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1. 发明公开

EP2861928A1 DISPOSITIF DE CONTRÔLE THERMIQUE 有权转让
标题翻译：温度控制装置的
公开(公告)号：EP2861928A1
公开(公告)日：2015-04-22
申请号：EP13739684.2
申请日：2013-07-18
申请人： Airbus Defence and Space SAS
发明人： FIGUS, Christophe
IPC分类号： F28D15/02 , F28D15/04
CPC分类号： F28D15/0233 , F28D15/0241 , F28D15/0266 , F28D15/0275 , F28D15/043 , F28D15/046
摘要： The invention relates to a heat exchange and transfer device that consists of a closed cavity containing a biphasic fluid and includes: at least one heat exchange area comprising a flat chamber configured in the shape of a space, the size of which is significantly smaller than the other two, typically at least ten times smaller, said flat chamber having a first capillary structure on all or part of the inner surface thereof, enabling the fluid in the liquid form thereof to wet said first capillary structure, at least one heat transport area configured in the shape of at least one tube having a second capillary structure over all or part of the inner face thereof, said flat chamber and said at least one tube being connected such that the vapor can circulate freely in the entire cavity, and that capillarity continuity is ensured between the first and second capillary structures so that the liquid can wet the entire resulting capillary structure.

2. 发明公开

EP2759794A1 Cooling of electronic modules 有权
标题翻译： Kühlungvon elektronischen Modulen
公开(公告)号：EP2759794A1
公开(公告)日：2014-07-30
申请号：EP13290022.6
申请日：2013-01-29
申请人： Alcatel Lucent
发明人： Goetz, Hans-Joachim , Haberditzl, Rainer , Seitz, Reinhold
IPC分类号： F28D15/02 , H05K7/20
CPC分类号： H01L23/427 , F28D15/0241 , F28D15/0275 , F28D2021/0028 , H01L2924/0002 , H05K7/20336 , H01L2924/00
摘要： The present invention relates to a device (1) for cooling of at least two electronic modules (2) that are arranged on a circuit board (3), characterized by a common heat dissipating device (4) and at least two heat absorbing bodies (5), wherein each heat absorbing body (5) is heat-conductively connected to the common heat dissipating device (4) and can be heat-conductively connected to one of the electronic modules (2), wherein at least one heat absorbing body (5) is heat-conductively connected to the common heat dissipating device (4) via at least one flexible heat pipe (6), the heat pipe (6) comprising a heat absorbing end section (7), a heat dissipating end section (8), and an axial and lateral flexible intermediate section (9), with the axial and lateral flexible intermediate section (9) being arranged between the heat absorbing end section (7) and the heat dissipating end section (8).
摘要翻译：本发明涉及一种用于冷却布置在电路板（3）上的至少两个电子模块（2）的装置（1），其特征在于，具有共同的散热装置（4）和至少两个吸热体 5），其中每个吸热体（5）与公共散热装置（4）导热连接，并且可以与一个电子模块（2）导热连接，其中至少一个吸热体 5）通过至少一个柔性热管（6）与公共散热装置（4）导热连接，热管（6）包括吸热端部（7），散热端部（8））和轴向和侧向柔性中间部分（9），其中轴向和侧向柔性中间部分（9）布置在吸热端部分（7）和散热端部分（8）之间。

3. 发明公开

EP1747299A4 SINGLE CRYSTAL SHAPE MEMORY ALLOY DEVICES AND METHODS 审中-公开
标题翻译： DEVICES使用单次晶体形状记忆合金的方法
公开(公告)号：EP1747299A4
公开(公告)日：2010-08-11
申请号：EP05744403
申请日：2005-05-04
申请人： TINI ALLOY CO
发明人： JOHNSON DAVID A , BOKAIE MICHAEL , MARTYNOV VALERY
IPC分类号： C22C27/06
CPC分类号： C22C9/01 , A61L31/022 , A61L31/088 , A61L31/10 , A61L31/14 , A61L2400/16 , A61M25/00 , A61M2025/09141 , C22F1/006 , C30B15/00 , C30B29/52 , F16F1/021 , F24J2/5266 , F24J2002/5437 , F28D15/0241 , H01H37/323 , Y02E10/47
摘要： Devices and methods of making devices having one or more components made of single crystal shape memory alloy capable of large recoverable distortions, defined herein as "hyperelastic" SMA. Recoverable Strains are as large as 9 percent, and in special circumstances as large as 22 percent. Hyperelastic SMAs exhibit no creep or gradual change during repeated cycling because there are no crystal boundaries. Hyperelastic properties are inherent in the single crystal as formed: no cold work or special heat treatment is necessary. Alloy components are Cu-Al-X where X may be Ni, Fe, Co, Mn. Single crystals are pulled from melt as in the Stepanov method and quenched by rapid cooling to prevent selective precipitation of individual elemental components. Conventional methods of finishing are used: milling, turning, electro-discharge machining, abrasion. Fields of application include aerospace, military, automotive, medical devices, microelectronics, and consumer products.

