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1. 发明公开

EP3389199A1 BI-DIRECTIONAL OPTICAL SUB-ASSEMBLY 无效
公开(公告)号：EP3389199A1
公开(公告)日：2018-10-17
申请号：EP15911856.1
申请日：2015-12-30
申请人： Huawei Technologies Co., Ltd.
发明人： LI, Shu , WANG, Zelin , LI, Yuanmou
IPC分类号： H04B10/43 , G02B6/42
CPC分类号： G02B6/4246 , G02B6/42 , G02B6/4215 , G02B6/4257 , G02B6/4263 , G02B6/4277 , H04B10/40 , H04B10/43 , H04J14/02
摘要： Embodiments of the present invention provide a bidirectional optical sub assembly, to eliminate optical and electrical crosstalk between a receiver and a transmitter in the bidirectional optical sub assembly. The bidirectional optical sub assembly includes: a base, made of a conducting material and including a first part and a second part; a wavelength division multiplexing part, configured to: reflect an optical signal of a first wavelength, or transmit an optical signal of a second wavelength, where the first wavelength is different from the second wavelength; an input port, configured to transmit a first electrical signal to a transmitter; the transmitter, configured to: convert the first electrical signal into a first optical signal, and transmit the first optical signal to the wavelength division multiplexing part, where the wavelength division multiplexing part is configured to reflect the first optical signal, and the wavelength division multiplexing part is further configured to transmit a second optical signal to a receiver; the receiver, configured to: convert the second optical signal into a second electrical signal, and output the second electrical signal by using an output port; and an isolation part, configured to electromagnetically isolate the receiver from the transmitter.

2. 发明授权

EP2735899B1 OPTICAL ELEMENT MODULE, OPTICAL TRANSMISSION MODULE, AND METHOD OF MANUFACTURING OPTICAL TRANSMISSION MODULE 有权
公开(公告)号：EP2735899B1
公开(公告)日：2018-09-05
申请号：EP12814657.8
申请日：2012-07-17
申请人： Olympus Corporation
发明人： MOTOHARA, Hiroyuki
IPC分类号： G02B6/42 , H01S5/022 , G02B6/36 , H01L31/0232 , H01L33/58 , H01S5/183
CPC分类号： H01L31/02325 , A61B1/00013 , G02B6/3644 , G02B6/4202 , G02B6/4239 , G02B6/4257 , H01L33/58 , H01L2224/13 , H01L2224/45144 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H01S5/02252 , H01S5/02284 , H01S5/183 , H01L2924/00014 , H01L2924/00
摘要： Provided are an optical element module, an optical transmission module, and a method of manufacturing the optical transmission module that allow a high-speed signal transmission between an imaging device with a high pixel number and a signal processing device, and achieve miniaturization. The optical element module 50 of the invention includes a surface emitting laser 2 for outputting an optical signal, a board 1 on which the surface emitting laser 2 is mounted, and a guide holding member 3 that has a through hole 15 into which an optical fiber is configured to be inserted for inputting the optical signal from the surface emitting laser 2, and is mounted and arranged to be aligned with the surface emitting laser 2 in a thickness direction of the board 1. The through hole 15 has a cylindrical shape and has substantially the same diameter as an outer diameter of the optical fiber.

3. 发明公开

EP3335063A1 SELF-ASSEMBLED VERTICALLY ALIGNED MULTI-CHIP MODULE 审中-实审
公开(公告)号：EP3335063A1
公开(公告)日：2018-06-20
申请号：EP16760588.0
申请日：2016-08-08
申请人： Oracle International Corporation
发明人： SHUBIN, Ivan , ZHENG, Xuezhe , LEE, Jin Hyoung , RAJ, Kannan , KRISHNAMOORTHY, Ashok V.
IPC分类号： G02B6/42 , G02B6/12 , H01S5/30
CPC分类号： G02B6/13 , G02B6/12 , G02B6/4228 , G02B6/4239 , G02B6/4257 , G02B6/43 , G02B2006/12061 , H01L33/58 , H01S5/3013
摘要： A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.

