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    • 4. 发明公开
    • Light receiving module
    • Lichtempfängermodul
    • EP1180705A2
    • 2002-02-20
    • EP01119950.2
    • 2001-08-17
    • Sumitomo Electric Industries, Ltd.
    • Fujimura, Yasushi, Yokohama Works ofKida, Yuuji, Sumitomo Wiring Systems, Ltd.
    • G02B6/42
    • G02B6/4214G02B6/421G02B6/4224G02B6/4228G02B6/423G02B6/4243G02B6/4245G02B6/4248G02B6/4265G02B6/4274G02B6/4285
    • An light receiving module 2 consists of a mount substrate 20, an optical fiber 18, a semiconductor photodetector 22, a mount member 26, and a signal processing semiconductor element 28. The mount member 26 has a pair of arm portions and a joint portion. Each arm portion extends along a first direction. The joint portion extends along a direction perpendicular to the first direction and connects the pair of arm portions. The optical fiber 18 has a first end and a second end. The semiconductor photodetector 22 has a light incidence surface optically coupled to the first end of the optical fiber 18, and a light receiving element part. The mount substrate 20 is placed between the pair of arm portions of the mount member 26 and carries the optical fiber 18 and the semiconductor photodetector 20. The signal processing semiconductor element 28 is placed on the mount member 26 and processes a signal from the semiconductor photodetector 22.
    • 光接收模块2由安装基板20,光纤18,半导体光电检测器22,安装构件26和信号处理半导体元件28组成。安装构件26具有一对臂部和接合部。 每个臂部分沿着第一方向延伸。 接合部沿着与第一方向垂直的方向延伸,并且连接该对臂部。 光纤18具有第一端和第二端。 半导体光电检测器22具有光耦合到光纤18的第一端的光入射表面和光接收元件部分。 安装基板20被放置在安装构件26的一对臂部之间,并且承载光纤18和半导体光电检测器20.信号处理半导体元件28放置在安装构件26上,并处理来自半导体光电检测器 22.
    • 6. 发明公开
    • Printed circuit board
    • Gedruckte Schaltung。
    • EP0272027A2
    • 1988-06-22
    • EP87310724.7
    • 1987-12-07
    • AT&T Corp.
    • Gabbard, Larry Joe
    • H05K1/00G02B5/00H05K1/02G02B6/42
    • G02B6/4204G02B6/2817G02B6/42G02B6/424G02B6/4245G02B6/4257G02B6/428G02B6/4285H05K1/0274
    • This printed circuit board (200) with optical signal distribution layer (101, 102) uses a layer of transparent material or an optical fiber mat build into the laminated printed circuit board structure to interconnect various opto-electrical devices (110,111) which are attached to the surface of the printed circuit board.
      The optical devices are connected to the buried optical fiber layer by drilling vias in the printed circuit board to intercept the fiber or the particular optical signal distribution layer at a desired location. The via is then filled with an optical material (210) whose optical properties provide for the coupling of light energy from the intercepted optical signal distribution layer through the via material to the surface of the printed circuit board. Opto-electrical devices are connected over the top of these vias and perform the optical light energy to electrical signal conversion function.
    • 具有光信号分配层(101,102)的印刷电路板(200)使用透明材料层或构成叠层印刷电路板结构的光纤垫,以将各种光电器件(110,111)连接到 印刷电路板的表面。 光学器件通过钻孔印刷电路板中的通孔连接到掩埋光纤层,以在期望的位置截取光纤或特定的光信号分布层。 然后,通孔的光学材料(210)被填充,光学材料(210)的光学性质提供了将光束从被截取的光信号分布层穿过通孔材料耦合到印刷电路板的表面。 光电器件通过这些通孔的顶部连接,并执行光学能量到电信号转换功能。