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1. 发明公开

EP4117402A1 TWO-PHASE COOLING DEVICE FOR COOLING AN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE TWO-PHASE COOLING DEVICE 审中-实审
公开(公告)号：EP4117402A1
公开(公告)日：2023-01-11
申请号：EP21183753.9
申请日：2021-07-05
申请人： ABB SCHWEIZ AG
发明人： Petrov, Andrey , Sologubenko, Oleksandr , Torresin, Daniele , Agostini, Bruno
IPC分类号： H05K7/20 , F28D15/02
摘要： A two-phase cooling device (20) for cooling an electronic component is provided. The two-phase cooling device (20) comprises: a housing (22) surrounding a cavity (24), which has a top region (28) and a bottom region (30), with the bottom region (30) having a lower part (48) and an upper part (46); and a cooling medium (32) within the cavity (24) for cooling the electronic component by a phase transition from a liquid state to a gaseous state, wherein, when the cooling medium (32) is solely in the liquid state, the bottom region (30) is completely filled with the cooling medium (32) and the top region (28) is free from the cooling medium (32); wherein at least the lower part (48) of the bottom region (30) of the housing (22) is formed such that, if the cooling medium (32) freezes, the last part of the cooling medium (32) to freeze is an upper surface (38) of the cooling medium (32).

2. 发明公开

EP4019252A1 HEAT-TRANSFER DEVICE AND METHOD TO PRODUCE SUCH A DEVICE 审中-实审
公开(公告)号：EP4019252A1
公开(公告)日：2022-06-29
申请号：EP20216880.3
申请日：2020-12-23
申请人： ABB Schweiz AG
发明人： Torresin, Daniele , Agostini, Bruno , Petrov, Andrey
IPC分类号： B33Y80/00 , H01L23/427 , H05K7/20 , B22F7/04
摘要： A heat-transfer device (100) comprises a bi-porous wick (102) having at least one layer (120) comprising a micro-porous body (122) and tubular macro-pores (124), and a dense casing (104) enclosing the wick (102), wherein the body (122) and the macro-pores (124) are fluidically interconnected and are at least partially overlapping inside the layer (120).

3. 发明公开

EP3715766A1 METHOD OF FORMING A 3D-VAPOR CHAMBER 有权转让
公开(公告)号：EP3715766A1
公开(公告)日：2020-09-30
申请号：EP19165849.1
申请日：2019-03-28
申请人： ABB Schweiz AG
发明人： Agostini, Bruno , Torresin, Daniele , Bortolato, Matteo
IPC分类号： F28D15/02
摘要： The invention relates to a method which is suited for manufacturing a 3D-vapor chamber (10) in a defined and efficient manner. Especially, the present method provides a solution for providing a vapor chamber (10) having an evaporator and a condenser made from a first part (12) and a second part (14), wherein continuity of internal structures is given which in turn provides an efficient working behaviour of the vapor chamber (10).

4. 发明公开

EP3196586A1 POWER-ELECTRONIC MODULE ARRANGEMENT 有权
标题翻译：电力电子模块布置
公开(公告)号：EP3196586A1
公开(公告)日：2017-07-26
申请号：EP17150422.8
申请日：2017-01-05
申请人： ABB Schweiz AG
发明人： Gradinger, Thomas , Agostini, Bruno , Agostini, Francesco , Habert, Mathieu , Torresin, Daniele
IPC分类号： F28F13/06 , F28D15/02 , F28F1/02 , H05K7/20
CPC分类号： F28F13/06 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/022 , H05K7/20145 , H05K7/20936
摘要： It is proposed a cooling unit (100) for a power electronic module arrangement. The cooling unit includes a two-phase heat exchanger (101) including a plurality of tube elements (120), each of which having at least one tube extending in a width direction (301) of the cooling unit, within and communicating between an evaporator portion (121) and a condenser portion (122) of the cooling unit (100). The tube elements are arranged in a spaced-apart manner along a depth direction (303) of the cooling unit forming cooling paths (213) for allowing an external cooling medium (130) to flow through the cooling paths, the cooling paths traversing the condenser portion in a length direction (302) of the cooling unit (100). The cooling unit further includes flow guides (141; 142) for forcing an external cooling medium (130) arriving at the heat exchanger through the cooling paths and then away from the cooling unit.
摘要翻译：提出了用于功率电子模块装置的冷却单元（100）。该冷却单元包括两相热交换器（101），该两相热交换器包括多个管元件（120），每个管元件具有沿冷却单元的宽度方向（301）延伸的至少一个管，并且在蒸发器部分（121）和冷却单元（100）的冷凝器部分（122）。管元件沿着形成冷却路径（213）的冷却单元的深度方向（303）以隔开的方式布置，以允许外部冷却介质（130）流过冷却路径，冷却路径横穿冷凝器部分在冷却单元（100）的长度方向（302）上。冷却单元还包括用于迫使外部冷却介质（130）通过冷却路径到达热交换器并且然后远离冷却单元的流动引导件（141; 142）。

