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    • 2. 发明公开
    • LOOP TYPE THERMO SIPHON, STIRLING COOLING CHAMBER, AND COOLING APPARATUS
    • 辣椒酱,炖肉 - KÜHLKAMMER,KÜHLVORRICHTUNGMIT GESCHLOSSENEM KREISLAUF
    • EP1669710A1
    • 2006-06-14
    • EP04771575.0
    • 2004-08-12
    • SHARP KABUSHIKI KAISHA
    • CHEN, Wei; 606, Kurearu KITANO, 2-16,
    • F28D15/02F28D1/047F25D11/00
    • F28D15/0266F25B9/14F25B23/006F25B25/00F25B2500/01F25D11/00F25D2317/0682F28D2015/0216
    • A loop thermosyphon (100A) includes a closed circuit configured of an evaporator (110), a condenser (130A), a feed pipe (120) and a return pipe (140), and the evaporator (130A) is an assembly including a header pipe (131) associated with the feed pipe, a header pipe (132) associated with the return pipe, and a plurality of aligned pipes. Each of the aligned pipes is a portion condensing a working fluid evaporated and is a serpentine tube defined by a linear portion forming a plurality of stages in vertically parallel layers, and a curved portion connecting such linear portions together. The condenser (130A) in the form of an assembly is entirely inclined relative to a bottom surface (301) of a casing (300) mounting the loop thermosyphon (100A) such that the serpentine tube's linear portions have a bottommost linear portion inclined in a direction allowing the bottommost linear portion to be closer to the bottom surface (301) of the casing (300) as the bottommost linear portion approaches the header pipe (131) associated with the return pipe. The loop thermosyphon's defective operation attributed to disposition can be reduced.
    • 循环热虹吸管(100A)包括由蒸发器(110),冷凝器(130A),进料管(120)和返回管(140)构成的闭合回路,并且蒸发器(130A)是包括集管 与进料管相关联的管道(131),与返回管道相关联的集管(132)和多个排列的管道。 每个对准的管是将蒸发的工作流体冷凝的部分,并且是由在垂直平行的层中形成多个级的线性部分限定的蛇形管,以及将这些线性部分连接在一起的弯曲部分。 组件形式的冷凝器(130A)相对于安装环形热虹吸管(100A)的壳体(300)的底表面(301)完全倾斜,使得蛇形管的线性部分具有倾斜于 当最下面的直线部分靠近与返回管相关联的总管(131)时,允许最底部线性部分更靠近壳体(300)的底表面(301)。 可以减少归因于配置的循环热虹吸管的缺陷操作。
    • 3. 发明公开
    • ORIENTATION-INDEPENDENT THERMOSYPHON HEAT SPREADER
    • 取向独立的热丝散热器
    • EP1379825A2
    • 2004-01-14
    • EP02733928.2
    • 2002-04-03
    • University of Maryland, College Park
    • JOSHI, YogendraMURTHY, Sunil, S.NAKAYAMA, Wataru
    • F28D15/00
    • H01L23/427F28D15/0233F28D15/0266F28D2015/0216F28F13/187H01L2924/0002H01L2924/00
    • Device for enhancing cooling of electronic circuit components that is substantially or fully independent of orientation. A thin profile thermosyphon heat spreader (20) mounted to an electronics package comprises a central evaporator (28) in hydraulic communication with a peripheral condenser (30), both at least partially filled with liquid coolant. A very high effective thermal conductivity results. Performance is optimized by keeping the evaporator (28) substantially full at all orientations while leaving a void for accumulation of vapor in the condenser (30). A cover plate (24) and a parallel base plate (22) of generally similar dimension form the evaporator (28) and condenser (30). Optionally, an opening in the base plate (22) is sealed against the electronics package and places the heat-dissipating component in direct contact with the liquid coolant. Alternatively, the base plate (22) may be formed with the electronics package from a single piece of material. A boiling enhancement structure (34)is provided in the evaporator (30) to encourage vapor bubble nucleation.