4. 发明公开

EP3309595A1 SUPPORT FOR OPTICAL ELEMENT AND IMAGE DRAWING APPARATUS 审中-公开
标题翻译：支持光学元件和图像绘图设备
公开(公告)号：EP3309595A1
公开(公告)日：2018-04-18
申请号：EP17193299.9
申请日：2017-09-26
申请人： Hitachi-LG Data Storage, Inc.
发明人： OCHI, Manabu , YAMASAKI, Tatsuya , KAZAMA, Atsushi , ICHIKAWA, Fumihito
IPC分类号： G02B7/182
CPC分类号： G02B26/12 , G02B6/4257 , G02B7/182 , G02B26/0825 , G02B26/0883
摘要： A support structure for an optical element in which a variation in mounting posture is suppressed irrespective of an error in external dimensions of the optical element is provided, and an image drawing apparatus with less color irregularity is provided.
[Solving Means] A housing formed with a first holding surface contact-holding a first surface of an optical element and a second holding surface contact-holding at least a portion of a ridge line separated from the first surface of the optical element, a first pressing member which presses the optical element toward the first holding surface, and a second pressing member which presses the optical element toward the second holding surface are provided, wherein an intersection angle of extrapolation surfaces obtained by extrapolating and extending the first and second holding surfaces is an acute angle, and wherein a first pressing position at which the first pressing member exerts a pressing force on the optical element is closer to the second holding surface than to a center of the optical element, and a second pressing position at which the second pressing member exerts a pressing force on the optical element is a position farther separated from the first holding surface than from the center of the optical element.
摘要翻译：本发明提供一种光学元件的支撑结构，其不论光学元件的外形尺寸的误差如何都能够抑制安装姿势的变化，并且提供色彩不规则性较小的图像描绘装置。 [解决手段]一种外壳，其形成有：第一保持表面，其与光学元件的第一表面接触并且第二保持表面与光学元件的第一表面分离的至少一部分棱线接触;第一设置有将所述光学元件向所述第一保持面按压的按压部件和将所述光学元件向所述第二保持面按压的第二按压部件，所述第一保持面和所述第二保持面外插延长而得到的外插面的交叉角度为所述第一按压部件对所述光学元件施加按压力的第一按压位置与所述光学元件的中心相比更靠近所述第二保持面，所述第二按压位置与所述第二按压位置相反，对光学元件施加按压力的位置是与第一保持面相比离开第一保持面更远的位置光学元件的中心。

5. 发明授权

EP3043197B1 TRÄGERSYSTEM FÜR FUNKTIONSELEMENTE DER MIKROTECHNIK 有权
标题翻译：微电子技术功能元件载体系统
公开(公告)号：EP3043197B1
公开(公告)日：2018-04-18
申请号：EP15201488.2
申请日：2015-12-21
申请人： Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. , Technische Universität Berlin
发明人： Schröder, Henning , Arndt-Staufenbiel, Norbert , Marx, Sebastian , Böttger, Gunnar
IPC分类号： G02B6/42 , G02B7/00 , G01M11/04 , G02B6/36
CPC分类号： G02B6/3648 , G02B6/00 , G02B6/4201 , G02B6/4219 , G02B6/4228 , G02B6/4257 , G02B7/00 , G02B7/003

