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1. 发明公开

EP3336591A1 METHOD FOR MANUFACTURING AN ACTIVE OPTICAL CABLE 审中-公开
公开(公告)号：EP3336591A1
公开(公告)日：2018-06-20
申请号：EP17206201.0
申请日：2017-12-08
申请人： AQUAOPTICS CORP.
发明人： LEE, Tung-An , YO, Shih-Jye , CHANG, Chia-Chi
IPC分类号： G02B6/42 , G02B6/44
CPC分类号： G02B6/4227 , G02B6/32 , G02B6/4214 , G02B6/4224 , G02B6/4239 , G02B6/4246 , G02B6/4249 , G02B6/4253 , G02B6/4255 , G02B6/428 , G02B6/4284 , G02B6/4292 , G02B6/4416
摘要： A method for manufacturing an active optical cable comprises (a) flip-chip packaging chips onto a circuit board to form a OE circuit board, (b) integrating the OE circuit board onto an optical bench to form a OE bench, (c) integrating the OE bench onto a printed circuit board to form a OE module, (d) molding encapsulant onto the OE bench, (e) coupling a hybrid cable onto the OE module, and (f) utilizing low temperature, low pressure injection molding process to form the active optical cable.

2. 发明公开

EP3101699A1 MODULE OPTOELECTRONIQUE POUR LIAISON OPTIQUE SANS CONTACT, MODULES MULTIVOIES ASSOCIES, SYSTEME D'INTERCONNEXION, PROCEDE DE REALISATION ET DE CONNEXION A UNE CARTE ASSOCIES 有权
标题翻译：亚光电子模块用于非接触式光学LINK RELEVANT多通道模块，网络体系，充足的换位和相关程序带卡
公开(公告)号：EP3101699A1
公开(公告)日：2016-12-07
申请号：EP16170679.1
申请日：2016-05-20
申请人： RADIALL
发明人： FOUCAL, Vincent , CLAUDEPIERRE, Chrisitan , PEZ, Mathias , PUJOL, Laurence , QUENTEL, François
IPC分类号： H01L33/58 , G02B6/43 , H01S5/022 , H01L31/0203 , G02B7/02 , H04B10/80 , H01L33/48 , G02B6/42
CPC分类号： G01J1/0403 , G01J1/0411 , G01J1/44 , G02B6/4206 , G02B6/4224 , G02B6/43 , G02B7/027 , H01L25/0756 , H01L31/0203 , H01L31/02325 , H01L31/105 , H01L33/486 , H01L33/58 , H01L2224/48091 , H01L2224/48472 , H01L2224/73265 , H01L2924/19107 , H01S5/02212 , H01S5/02276 , H01S5/02288 , H01S5/183 , H04B10/803 , H05K1/0266 , H05K1/0274 , H05K1/181 , H05K3/303 , H05K5/0026 , H05K2201/10121 , H05K2203/167 , H01L2924/00014
摘要： Module optoélectronique (M), destiné à assurer une conversion d'un signal électrique depuis une carte électronique en un signal optique propagé en espace libre ou vice-versa, comprenant l'empilement suivant:
- une carte électronique (1) destinée à servir d'interface avec une carte électronique d'application;
- un composant électronique de commande (2) adapté pour réaliser la commande d'un composant optoélectronique, le composant électronique étant fixé directement sur la carte électronique et relié électriquement au circuit électronique;
- un composant optoélectronique (3) adapté pour émettre ou recevoir un signal lumineux par sa surface supérieure, le composant optoélectronique étant fixé directement sur le dessus du composant électronique de commande et relié électriquement au composant électronique;
- un dispositif optique (9) adapté pour transmettre un signal optique ;
- un support (10) de dispositif optique, le support étant fixé, de préférence par collage ou brasage, directement sur la carte électronique de sorte à assurer l'alignement mécanique entre le dispositif optique et le composant optoélectronique.
摘要翻译：一种光电模块，意在从电子板提供电信号的转换成以在自由空间中或反之亦然传播的光信号，包括以下堆栈：一个电子板，目的是作为与电子应用板接口; 关于适合于在光电部件控制的电子控制部件，电子部件被直接安装在所述电子电路板和电连接到所述电子电路; 适合于传输或通过其上表面上接收的光信号光电部件的，光电子器件被直接安装在电子控制组件的顶部，并电连接到所述电子元件; 到光学器件适于发射在光信号; 到光学器件载体，所述载体被连接，优选地通过胶合或钎焊，直接在电子板，以确保所述光学器件和光电子器件之间的机械对准。

