片电阻装置的制造方法包括以下步骤：第一切割步骤，磁性吸引晶圆电阻装置的磁性金属接点，以第一次切割电阻层; 第二步骤，磁性吸引晶片电阻器装置的磁性金属触点以第二次切割电阻层。通过上述步骤，每个晶片电阻器件在切割步骤期间以相同的方向前进，以允许切割标记出现在每个晶片电阻器件上的相同位置，以减少每个电阻器的电阻值的变化量，这是由于切割步骤。

4. 发明公开

EP3109868A1 PREPARATION METHOD FOR ELECTRONIC COMPONENTS WITH AN ALLOY ELECTRODE LAYER 有权
标题翻译： HERSTELLUNGSVERFAHRENFÜRELEKTRONISCHE KOMPONENTEN MIT EINER LEGIERUNGSELEKTRODENSCHICHT
公开(公告)号：EP3109868A1
公开(公告)日：2016-12-28
申请号：EP15180676.7
申请日：2015-08-12
申请人： Thinking Electronic Industrial Co., Ltd.
发明人： XU, Xun , JIA, Zhiwei
IPC分类号： H01C1/142 , H01C7/102 , H01C17/28
CPC分类号： H01C17/065 , H01C1/142 , H01C7/102 , H01C17/281 , H01C17/283 , H05K3/1225 , H05K3/1291 , H05K3/14 , H05K3/28 , H05K3/4007 , H05K3/4664
摘要： A preparation method for an electronic component with an alloy electrode layer includes steps of printing a metal layer (21) on each of the two opposite surfaces of a ceramic substrate (1) with the metal layer (21) made from aluminum, spraying an alloy layer (22) being a copper alloy layer (22) on an outer surface of each metal layer (21), connecting a pin (3) to each alloy layer (22), and enclosing the ceramic substrate (1), the metal layers (21), the alloy layers (22) and a portion of each pin (3) with an insulating layer (4). With the adoption of copper alloy for the alloy layer (22), the preparation method has the advantages of low production cost and high reliability of the electronic component produced by the method.
摘要翻译：一种具有合金电极层的电子部件的制备方法，包括以下步骤：在由铝制成的金属层（21）的陶瓷基板（1）的两个相对面的每一面上印刷金属层（21），喷涂合金层（22）是每个金属层（21）的外表面上的铜合金层（22），将销（3）连接到每个合金层（22），并包围陶瓷基板（1），金属层（21），合金层（22）和每个销（3）的具有绝缘层（4）的部分。随着合金层（22）采用铜合金，该制备方法具有生产成本低，可靠性高的优点。

5. 发明公开

EP2472529A4 THERMISTOR AND METHOD FOR PRODUCING SAME 有权
标题翻译： HERMTELLUNGSVERFAHRENDAFÜR的热忱
公开(公告)号：EP2472529A4
公开(公告)日：2016-04-27
申请号：EP10811774
申请日：2010-08-20
申请人： MURATA MANUFACTURING CO
发明人： MIURA TADAMASA
IPC分类号： H01C7/00 , G01K7/22 , H01C1/14 , H01C1/142 , H01C7/04 , H01C17/065 , H01C17/28
CPC分类号： H01C17/00 , G01K7/22 , H01C1/1413 , H01C1/142 , H01C7/008 , H01C7/04 , H01C17/065 , H01C17/281 , Y10T29/49085

6. 发明公开

EP1622174A4 ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME 审中-公开
标题翻译：电子元件及其制造方法
公开(公告)号：EP1622174A4
公开(公告)日：2009-11-11
申请号：EP04730643
申请日：2004-04-30
申请人： PANASONIC CORP
发明人： TANAKA HIDEKI , WASHIZAKI TOMOYUKI , IKEUCHI KIYOSHI , IWAO TOSHIYUKI , NAGATOMO YASUKI , IIBOSHI KESATO , OTA JIRO , IZUMI YASUHIRO
IPC分类号： H01C1/14 , H01C1/032 , H01C17/28 , H01H85/048
CPC分类号： H01C17/281 , H01C1/032 , H01C1/14 , Y10T29/49107

