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1. 发明公开

EP3224631A1 VERFAHREN ZUR BESTIMMUNG EINER ALTERUNG VON LEISTUNGSHALBLEITERMODULEN SOWIE VORRICHTUNG UND SCHALTUNGSANORDNUNG 有权
公开(公告)号：EP3224631A1
公开(公告)日：2017-10-04
申请号：EP15821054.2
申请日：2015-12-18
申请人： Siemens Aktiengesellschaft
发明人： BUTRON-CCOA, Jimmy Alexander , LINDEMANN, Andreas , MITIC, Gerhard
IPC分类号： G01R31/26 , G01K7/01 , H02M1/32
CPC分类号： G01R31/2619 , G01K3/10 , G01K7/01 , G01R31/046 , G01R31/2628 , G01R31/2642 , H02M2001/327 , H03K2017/0806
摘要： The invention relates to a method for characterizing a power semiconductor module (1), which has at least one power semiconductor component (2), comprising the following steps: determining a thermal model (4) of the power semiconductor module (1) at a reference time point; detecting a reference temperature (T
j,zth ) on the basis of the thermal model (4) of the power semiconductor module (1); measuring at least one temperature-sensitive electrical parameter (TSEP) of the power semiconductor module (1) at at least one time point which is later than the reference time point during operation of the power semiconductor module (1); detecting a current temperature (T
j,tsep ) of the power semiconductor module (1) from the at least one measured temperature-sensitive electrical parameter (TSEP) of the power semiconductor module (1); detecting a temperature difference (ΔΤ) between the current temperature (T
j,tsep) ) and the reference temperature (T
j,zth ); and determining a deterioration of the power semiconductor module (1) on the basis of the detected temperature difference (ΔΤ).
摘要翻译：本发明涉及一种用于表征具有至少一个功率半导体部件（2）的功率半导体模块（1）的方法，包括以下步骤：确定功率半导体模块（1）的热模型（4）参考时间点; 基于功率半导体模块（1）的热模型（4）检测参考温度（Tj，zth）; 在所述功率半导体模块（1）的操作期间，在比所述参考时间点晚的至少一个时间点处测量所述功率半导体模块（1）的至少一个温度敏感电参数（TSEP）; 从所述功率半导体模块（1）的所述至少一个测得的温度敏感电参数（TSEP）中检测所述功率半导体模块（1）的当前温度（Tj，tsep）; 检测当前温度（Tj，tsep））和参考温度（Tj，zth）之间的温度差（ΔT）; 以及基于检测到的温度差（ΔT）确定功率半导体模块（1）的劣化。

2. 发明公开

EP2661162A3 Equipment provided with one or more plug-in units 审中-公开
标题翻译：提供一个或多个插件的设备
公开(公告)号：EP2661162A3
公开(公告)日：2017-05-17
申请号：EP13162249.0
申请日：2013-04-04
申请人： Coriant Oy
发明人： Holma, Antti , Laamanen, Heikki , Kohonen, Petri , Leiman, Ian
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： G01R31/041 , G01R31/04 , G01R31/043 , G01R31/045 , G01R31/046 , H05K7/1414 , H05K7/1498 , H05K7/186
摘要： Equipment comprising at least one plug-in unit and a body device for receiving the plug-in unit is presented. The plug-in unit comprises an electrically conductive structure (121, 122, 123) having at least one surface area capable of forming a capacitive coupling with a surface area of an electrically conductive part (130, 131) of the body device when the plug-in unit is inserted in the body device. The equipment further comprises a monitoring circuit (124) for generating a signal indicative of electrical properties of a measurement circuit comprising the capacitive coupling and at least one galvanic contact provided by electrical connectors of the plug-in unit and the body device. The generated signal is also indicative of correctness of the installation of the plug-in unit. Thus, the correct installation of the plug-in unit can be electrically indicated and monitored.
摘要翻译：提出了包括至少一个插入单元和用于接收插入单元的本体装置的设备。插入单元包括具有至少一个表面区域的导电结构（121,122,123），该表面区域能够形成与主体装置的导电部分（130,131）的表面区域的电容耦合，单元插入身体设备。该设备还包括监测电路（124），用于生成指示测量电路的电特性的信号，该测量电路包括电容耦合和由插入单元和身体设备的电连接器提供的至少一个电流接触。产生的信号也表示插入单元安装的正确性。因此，插件的正确安装可以电气指示和监控。

3. 发明授权

EP2555006B1 Semiconductor device 有权转让
公开(公告)号：EP2555006B1
公开(公告)日：2016-07-27
申请号：EP12157652.4
申请日：2012-03-01
申请人： Samsung Display Co., Ltd.
发明人： Yeo, Dong-Hyun , Kim, Yong-Bum , Jeon, Byung-Kil , Jun, Bong-Ju
IPC分类号： G01R31/04
CPC分类号： G01R31/046 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014