6. 发明公开

EP3018509A4 OPTICAL MODULE, OPTICAL MODULE MOUNTING METHOD, OPTICAL MODULE-MOUNTED CIRCUIT SUBSTRATE, OPTICAL MODULE EVALUATION KIT SYSTEM, CIRCUIT SUBSTRATE AND COMMUNICATION SYSTEM 审中-公开
标题翻译：用于光模块的光模块的光模块装配工艺安装的电路衬底检测试剂盒SYSTEM FOR光模块，电路基板和通信系统
公开(公告)号：EP3018509A4
公开(公告)日：2017-03-15
申请号：EP13888578
申请日：2013-07-05
申请人： FURUKAWA ELECTRIC CO LTD
发明人： NEKADO YOSHINOBU , ISHIKAWA YOZO , NISHIMURA NAOYA , UEMURA TOSHINORI , NASU HIDEYUKI
IPC分类号： G02B6/122 , G02B6/42
CPC分类号： G02B6/325 , G02B6/30 , G02B6/32 , G02B6/4204 , G02B6/421 , G02B6/423 , G02B6/4231 , G02B6/4232 , G02B6/4239 , G02B6/4244 , G02B6/4249 , G02B6/4257 , G02B6/428 , G02B6/4292 , G02B6/4293 , H05K1/0269 , H05K1/0274 , H05K1/141 , H05K1/181 , H05K3/368 , H05K2201/09918 , H05K2201/10106 , H05K2203/0195
摘要： An optical module (100) includes a housing (10) including an internal space (14) that has an opening in a substrate mounting surface (12a), an element mounting surface (11a) that forms a portion of an inner surface of the internal space, and a waveguide introduction opening (15) that is formed in a side surface intersecting the substrate mounting surface and is opened to the opening of the substrate mounting surface and communicated with the internal space, an optical element (20) that is mounted on the element mounting surface, and an electronic element (30) that is mounted on the element mounting surface and is connected to the optical element. When the substrate mounting surface is mounted on a circuit substrate (200), an optical waveguide (210) that protrudes from a surface of the circuit substrate is introduced into the internal space through the waveguide introduction opening.

7. 发明公开

EP2980621A4 OPTICAL CONNECTOR 有权
标题翻译：光连接器
公开(公告)号：EP2980621A4
公开(公告)日：2016-11-16
申请号：EP14774118
申请日：2014-03-24
申请人： OPTICIS CO LTD
发明人： KIM HEE DAE , LEE HYUN SIK
IPC分类号： G02B6/42 , G02B6/43
CPC分类号： G02B6/4292 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4246 , G02B6/4249 , G02B6/4255 , G02B6/4257 , G02B6/43
摘要： An optical connector is provided. The optical connector includes: an optical fiber line fixing block including an insertion groove in which an end portion of an optical fiber line is inserted; and a submount including first guide-walls determining a position of the optical fiber line fixing block and second guide-walls determining a position of an optical device to be connected to the optical fiber line, wherein the optical fiber line fixing block and the optical device are automatically aligned by the first guide-walls and the second guide-walls.

8. 发明授权

EP2391916B1 MICROMECHANICALLY ALIGNED OPTICAL ASSEMBLY 有权
标题翻译： MICRO机械对准的光学安排
公开(公告)号：EP2391916B1
公开(公告)日：2016-09-14
申请号：EP10736546.2
申请日：2010-02-01
申请人： Kaiam Corp.
发明人： PEZESHKI, Bardia , HEANUE, John
IPC分类号： G02B6/42 , G02B6/32 , G02B6/35
CPC分类号： G02B6/4226 , G02B6/32 , G02B6/3598 , G02B6/4207 , G02B6/4214 , G02B6/4215 , G02B6/4225 , G02B6/4238 , G02B6/4239 , G02B6/4244 , G02B6/4249 , G02B6/4257 , Y10T29/49778 , Y10T29/49902
摘要： An optical assembly includes a combination of laser sources emitting radiation, focused by a combination of lenses into optical waveguides. The optical waveguide and the laser source are permanently attached to a common carrier, while at least one of the lenses is attached to a holder that is an integral part of the carrier, but is free to move initially. Micromechanical techniques are used to adjust the position of the lens and holder, and then fix the holder it into place permanently using integrated heaters with solder.