7. 发明公开

EP1460649A4 CHIP RESISTOR AND METHOD FOR PRODUCING THE SAME 审中-公开
标题翻译：片式电阻及其制造方法
公开(公告)号：EP1460649A4
公开(公告)日：2008-10-01
申请号：EP02788669
申请日：2002-11-28
申请人： ROHM CO LTD
发明人： DOI MASATO
IPC分类号： H01C17/28 , H01C1/14 , H01C7/00 , H01C17/00
CPC分类号： H01C17/006 , H01C1/14 , H01C7/003 , H01C17/28 , H01C17/281 , H01C17/283
摘要： A chip resistor comprising a resistive film 12 and upper surface electrodes 13 at the opposite ends thereof that are formed on the upper surface of a chip type insulating substrate 11, a cover coat 14 covering the resistive film, an auxiliary upper surface electrodes 15 formed on the upper surfaces of the upper surface electrodes 13 so as to partially overlap the cover coat 14, side face electrodes 16 formed on the left and right end faces 11a of the insulating substrate 11, and a metal plating layer 18 formed on the surfaces of the auxiliary upper surface electrode 15 and the side face electrode 16, wherein occurrence of migration due to sulfur gas is prevented in the upper surface electrode 13 and the auxiliary upper surface electrode 15 by forming an uppermost over coat 19 covering the cover coat 14 to partially overlap the part of the auxiliary upper surface electrode 15 overlapping the cover coat 14.

8. 发明授权

EP1664698B1 BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 有权
公开(公告)号：EP1664698B1
公开(公告)日：2008-05-21
申请号：EP04803274.2
申请日：2004-11-25
申请人： Zitzmann, Heinrich , Bernitz, Georg
发明人： BERNITZ, Georg , ZITZMANN, Heinrich
IPC分类号： G01K7/16 , H01C17/28
CPC分类号： H01G4/224 , G01K7/16 , H01C1/142 , H01C7/001 , H01C17/006 , H01C17/281 , H01G13/006 , H01L2924/0002 , H01L2924/00
摘要： The invention relates to a method for producing a component during which a number of parts (106) are firstly provided that each have at least one first connecting area (102). In addition, a support (106) having a first surface (108) is provided inside of which a number of recesses (1121 1124) are made. The provided parts (100) are inserted into the recesses (1121 1124) in such a manner that the first connecting area (102) of each part (100) faces the first surface (108) of the support (100). A conductive material (116) is applied to the first surface (108) of the support (100) in such a manner that the conductive material (116) is in contact with the first connecting area (102) of each part (100). Afterwards, the support (106) is separated in order to obtain the individual components.
摘要翻译：本发明涉及一种用于制造部件的方法，在该方法中首先提供多个部件（106），每个部件具有至少一个第一连接区域（102）。此外，具有第一表面（108）的支撑件（106）在其内部设置有多个凹部（1121 1124）。所提供的部件（100）以使得每个部件（100）的第一连接区域（102）面向支撑件（100）的第一表面（108）的方式插入到凹部（1121 1124）中。以导电材料（116）与每个部件（100）的第一连接区域（102）接触的方式将导电材料（116）施加到支撑件（100）的第一表面（108）。之后，将支撑件（106）分开以获得单独的部件。

9. 发明授权

EP0902952B1 METHOD OF FORMING AN ELECTRODE ON A SUBSTRATE 失效
标题翻译：申请的程序，接点安排在载
公开(公告)号：EP0902952B1
公开(公告)日：2005-08-17
申请号：EP97928755.4
申请日：1997-05-30
申请人： Tyco Electronics Corporation
发明人： CZUBAROW, Pawel , DUPON, Ryan , EVANS, Anthony , JANSONS, Viktors
IPC分类号： H01C17/28 , H01L41/22
CPC分类号： H01L41/29 , H01C17/281

10. 发明公开

EP0870306A1 METHOD OF SECURING AN ELECTRIC CONTACT TO A CERAMIC LAYER AS WELL AS A RESISTANCE ELEMENT THUS MANUFACTURED 失效
标题翻译：方法用于固定开关触点上形成陶瓷层和在制造的电阻元件THIS WAY
公开(公告)号：EP0870306A1
公开(公告)日：1998-10-14
申请号：EP97943100.0
申请日：1997-10-20
申请人： Koninklijke Philips Electronics N.V.
发明人： HASPESLAGH, Harold, Rogier, Michel
IPC分类号： H01C1 , H01C7 , H01C17 , H05K3
CPC分类号： H05K3/4015 , H01C1/14 , H01C17/0654 , H01C17/281 , H01C17/30 , Y10T29/49099
摘要： The invention provides a method of securing an electric contact of a metal to a layer of a sintered thick-film paste which is situated on an electrically insulating substrate. In this method, a layer of a non-sintered thick-film paste is provided, in accordance with a desired pattern, on an electrically insulating substrate. Subsequently, the layer is provided with a, preferably, block-shaped, body of metal, such as a NiFe-alloy. Next, the layer of the thick-film paste is subjected to a temperature treatment, thereby forming the layer of the sintered thick-film paste. Finally, an electric contact is secured to the body, preferably by welding. The connections made by means of the method in accordance with the invention proved to be very reliable, both electrically and mechanically. The invention can be very advantageously used in the manufacture of passive elements, such as resistors and inductors, as well as in the manufacture of heating elements.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式