4. 发明公开

EP2661162A2 Equipment provided with one or more plug-in units 审中-公开
标题翻译： Gerätmit einer oder mehreren Plugin-Einheiten
公开(公告)号：EP2661162A2
公开(公告)日：2013-11-06
申请号：EP13162249.0
申请日：2013-04-04
申请人： Tellabs Oy
发明人： Holma, Antti , Laamanen, Heikki , Kohonen, Petri , Leiman, Ian
IPC分类号： H05K7/14 , H05K7/18
CPC分类号： G01R31/041 , G01R31/04 , G01R31/043 , G01R31/045 , G01R31/046 , H05K7/1414 , H05K7/1498 , H05K7/186
摘要： Equipment comprising at least one plug-in unit and a body device for receiving the plug-in unit is presented. The plug-in unit comprises an electrically conductive structure (121, 122, 123) having at least one surface area capable of forming a capacitive coupling with a surface area of an electrically conductive part (130, 131) of the body device when the plug-in unit is inserted in the body device. The equipment further comprises a monitoring circuit (124) for generating a signal indicative of electrical properties of a measurement circuit comprising the capacitive coupling and at least one galvanic contact provided by electrical connectors of the plug-in unit and the body device. The generated signal is also indicative of correctness of the installation of the plug-in unit. Thus, the correct installation of the plug-in unit can be electrically indicated and monitored.
摘要翻译：提供了包括至少一个插入单元和用于接收插件单元的主体装置的设备。插入单元包括导电结构（121,122,123），该导电结构具有至少一个表面区域，该表面区域能够在主体装置的导电部件（130,131）的表面积形成电容耦合时， - 单元插入身体装置。该设备还包括监视电路（124），用于产生指示包括电容耦合的测量电路的电特性的信号以及由插入单元和主体设备的电连接器提供的至少一个电流接触。生成的信号也表示插件单元的安装的正确性。因此，可以电指示和监视插件单元的正确安装。

6. 发明公开

EP1642484A1 TESTING OF INTERCONNECTIONS BETWEEN STACKED CIRCUIT BOARDS 审中-公开
标题翻译：测试连接STACKED板之间
公开(公告)号：EP1642484A1
公开(公告)日：2006-04-05
申请号：EP03738850.1
申请日：2003-07-07
申请人： TELEFONAKTIEBOLAGET LM ERICSSON (publ)
发明人： NILSSON, Mattias , JOHANSSON, Stefan
IPC分类号： H05K3/36 , H05K3/40
CPC分类号： H05K3/368 , G01R31/046 , H05K1/0268 , H05K1/117 , H05K3/325 , H05K3/4614 , H05K2201/10348 , H05K2201/10378 , H05K2203/162
摘要： A retainer board (25, 27, 28) having at least one hole (10) in which a wire button contact (5) is inserted, wherein the hole (10) is plated and at least one conductor (20) is connected to the plated hole for providing outside access. Moreover a method for testing stacked circuit boards are disclosed comprising the steps of detachably arranging at least two circuits boards (11, 12, 29), testing the individual functionality of the circuit boards (11, 12) and if approved, assembling the circuit boards (11, 12) and the first retainer board (25, 27, 28), and asserting whether the overall functionality of the arrangement is approved.

7. 发明公开

EP1288668A3 System and method for testing electronic device interconnections 审中-公开
标题翻译：装置和方法，用于测试电子电路的连接
公开(公告)号：EP1288668A3
公开(公告)日：2003-12-17
申请号：EP02255349.9
申请日：2002-07-31
申请人： Agilent Technologies, Inc.
发明人： Bohn, David D.
IPC分类号： G01R31/30 , G01R31/316
CPC分类号： G01R31/046
摘要： A system and method of testing the quality of electronic device interconnections uses a pressure-sensitive medium. The interconnections of an electronic device are placed in contact with the pressure-sensitive medium. Force is then applied to the device so that an indication of the pressure exerted by each interconnection is produced by the pressure-sensitive medium. The indication of the pressure exerted by each interconnection is then analyzed to determine the quality of the connections of the electronic device.