3. 发明公开

EP2940739A4 SILICA-ON-SILICON-BASED HYBRID INTEGRATED OPTOELECTRONIC CHIP AND MANUFACTURING METHOD THEREFOR 有权
标题翻译： HYBRID，集成光电子硅上硅芯片及其制造方法
公开(公告)号：EP2940739A4
公开(公告)日：2016-01-13
申请号：EP13867481
申请日：2013-12-26
申请人： WUHAN TELECOMM DEVICES CO LTD
发明人： ZHOU LIANG , CAO XIAOGE , YU XIANGHONG
IPC分类号： H01L31/12 , G02B6/42 , H01L31/18
CPC分类号： G02B6/4257 , G02B6/122 , G02B6/305 , G02B6/42 , G02B6/4224 , G02B6/4232 , H01L31/02327 , H01L31/12 , H01L31/18
摘要： Provided are a silica-on-silicon-based hybrid integrated optoelectronic chip and a manufacturing method therefor. The hybrid integrated optoelectronic chip comprises a silicon substrate (1), wherein the surface of the silicon substrate (1) is provided with a platform (8), lug bosses (6,7) and a groove (10); a silica waveguide element (2) is arranged in the groove (10), the lug bosses (6,7) are protruded from the surface of the platform (8), and the surface of the platform (8) is provided with a discontinuous metal electrode layer (3); and the surface of the metal electrode layer (3) is provided with solder bumps (4), and an active optoelectronic chip (5) is arranged above the solder bumps (4) and the lug bosses (6, 7). In the manufacturing method, multi-step processes including material growth, hot oxygen bonding, flip-chip bonding, lithography alignment and the like are adopted, thereby guaranteeing the high-efficiency light coupling among waveguide devices of different materials, and reducing the light reflection between waveguide end faces. A high-frequency electrode composed of alternating current electrode areas (26) is manufactured between the alignment lug bosses (6, 7). Due to the fact that flip-chip bonding technology is beneficial to the transmission of high-frequency signals, integration level between devices is improved. Meanwhile, the process design not only can achieve the chip-level probe test, but also can be used for the subsequent gold ball bonding or wedge bonding process, thereby facilitating the achievement of encapsulation and mass production of hybrid integrated chips.

4. 发明公开

EP2790046A4 JUNCTION STRUCTURE FOR MULTICORE OPTICAL FIBER AND METHOD FOR MANUFACTURING JUNCTION STRUCTURE FOR MULTICORE OPTICAL FIBER 有权
标题翻译：连接结构光多芯光纤及其制造方法的连接结构光纤多核
公开(公告)号：EP2790046A4
公开(公告)日：2015-08-05
申请号：EP12855752
申请日：2012-11-14
申请人： SUMITOMO ELECTRIC INDUSTRIES
发明人： SASAOKA EISUKE
IPC分类号： G02B6/24 , G02B6/02 , G02B6/04 , G02B6/38
CPC分类号： G02B6/3885 , G02B6/3652 , G02B6/3822 , G02B6/4224 , Y10T29/49826

5. 发明公开

EP2219059A3 Verfahren zur Herstellung einer elektro-optischen Leiterplatte mit Lichtwellenleiterstrukturen 有权
标题翻译：一种用于制造具有光导波路结构的电光印刷电路板的方法
公开(公告)号：EP2219059A3
公开(公告)日：2014-09-03
申请号：EP10153416.2
申请日：2010-02-12
申请人： vario-optics ag
发明人： Halter, Markus , Betschon, Felix
IPC分类号： G02B6/42 , G02B6/136
CPC分类号： G02B6/42 , C23F1/02 , G02B6/136 , G02B6/4224 , G02B6/423 , G02B2006/12173 , H05K1/0269 , H05K1/0274 , H05K3/0032 , H05K3/0047 , H05K3/061 , H05K2201/09781 , H05K2201/09918
摘要： Eine elektro-optische Leiterplatte enthält einerseits elektrische Leiterbahnen und andererseits Lichtwellenleiterstrukturen. Die Lichtwellenleiterstrukturen umfassen eine Unterschicht (2), eine Kernschicht (4) und eine Mantelschicht (5). Auf der Leiterplatte werden nicht-transparenten Flächen (3) aufgebracht und später die Kernschicht (4) sowohl auf die Unterschicht als auch auf die nicht-transparenten Flächen (3) aufgetragen und sowohl auf der Unterschicht (2) als auch auf den nicht-transparenten Flächen (3) strukturiert. Anschliessend wird diese Struktur in die nicht-transparenten Flächen (3) übertragen, beispielsweise durch Ätzen. Auf diese Weise entstehen strukturierte, nicht transparente Referenzmarken (30), die die Information über die tatsächliche Lage der Lichtwellenleiterstrukturen enthalten.
摘要翻译：该方法包括在衬底上形成的非透明表面（1），例如聚酰亚胺。基板到底层（2）施加在，和底层被构造并检查该下层不覆盖所述非透明表面。核心层（4）被施加，其中，所述核心层和底层覆盖非透明表面。甲覆盖层（5）施加和结构化搜索，DASS模具套层不覆盖所述非透明表面。材料从不透明表面上的结构化的区域内去除，以形成基准标记（30）。