    • 用于增强基本上或完全独立于取向的电子电路组件冷却的装置。 安装到电子组件的薄型热虹吸散热器(20)包括与外围冷凝器(30)液压连通的中央蒸发器(28),两者至少部分地填充有液体冷却剂。 导致非常高的有效导热率。 通过保持蒸发器(28)在所有取向基本满的同时留下空间用于蒸气在冷凝器(30)中的积聚来优化性能。 大致类似尺寸的盖板(24)和平行底板(22)形成蒸发器(28)和冷凝器(30)。 可选地,底板(22)中的开口相对于电子装置封装被密封并且使散热部件与液体冷却剂直接接触。 或者,底板(22)可以由单件材料形成电子封装。 在蒸发器(30)中提供沸腾增强结构(34)以促进气泡成核。
    • 4. 发明公开
    • Cooling apparatus using boiling and condensing refrigerant
    • 使用沸腾和冷凝制冷剂的冷却装置
    • EP0969261A2
    • 2000-01-05
    • EP99111978.5
    • 1999-06-28
    • Denso Corporation
    • Osakabe, HiroyukiKamiya, KunihiroOhara, Takahide
    • F28D15/02
    • F28D15/0233F28D15/0266F28D2015/0216F28F1/126F28F3/025F28F3/027
    • This cooling apparatus can improve a radiation performance by increasing the boiling area and make it difficult to cause the burnout on boiling faces by filling the boiling faces with a refrigerant necessary for the boiling. In refrigerant chambers (108) for reserving a refrigerant, there are inserted corrugated fins (112) for increasing the boiling area. These corrugated fins are composed of lower corrugated fins (112A) arranged to correspond to the lower sides of the boiling faces for receiving the heat of a heating body, and upper corrugated fins (112B) arranged to correspond to the upper sides of the boiling faces, and these lower and upper corrugated fins are individually held in thermal contact with the boiling faces of the refrigerant chambers. The lower corrugated fins and the upper corrugated fins are given a common fin pitch P and are individually inserted vertically in the individual refrigerant chambers to define the individual passages further into a plurality of small passage portions. However, the lower corrugated fins and the upper corrugated fins are inserted such that their crests and valleys are staggered from each other in the transverse direction of the refrigerant chambers.
    • 该冷却装置可以通过增加沸腾面积来提高辐射性能,并且通过用煮沸所需的制冷剂填充沸腾面使得难以在沸腾面上引起燃尽。 在用于储存制冷剂的制冷剂室(108)中插入用于增加沸腾面积的波纹翅片(112)。 这些波纹翅片由布置成对应于用于接收加热体的热量的沸腾面的下侧布置的下波纹翅片(112A)和布置成对应于沸腾面的上侧的上波纹翅片(112B) ,并且这些下波纹翅片和上波纹翅片分别保持与制冷剂室的沸腾面热接触。 下部波纹翅片和上部波纹翅片具有共同的翅片间距P并且分别竖直地插入各个制冷剂室中以将单独通道限定成进一步进入多个小通道部分。 然而,下部波纹翅片和上部波纹翅片被插入,使得它们的波峰和波谷在制冷剂室的横向方向上彼此交错。
    • 6. 发明公开
    • SEMICONDUCTOR REFRIGERATOR
    • 半导体冰箱
    • EP3220081A1
    • 2017-09-20
    • EP15869100.6
    • 2015-09-28
    • Qingdao Haier Joint Stock Co., Ltd
    • TAO, HaiboYU, DongLI, PengLIU, JianruWANG, DingyuanLI, ChunyangQI, FeifeiJI, Lisheng
    • F25D19/00
    • F25D16/00F25B21/02F25B2321/0251F25B2321/0252F25D11/00F25D19/006F25D23/066F28D15/0233F28D15/0275F28D2015/0216
    • A semiconductor refrigerator comprises a liner (100), at least one semiconductor refrigerating sheet and a plurality of cold-end heat exchanging devices (200). Each cold-end heat exchanging device (200) is configured to allow a refrigerant to flow and perform phase-change heat exchange in the cold-end heat exchanging device (200), so as to transfer cold at a cold end of the at least one semiconductor refrigerating sheet to a storage chamber of the liner (100). Each cold-end heat exchanging device (200) is provided with three refrigerant pipelines (20), each refrigerant pipeline (20) is provided with an evaporating segment (21) with a closed end that is bent and extended downwards in a vertical plane, and evaporating segments (21) of the three refrigerant pipelines (20) of each cold-end heat exchanging device (200) are respectively connected to a rear wall and two side walls of the liner (100) in a thermal manner. Because the plurality of cold-end heat exchanging devices (200) is provided, an effective heat exchange area of a thermal connection to the liner (100) of the refrigerator is enlarged significantly, and therefore energy efficiency of the semiconductor refrigerator is improved significantly.