9. 发明公开

EP2937897A3 DEVICE PACKAGE AND METHODS FOR THE FABRICATION AND TESTING THEREOF 审中-公开
标题翻译： VORFAHUNG SPAKET UND VERFAHREN ZUR HERSTELLUNG UNDPRÜFUNGDAVON
公开(公告)号：EP2937897A3
公开(公告)日：2016-03-23
申请号：EP15171706.3
申请日：2004-09-13
申请人： Nuvotronics LLC
发明人： Sherrer, David W , Rasnake, Larry J , Fisher, John J
IPC分类号： H01L21/768 , H01L23/522 , G02B6/42
CPC分类号： G02B6/4248 , G01B11/16 , G01B11/26 , G02B6/3692 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4244 , G02B6/4257 , G02B6/4271 , G02B6/4292 , H01L23/481 , H01L2924/0002 , H01S5/0014 , H01S5/022 , H01S5/02208 , H01S5/02216 , H01S5/0222 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02288 , H01S5/02415 , H01S5/02469 , H01S5/0683 , H01L2924/00012 , H01L2924/00
摘要： Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b) forming a layer on the first surface of the substrate; (c) etching a via hole through the substrate from the second surface to the layer, the via hole having a first perimeter at the first surface; (d) forming an aperture in the layer, wherein the aperture has a second perimeter within the first perimeter; and (e) providing a conductive structure for sealing the via structure. Also provided are sealed via structures, methods of detecting leakage in a sealed device package, sealed device packages, device packages containing cooling structures, and methods of bonding a first component to a second component.
摘要翻译：提供的是光电器件封装。封装包括在基底基板的表面上具有光电子器件安装区域的基底基板和盖安装区域。光电器件安装在光电器件安装区域上。盖子安装在盖安装区域上以在基底基板和盖子之间形成封闭的容积。光电子器件处于封闭容积。盖具有适于将光给定波长的光沿着光路传送到光电器件或从光电子器件传输的光学透射区域，其中盖安装区域的至少一部分沿着基底衬底表面下方的光路设置，光路下方的深度。还提供了晶片或栅格级光电子器件封装，晶片或栅格级光电器件封装盖及其形成方法和连接的光电子器件。

10. 发明授权

EP1517166B1 Device package and methods for the fabrication and testing thereof 有权
标题翻译：设备壳体和方法的那些测试和制造
公开(公告)号：EP1517166B1
公开(公告)日：2015-10-21
申请号：EP04255516.9
申请日：2004-09-13
申请人： Nuvotronics, LLC
发明人： Sherrer, David W. , Rasnake, Larry J. , Fisher, John J.
IPC分类号： G02B6/42 , H01L33/00
CPC分类号： G02B6/4248 , G01B11/16 , G01B11/26 , G02B6/3692 , G02B6/4201 , G02B6/4204 , G02B6/4206 , G02B6/421 , G02B6/4214 , G02B6/423 , G02B6/4239 , G02B6/4243 , G02B6/4244 , G02B6/4257 , G02B6/4271 , G02B6/4292 , H01L23/481 , H01L2924/0002 , H01S5/0014 , H01S5/022 , H01S5/02208 , H01S5/02216 , H01S5/0222 , H01S5/02252 , H01S5/02272 , H01S5/02284 , H01S5/02288 , H01S5/02415 , H01S5/02469 , H01S5/0683 , H01L2924/00012 , H01L2924/00
摘要： Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting region. A lid is mounted on the lid mounting region to form an enclosed volume between the base substrate and the lid. The optoelectronic device is in the enclosed volume. The lid has an optically transmissive region suitable for transmitting light of a given wavelength along an optical path to or from the optoelectronic device, wherein at least a portion of the lid mounting region is disposed along the optical path below the surface of the base substrate to a depth below the optical path. Also provided are wafer or grid level optoelectronic device packages, wafer- or grid-level optoelectronic device package lid and their methods of formation, and connectorized optoelectronic devices.

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