6. 发明授权

EP1352265B1 OPTICAL TRANSMITTER, RECEIVER OR TRANSCEIVER MODULE 有权
标题翻译：光学发件人，收件人或发射器/接收器模块
公开(公告)号：EP1352265B1
公开(公告)日：2011-12-28
申请号：EP01274175.7
申请日：2001-11-20
申请人： Emcore Corporation
发明人： ANDERSON, Gene, R. , ARMENDARIZ, Marcelino, G. , BRYAN, Robert, P. , CARSON, Richard, F. , CHU, Dahwey , DUCKETT, Edwin, B., III , MCCORMICK, Frederick, B. , MITCHELL, Robert, T. , PETERSON, David W. , REYSEN, Bill, H.
IPC分类号： G02B6/42
CPC分类号： G02B6/4239 , G02B6/266 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/4207 , G02B6/421 , G02B6/4212 , G02B6/4221 , G02B6/4224 , G02B6/4227 , G02B6/4249 , G02B6/426 , G02B6/4277 , G02B6/4281 , G02B6/4283 , G02B6/4286 , G02B6/4292
摘要： This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an optoelectronic connector. The optoelectronic connector comprises: (1) a mounting structure; (2) an array of optoelectronic devices adapted to the mounting structure, the optoelectronic devices having at least a first end; (3) an array of optical elements, the array of optical elements having at least a first end; (4) the first end of the array of optical elements proximate to the first end of the array of optoelectronic devices in such a manner that one or more optical elements is positioned relative to one or more optoelectronic devices; and (5) a heat spreader passing along a surface of a head region of the mounting structure. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the head spreader. Optoelectronic devices may be adapted to the head spreader in such a manner that the devices are accessible through the window in the mounting structure.

7. 发明公开

EP2192431A3 Opto-electric hybrid board and manufacturing method thereof 审中-公开
标题翻译：其光电混合板和制造方法
公开(公告)号：EP2192431A3
公开(公告)日：2011-07-27
申请号：EP09176770.7
申请日：2009-11-23
申请人： Nitto Denko Corporation
发明人： Hodono, Masayuki
IPC分类号： G02B6/43 , G02B6/42
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4224 , G02B6/43 , H05K1/0269 , H05K1/0274 , H05K3/303 , H05K2201/0108 , H05K2201/09918 , H05K2201/10121 , H05K2203/063 , H05K2203/166 , Y10T29/49124
摘要： An opto-electric hybrid board in which a new alignment mark having an identifying mark that is easy to recognize is formed in addition to a conventional alignment mark, and a method of manufacturing the opto-clcctric hybrid board. The opto-electric hybrid board includes an optical waveguide portion 2, an electric circuit board 1, and optical elements mounted on this electric circuit board 1. The optical waveguide portion 2 includes a translucent under cladding layer 21, a linear core 22 for an optical path, first alignment marks 24 positioned relative to end portions of this core 22, and an over cladding layer 23 for covering the above-mentioned core 22 and the first alignment marks 24. The electric circuit board 1 includes second alignment marks 15 for positioning of the optical elements and formed on a surface thereof on which the optical elements are mounted.