    • 半导体致冷器包括衬里(100),至少一个半导体致冷片和多个冷端热交换装置(200)。 每个冷端热交换装置(200)构造成允许制冷剂流动并且在冷端热交换装置(200)中执行相变热交换,从而在至少一个冷端热交换装置 一个半导体制冷片连接到衬里(100)的储存室。 每个冷端热交换装置200设有三条制冷剂管道20,每条制冷剂管道20设有蒸发段21, 并且每个冷端热交换装置(200)的三个制冷剂管道(20)的蒸发段(21)分别以热方式连接到衬里(100)的后壁和两个侧壁。 由于设置了多个冷端热交换装置(200),与冰箱的衬里(100)的热连接的有效热交换面积显着增大,因此半导体致冷器的能量效率显着提高。
    • 7. 发明公开
    • PASSIVER ZWEIPHASEN-KÜHLKREISLAUF
    • EP3120090A1
    • 2017-01-25
    • EP15713401
    • 2015-03-17
    • AREVA GMBH
    • FUCHS THOMASORNOT LEORECK MARKUSREUTER MATTHIAS
    • F25B23/00
    • F28D15/0266F25B23/006F28D15/025F28D2015/0216F28F19/00F28F2230/00F28F2265/12F28F2265/30
    • The invention relates to a passive two-phase cooling circuit (2) with an evaporator (6) and a condenser (18) for a coolant which is conducted in the cooling circuit (2). An evaporator supply line (4) and an evaporator discharge line (10) are connected to the evaporator (6), and a condenser supply line (16) and a condenser discharge line (22) are connected to the condenser (18). Such a cooling circuit is to be developed such that pressure peaks are reduced or even completely prevented during operation while keeping the system design simple and inexpensive. According to the invention, this is achieved in that the evaporator supply line (4), the evaporator discharge line (10), the condenser supply line (16), and the condenser discharge line (22) are connected to a common damping container (24). A liquid column (52) is formed in the condenser discharge line (22) during the operation of the cooling circuit (2), said liquid column assuming the function of a liquid seal (50) and the function of a fluid-dynamic vibration damper.
    • 无源两相冷却回路包括蒸发器和用于在冷却回路中传导的冷却剂的冷凝器。 蒸发器供应管线和蒸发器排放管线连接到蒸发器,并且冷凝器供应管线和冷凝器排出管线连接到冷凝器。 冷却回路具有简单且成本有效的结构,其通过将蒸发器供应管线,蒸发器排放管线,冷凝器供应管线和冷凝器排出管线连接到公共阻尼容器来减少或甚至完全防止在操作期间的压力冲击。 在冷却回路运行期间,在冷凝器排出管路中形成液柱,并且柱体具有液密密封件和流体动力减震器的功能。
    • 8. 发明公开
    • COOLING SYSTEM AND ELECTRONIC APPARATUS
    • ELEKTRONISCHE VORRICHTUNG的KÜHLSYSTEM
    • EP3089571A1
    • 2016-11-02
    • EP14873921.2
    • 2014-12-02
    • NEC Platforms, Ltd.