5. 发明公开

EP3190371A1 HEAT EXCHANGER FOR POWER-ELECTRONIC COMPONENTS 有权
标题翻译：电力电子组件热交换器
公开(公告)号：EP3190371A1
公开(公告)日：2017-07-12
申请号：EP16150431.1
申请日：2016-01-07
申请人： ABB Schweiz AG
发明人： Torresin, Daniele , Agostini, Bruno , Agostini, Francesco , Gradinger, Thomas , Habert, Mathieu
IPC分类号： F28D15/02 , F28F13/00 , F28F1/02 , H05K7/20
CPC分类号： H05K7/20309 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28F1/022 , F28F13/00 , F28F2270/00 , F28F2275/02 , H05K7/20318 , H05K7/20327 , H05K7/20336 , H05K7/20936
摘要： It is proposed a two-phase heat exchanger device (100) for a power-electronic module arrangement having a semiconductor module. The two-phase heat exchanger device includes a base plate (110) configured for being in contact with a first semiconductor module (201) at a first side (123) of the base plate; and at least one tube element (120) for a first cooling medium (131) including a first portion (121) having at least one evaporator channel and a second portion (122) having at least one condenser channel. The base plate has a groove (111; 112) containing the tube element, wherein the groove is dimensioned for enabling thermal contact between the base plate and the first portion of the tube element and dimensioned to form a gap (113) between the base plate and the second portion of the tube element for thermal separation of the base plate and the second portion of the tube element.
摘要翻译：提出了一种用于具有半导体模块的功率电子模块装置的两相热交换器装置（100）。该两相热交换器装置包括基板（110），该基板构造成在基板的第一侧（123）处与第一半导体模块（201）接触; 和用于第一冷却介质（131）的至少一个管元件（120），所述第一冷却介质包括具有至少一个蒸发器通道的第一部分（121）和具有至少一个冷凝器通道的第二部分（122）。基板具有容纳管元件的凹槽（111; 112），其中凹槽的尺寸设定为能够实现基板与管元件的第一部分之间的热接触，并且其尺寸被设计为在基板与基板之间形成间隙（113）以及管件的第二部分，用于热分离底板和管件的第二部分。

6. 发明公开

EP3147621A1 COOLING DEVICE AND METHOD FOR COOLING AT LEAST TWO POWER ELECTRONIC DEVICES 有权
标题翻译：冷却装置和方法用于冷却至少两个电子功率器件
公开(公告)号：EP3147621A1
公开(公告)日：2017-03-29
申请号：EP15186625.8
申请日：2015-09-24
申请人： ABB Schweiz AG
发明人： Agostini, Francesco , Torresin, Daniele , Habert, Mathieu , Agostini, Bruno
IPC分类号： F28F9/02 , F28D15/02
CPC分类号： H05K7/20936 , F28D15/025 , F28D15/0266 , F28D15/0275 , F28F9/0278 , F28F13/10 , H05K7/209
摘要： A cooling device for cooling at least two power electronic devices (4) by a working fluid (61). The cooling device has a heat receiver portion of the Pulsating Heat Pipe circuit system (60) and a pair of thermo-conducting walls provided on mutually opposite sides of the heat receiver arrangement (20) and sandwiching the heat receiver portion between them. These walls are adapted for being thermally connected to a respective one of the power electronic devices. The cooling device further has a heat dissipator arrangement (40) with a heat dissipator portion of the Pulsating Heat Pipe circuit system (60) and a plurality of fins (42) thermally coupled to the heat dissipator portion for transferring heat from the heat dissipator portion to an external cooling fluid for cooling the working fluid in the heat dissipator portion. The Pulsating Heat Pipe circuit system (60) connects the heat receiver portion with the heat dissipator portion for transferring heat from the heat receiver portion to the heat dissipator portion by the Pulsating Heat Pipe action of the working fluid.
摘要翻译：用于由工作流体（61）的冷却的至少两个电力电子器件（4）的冷却装置。所述冷却装置具有脉动热管电路系统（60）和设置在所述热接收器装置（20）和夹持在它们之间的热接收器部分的彼此相对的两侧的一对热传导壁的热接收器部分。这些壁angepasst用于连接到一个热respectivement电力电子器件中的一个。所述冷却装置还具有热从所述散热器的部分耦合到用于传递环热散热器部分的散热器装置（40）与所述脉动热管电路系统（60）的部分的散热器和散热片的多个（42）到用于冷却所述工作流体在所述散热器中的部分的外部冷却流体。脉动热管电路系统（60）与从所述工作流体的脉动热管作用在部分热接收器部分，以所述散热器的散热部用于传递环的热的接收器部分连接。