8. 发明公开

EP1288668A2 System and method for testing electronic device interconnections 审中-公开
标题翻译： Anordnung und Verfahren zurPrüfungvon elektronischen Schaltungsverbindungen
公开(公告)号：EP1288668A2
公开(公告)日：2003-03-05
申请号：EP02255349.9
申请日：2002-07-31
申请人： Agilent Technologies, Inc.
发明人： Bohn, David D.
IPC分类号： G01R31/30
CPC分类号： G01R31/046
摘要： A system and method of testing the quality of electronic device interconnections uses a pressure-sensitive medium. The interconnections of an electronic device are placed in contact with the pressure-sensitive medium. Force is then applied to the device so that an indication of the pressure exerted by each interconnection is produced by the pressure-sensitive medium. The indication of the pressure exerted by each interconnection is then analyzed to determine the quality of the connections of the electronic device.
摘要翻译：测试电子设备互连质量的系统和方法使用压敏介质。将电子设备的互连放置成与压敏介质接触。然后将力施加到装置，使得由每个互连施加的压力的指示由压敏介质产生。然后分析由每个互连施加的压力的指示，以确定电子设备的连接的质量。

9. 发明公开

EP1209476A1 Electronic device and manufacturing method thereof 审中-公开
标题翻译： ElektronischesGerätundzugehörigesHerstellungsverfahren
公开(公告)号：EP1209476A1
公开(公告)日：2002-05-29
申请号：EP01307985.0
申请日：2001-09-19
申请人： Seiko Instruments Inc.
发明人： Kato, Kazuo
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2829 , G01R31/046
摘要： To precisely determine easily a disconnection failure in bonding connection of a flip coil of a magnetic sensor. A wiring pattern (Pb2) for connecting a +FL terminal (10a) of an X-axis sensor (10) and a wiring pattern (Pb1) for connecting a +FL terminal (20a) of a Y-axis sensor (20) are arranged on a circuit wiring board. The -FL terminals (10b,20b) of the sensors (10,20) are connected by a wiring pattern (Pb3) on the circuit wiring board. After MOS transistors (Pch MOS Tr 80,Nch MOS Tr 90) are mounted on the board, the wiring patterns (Pb1 and Pb2) are connected to each other by wiring in the MOS transistors. The MOS transistors are mounted on the circuit wiring board so that a flip coil of the X-axis sensor and a flip coil of the Y-axis sensor are connected in parallel with each other. Before the MOS transistors are mounted on the circuit wiring board, the resistance of each of the flip coils is measured. The disconnection failure in bonding connection of the flip coils can be inspected by using the fact that the difference between a measured value in a case of good bonding connection and that in a case of bad bonding connection is large.
摘要翻译：为了精确地确定磁传感器的翻转线圈的接合连接中的断开故障。用于连接X轴传感器（10）的+ FL端子（10a）和用于连接Y轴传感器（20）的+ FL端子（20a）的布线图案（Pb1）的布线图案（Pb2）布置在电路布线板上。传感器（10,20）的-FL端子（10b，20b）通过电路布线板上的布线图案（Pb3）连接。在MOS晶体管（Pch MOS Tr 80，Nch MOS Tr 90）安装在电路板上之后，布线图案（Pb1和Pb2）通过MOS晶体管中的布线彼此连接。 MOS晶体管安装在电路布线板上，使得X轴传感器的翻转线圈和Y轴传感器的翻转线圈彼此并联连接。在MOS晶体管安装在电路布线板上之前，测量每个翻转线圈的电阻。可以通过使用在良好的接合连接的情况下的测量值与不良接合连接的情况下的差异大的事实来检查翻转线圈的接合连接中的断开故障。

10. 发明公开

EP1181566A1 TESTING FASTENINGS OF PRINTED CIRCUIT BOARD 有权
标题翻译：电路板安装测试方法
公开(公告)号：EP1181566A1
公开(公告)日：2002-02-27
申请号：EP00906392.6
申请日：2000-02-21
申请人： Nokia Networks Oy
发明人： PINOLA, Timo
IPC分类号： G01R31/04
CPC分类号： G01R31/046 , H05K1/0268 , H05K1/111 , H05K3/3421
摘要： The invention relates to a method comprising supplying a test signal to a first pad part of the pad (200); measuring the occurrence of the test signal through a second pad part of the pad (200) or a part of the printed circuit board (100) connected to the second pad part, which second pad part is separate from the first pad part, and the leg (104) of the connector is fastened both to the first pad part and to the second pad part during the manufacturing process in order to establish a connection between the pad parts (112, 114) through the leg (104). The invention further relates to a printed circuit board (100) comprising: at least one pad (200) connectable to a test device (118); at least one connector (102) comprising at least one leg (104) fastened to the pad. The pad (200) comprises at least two separate pad parts (112, 114), i.e. a first and a second pad part, and the test device (118) is connectable to at least one pad part. The leg (104) of the connector is fastened both to the first pad part and to the second pad part in order to establish a connection between the pad parts (112, 114) through the leg (104).

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