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    • 4. 发明公开
    • Resistive memory system, driver circuit thereof and method for setting resistance thereof
    • 电阻性存储器系统,驱动器电路,以及它们的用于调节其电阻的方法
    • EP3016108A1
    • 2016-05-04
    • EP15150575.7
    • 2015-01-09
    • Industrial Technology Research Institute
    • Tseng, Pei-LingKuo, Chia-ChenSheu, Shyh-ShyuanChang, Meng-Fan
    • G11C13/00
    • G11C13/0038G11C2013/0078
    • A resistive memory system, a driver circuit thereof and a method for setting resistances thereof are provided. The resistive memory system includes a memory array, a row selection circuit, a first control circuit and a second control circuit. The memory array has a plurality of resistive memory cells. The row selection circuit is used for activating the resistive memory cells. The first control circuit and the second control circuit are coupled to the resistive memory cells. When each of resistive memory cells is set, the first control circuit and the second control circuit respectively provide a set voltage and a ground voltage to the each of resistive memory cells to form a set current, and the set current is clamped by at least one of the first control circuit and the second control circuit.
    • 本发明提供一种电阻性存储器系统,其驱动电路和用于设置其termoresistencias的方法。 电阻式存储器系统包括:存储器阵列,行选择电路,第一控制电路和第二控制电路。 该存储器阵列具有电阻式存储器单元的复数。 行选择电路用于激活所述电阻式存储器单元。 第一控制电路和第二控制电路被耦合到所述电阻式存储器单元。 当每个电阻式存储单元的设置,第一控制电路及第二控制电路提供一组电压和地电压施加到每个电阻存储单元,以形成一组电流,该组电流由至少一个夹紧 的第一控制电路和第二控制电路。
    • 8. 发明公开
    • Memory cell and memory device
    • Speicherzelle und Speichervorrichtung
    • EP1376598A1
    • 2004-01-02
    • EP03254030.4
    • 2003-06-25
    • SHARP KABUSHIKI KAISHA
    • Inoue, KojiHamaguchi, Koji
    • G11C11/15G11C13/02
    • G11C13/0007G11C13/0038G11C13/0069G11C2013/0071G11C2013/009G11C2213/31G11C2213/79
    • The present invention provides a memory cell having a variable resistor (Rc) as a memory element, and also provides a memory device comprising the memory cells. The variable resistor (Rc) is made of a thin-film material (for example, PCMO) or the like having a perovskite structure. So the memory cell can operate at a low voltage and can be highly integrated. The memory cell MC is formed of a combination of a current controlling device (Qc) and a variable resistor. A field-effect transistor, diode or bipolar transistor is used as the current controlling device (Qc). The current controlling device (Qc) is connected in series with the current path of the variable resistor (Rc) so as to control a current flowing through the variable resistor (Rc).
    • 本发明提供一种具有可变电阻器(Rc)作为存储元件的存储单元,并且还提供包括存储器单元的存储器件。 可变电阻器(Rc)由具有钙钛矿结构的薄膜材料(例如PCMO)等制成。 因此,存储器单元可以在低电压下工作并且可以高度集成。 存储单元MC由电流控制装置(Qc)和可变电阻器的组合构成。 使用场效晶体管,二极管或双极晶体管作为电流控制装置(Qc)。 电流控制装置(Qc)与可变电阻器(Rc)的电流路径串联连接,以控制流过可变电阻器(Rc)的电流。