7. 发明公开

EP3144625A1 COOLING ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：维多利亚ZU DEREN HERSTELLUNG
公开(公告)号：EP3144625A1
公开(公告)日：2017-03-22
申请号：EP15186080.6
申请日：2015-09-21
申请人： ABB Schweiz AG
发明人： Agostini, Bruno , Torresin, Daniele , Agostini, Francesco , Habert, Mathieu , Koivuluoma, Timo
IPC分类号： F28F3/02 , F28D15/02 , F28D15/04 , H01L23/427 , H01L23/467
CPC分类号： F28D15/046 , F28D15/0233 , F28D15/0266 , F28D15/0275 , F28D15/0283 , F28D15/04 , F28D2021/0029 , F28F3/02 , F28F3/025 , F28F13/10 , F28F2215/06 , H01L23/427 , H01L23/467
摘要： A cooling assembly comprising a plurality of fin elements (2) stacked in a stack direction (101), a plurality of coolant channels (4) each located between adjacent fin elements (2) and extending in a coolant channel direction (102) perpendicular to the stack direction (101), a first heat transfer surface (10) adapted to be in contact with a heat generating element (19), and a second heat transfer surface (20) spaced apart from the first heat transfer surface (10), the plurality of fin elements (2) and the plurality of coolant channels (4) being located between the first heat transfer surface (10) and the second heat transfer surface (20). Each of the fin elements (2) comprises a pulsating heat pipe (6) embedded therein, a main pulsating direction of each of the pulsating heat pipes (6) being substantially parallel to a normal of the first heat transfer surface (10).
摘要翻译：一种冷却组件，包括沿堆叠方向（101）堆叠的多个翅片元件（2），多个冷却剂通道（4），每个冷却剂通道（4）各自位于相邻的翅片元件（2）之间并且沿着与冷却剂通道方向（102）垂直的方式延伸堆叠方向（101），适于与发热元件（19）接触的第一传热表面（10）和与第一传热表面（10）间隔开的第二传热表面（20）多个翅片元件（2）和多个冷却剂通道（4）位于第一传热表面（10）和第二传热表面（20）之间。每个翅片元件（2）包括嵌入其中的脉动热管（6），每个脉动热管（6）的主脉动方向基本上平行于第一传热表面（10）的法线。

8. 发明公开

EP4043821A1 BLANK FOR A HEAT-TRANSFER DEVICE AND METHOD TO PRODUCE A HEAT-TRANSFER DEVICE 有权
公开(公告)号：EP4043821A1
公开(公告)日：2022-08-17
申请号：EP21156769.8
申请日：2021-02-12
申请人： ABB Schweiz AG
发明人： Agostini, Bruno , Torresin, Daniele , Petrov, Andrey
IPC分类号： F28D15/02
摘要： A blank (100) for a heat-transfer device (102) comprises a vapor chamber (106) enclosed by a body (104) of the heat-transfer device (102), and a charging tube (108) connected to the vapor chamber (106), wherein a part of the charging tube (108) protruding from the body (104) has at least one unsealed sealing zone (112) with an oblong flow area (200), where a width of the charging tube (108) exceeds a height of the charging tube (108).

9. 发明授权

EP3203512B1 HEAT SPREADER AND POWER MODULE 有权
公开(公告)号：EP3203512B1
公开(公告)日：2019-05-08
申请号：EP16154626.2
申请日：2016-02-08
申请人： ABB Schweiz AG
发明人： Agostini, Bruno , Kearney, Daniel , Torresin, Daniele , Agostini, Francesco , Habert, Mathieu
IPC分类号： H01L23/36 , H01L23/46 , H01L23/473 , H01L23/427

10. 发明授权

EP2444770B1 Heat Exchanger Based on Pulsating Heat Pipe Principle 有权转让
公开(公告)号：EP2444770B1
公开(公告)日：2020-02-12
申请号：EP10188165.4
申请日：2010-10-20
申请人： ABB Schweiz AG
发明人： Agostini, Bruno , Fabbri, Matteo
IPC分类号： F28D15/02 , F28D1/053 , F28F9/02

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