    • NAKAMURA, YasuhitoFUJII, Shunsuke
    • H05K7/20G06F1/20
    • F28D15/0266F28D15/0208F28D15/0241F28D15/06F28D2015/0216F28F2265/12G06F1/20H05K7/20318H05K7/20818
    • To prevent lowering of cooling efficiency of a cooling system that uses a refrigerant. A cooling system S3 is provided with: an evaporator 3, which includes a tubing inlet 17, and which absorbs heat radiated from a server rack 1 using a refrigerant; a heat exchanger 13, which includes a tubing inlet 19 at a higher position than the tubing inlet 17, and which cools the refrigerant; a bendable flexible pipe 10, which is connected to the tubing inlet 17 and the tubing inlet 19, and which serves as a flow path for the refrigerant; and a platform 12, which has a surface which is sloped higher at one end portion than another end portion, and wherein the flexible pipe 10 is placed on said surface so as to be positioned higher at the side to which the tubing inlet 19 is connected than the side to which the tubing inlet 17 is connected.
    • 为了防止降低使用制冷剂的冷却系统的冷却效率。 冷却系统S3设有:蒸发器3,其包括管道入口17,并且使用制冷剂吸收从服务器架1辐射的热量; 热交换器13,其包括在比管道入口17更高的位置处的管道入口19,并且冷却制冷剂; 可弯曲的柔性管10,其连接到管道入口17和管道入口19,并且其用作制冷剂的流动路径; 以及平台12,其具有在一个端部比另一个端部更高的表面,并且其中柔性管10被放置在所述表面上,以便在管道入口19连接的一侧被定位得更高 比管道入口17连接的一侧。
    • 10. 发明公开
    • COOLING SYSTEM FOR STORED NUCLEAR FUEL
    • KÜHLSYSTEMFÜRGESPEICHERTEN KERNBRENNSTOFF
    • EP2975613A1
    • 2016-01-20
    • EP14764284.7
    • 2014-02-21
    • Fujikura Ltd.
    • MOCHIZUKI, MasatakaRANDEEP, SinghMATSUDA, Masahiro
    • G21C19/07F28D15/02G21C19/32G21F5/10G21F9/36
    • G21C19/32F28D15/0275F28D2015/0216G21C19/07G21C19/08G21F5/10G21F9/36
    • A cooling system for cooling nuclear fuel stored in a pool that can prevent a lowering of water level resulting from evaporation is provided. The cooling system cools the nuclear fuels 3 stored in a bottom of the pool 2 filled with cooling water 4. The cooling water 4 comprises an upper layer formed in a water surface as side in which a density of the cooling water 4 is low, a lower layer formed in the bottom side of the pool 2 in which a density of the cooling water 4 is high, and an intermediate layer in which a density of the cooling water 4 is in between those of the cooling waters 4 in the upper layer and the lower layer. A lower end 5a of a heat pipe 5 adapted to transport heat in the form of latent heat of working fluid is situated at a site where the heat is exchanged with the cooling water 4, and an upper 5b end of the heat pipe 5 is exposed to external air. The nuclear fuel 3 is stored within the lower layer.
    • 提供了一种用于冷却存储在池中的核燃料的冷却系统,其可以防止由蒸发引起的水位降低。 冷却系统冷却储存在池2的底部的充满冷却水4的核燃料3.冷却水4包括形成在水面中的上层,其中冷却水4的密度低, 冷却水4的密度高的池2的底面形成的下层和冷却水4的密度在上层的冷却水4的密度之间的中间层和 下层。 适于以工作流体的潜热传递热量的热管5的下端5a位于与冷却水4交换热量的位置,并且热管5的上部5b端部露出 到外部空气。 核燃料3储存在下层内。