8. 发明公开

EP2192431A2 Opto-electric hybrid board and manufacturing method thereof 审中-公开
标题翻译： Optoelektrische Hybridplatte und Herstellungsverfahren davon
公开(公告)号：EP2192431A2
公开(公告)日：2010-06-02
申请号：EP09176770.7
申请日：2009-11-23
申请人： Nitto Denko Corporation
发明人： Hodono, Masayuki
IPC分类号： G02B6/43 , G02B6/42
CPC分类号： G02B6/42 , G02B6/4214 , G02B6/4224 , G02B6/43 , H05K1/0269 , H05K1/0274 , H05K3/303 , H05K2201/0108 , H05K2201/09918 , H05K2201/10121 , H05K2203/063 , H05K2203/166 , Y10T29/49124
摘要： An opto-electric hybrid board in which a new alignment mark having an identifying mark that is easy to recognize is formed in addition to a conventional alignment mark, and a method of manufacturing the opto-clcctric hybrid board. The opto-electric hybrid board includes an optical waveguide portion 2, an electric circuit board 1, and optical elements mounted on this electric circuit board 1. The optical waveguide portion 2 includes a translucent under cladding layer 21, a linear core 22 for an optical path, first alignment marks 24 positioned relative to end portions of this core 22, and an over cladding layer 23 for covering the above-mentioned core 22 and the first alignment marks 24. The electric circuit board 1 includes second alignment marks 15 for positioning of the optical elements and formed on a surface thereof on which the optical elements are mounted.
摘要翻译：除了常规的对准标记之外，还形成有具有易于识别的识别标记的新的对准标记的光电混合基板，以及制造光电混合基板的方法。光电混合基板包括光波导部分2，电路板1和安装在该电路板1上的光学元件。光波导部分2包括半透明下敷层21，用于光学的线性芯22 路径，相对于该芯22的端部定位的第一对准标记24以及用于覆盖上述芯22和第一对准标记24的上包层23.电路板1包括用于定位的第二对准标记15 光学元件并形成在其上安装有光学元件的表面上。

9. 发明授权

EP1788416B1 Method for manufacturing laser diode chip 有权
标题翻译：一种用于制造激光二极管芯片处理
公开(公告)号：EP1788416B1
公开(公告)日：2008-03-05
申请号：EP07004415.1
申请日：1999-09-20
申请人： LG Cable & Machinery Ltd.
发明人： Yoon, Euy Sik , Jun, Hong Jun , Shin, Ki Chul , Song, Jun Seok , Koo, Bon Jo , Lee, Ho Sung
IPC分类号： G02B6/42 , H01S5/02 , H01S5/026
CPC分类号： H01S5/02252 , G02B6/4224 , G02B6/423 , H01S5/0202 , H01S5/02284

10. 发明公开

EP1686399A1 Method for manufacturing optical member 审中-公开
标题翻译：光学元件的制造方法
公开(公告)号：EP1686399A1
公开(公告)日：2006-08-02
申请号：EP06112502.7
申请日：2002-05-02
申请人： Oki Electric Industry Co., Ltd.
发明人： Uekawa, Masahiro, Oki Electric Industry Co., Ltd. , Kotani, Kyoko, Oki Electric Industry Co., Ltd. , Sasaki, Hironori, Oki Electric Industry Co., Ltd. , Takamori, Takeshi, Oki Electric Industry Co., Ltd. , Maeno, Yoshinori, Oki Electric Industry Co., Ltd.
IPC分类号： G02B3/00 , G02B6/42 , G02B5/32 , G02B6/12
CPC分类号： G02B6/4204 , G02B3/00 , G02B3/0012 , G02B3/005 , G02B3/0075 , G02B5/32 , G02B6/1245 , G02B6/32 , G02B6/327 , G02B6/362 , G02B6/3636 , G02B6/3652 , G02B6/3676 , G02B6/3692 , G02B6/4206 , G02B6/4207 , G02B6/4221 , G02B6/4224 , G02B6/423 , G02B6/4239 , G02B6/4249 , G02B7/02 , G02B7/021 , G02B7/022 , G02B2006/12102
摘要： A method for manufacturing an optical member comprises the first step of forming a plurality of luminous flux conversion portions in the form of an array on an optical substrate and the second step of forming an edge portion along a part of the circumference of each of said luminous flux conversion portions, and a handling/supporting portion which is provided on the side of the other part of the circumference of each of said luminous flux conversion portions and is extended to connect and support at least two of said luminous flux conversion portions together along the array of said luminous flux conversion portions, whereby there is obtained an optical element aggregation provided with a plurality of said luminous flux conversion portions, edge portions corresponding to a plurality of said luminous flux conversion portions, and the handling/supporting portion connecting and supporting these together.
摘要翻译：一种光学部件的制造方法，其特征在于，包括：在光学基板上以阵列状形成多个光束转换部的第一工序;以及沿着上述发光元件的周缘的一部分形成边缘部的第二工序以及操作/支撑部分，其设置在每个所述光通量转换部分的圆周的另一部分的一侧上，并且被延伸以将所述光通量转换部分中的至少两个沿着从而获得具有多个所述光束变换部，与多个所述光束变换部对应的边缘部以及将它们连结并支承的操作支承部的光学元件集合体一起。

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