4. 发明公开

EP1638143A3 Heat-transfer devices 审中-公开
标题翻译：传热设备
公开(公告)号：EP1638143A3
公开(公告)日：2006-05-10
申请号：EP05255608.1
申请日：2005-09-14
申请人： LUCENT TECHNOLOGIES INC.
发明人： Ewes, Ingo , Hodes, Marc Scott , Holmes, Paul D. , Kolodner, Paul Robert
IPC分类号： H01L23/433 , H01L23/427
CPC分类号： H01L23/4338 , F28D15/0241 , F28D15/0275 , F28F3/02 , F28F3/048 , F28F13/00 , F28F2013/008 , F28F2275/125 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another. In another illustrative embodiment, the heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another, one or more of the components comprising one or more heat-dissipating fins configured to dissipate at least a portion of heat from the heat source to air proximate to the device.

5. 发明公开

EP1638143A2 Heat-transfer devices 审中-公开
标题翻译：传热装置
公开(公告)号：EP1638143A2
公开(公告)日：2006-03-22
申请号：EP05255608.1
申请日：2005-09-14
申请人： LUCENT TECHNOLOGIES INC.
发明人： Ewes, Ingo , Hodes, Marc Scott , Holmes, Paul D. , Kolodner, Paul Robert
IPC分类号： H01L23/433 , H01L23/427
CPC分类号： H01L23/4338 , F28D15/0241 , F28D15/0275 , F28F3/02 , F28F3/048 , F28F13/00 , F28F2013/008 , F28F2275/125 , H01L23/40 , H01L23/4006 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Techniques for heat removal are provided. In one illustrative embodiment, a heat-transfer device is provided. The heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another. In another illustrative embodiment, the heat-transfer device comprises at least one heat-dissipating structure thermally connectable to at least one heat source, wherein the heat-dissipating structure comprises at least two components thermally coupled to each other and configured to slide relative to one another, one or more of the components comprising one or more heat-dissipating fins configured to dissipate at least a portion of heat from the heat source to air proximate to the device.
摘要翻译：提供了散热技术。在一个说明性实施例中，提供了一种传热装置。所述传热装置包括至少一个可热连接到至少一个热源的散热结构，其中所述散热结构包括至少两个彼此热耦合并且构造成相对于彼此滑动的部件。在另一个说明性实施例中，传热装置包括至少一个可热连接到至少一个热源的散热结构，其中散热结构包括至少两个彼此热耦合并被配置成相对于一个另一个或多个所述部件包括一个或多个散热片，所述散热片被构造成将来自所述热源的至少一部分热量耗散到所述装置附近的空气中。

6. 发明授权

EP0741273B1 A plate-type heat exchanger 失效
标题翻译：板式换热器
公开(公告)号：EP0741273B1
公开(公告)日：2002-11-20
申请号：EP96105996.1
申请日：1996-04-17
申请人： ENEL S.p.A.
发明人： Benelli, Giancarlo, c/o Enel S.p.A. , De Carli, Massimiliano, c/o Enel S.p.A.
IPC分类号： F28D9/00 , F28F3/02
CPC分类号： F28D15/0241 , F28D9/0031 , F28F3/025

7. 发明公开

EP0770200A1 FLEXIBLE HEAT PIPE FOR INTEGRATED CIRCUIT COOLING APPARATUS 失效
标题翻译：灵活的热管投资，用于冷却集成电路
公开(公告)号：EP0770200A1
公开(公告)日：1997-05-02
申请号：EP95927517.0
申请日：1995-07-27
申请人： AAVID ENGINEERING, INC.
发明人： LARSON, Ralph, I. , PHILLIPS, Richard, L.
IPC分类号： F28D15 , F28F21 , H01L23 , H05K7
CPC分类号： F28F21/00 , F28D15/0241 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heat pipe (10) which is flexible and thus conformable to the space in which it is to be deployed consists of two or three layers, namely, a relatively thin, highly conductive plate (12) as a bottom layer, a plastic sheet (16) as a top layer and wicking (14) as an optional middle layer. The bottom plate (12) has a relatively high modulus of elasticity and it is stiff, yet ductile. It is preferably made of metal, such as aluminum, or a plastic sheet or plate. To manufacture the heat pipe (10), the bottom (12) and top layers (16) are aligned, with the wicking (14) between them, and sealed together around three edges. Liquid coolant is then added and the fourth edge is sealed. The sealing is preferably performed by heat sealing. The heat pipe (10) may include heat-dissipating fins (36) or ridges on the end of the pipe that operates as a condenser. The opposing end of the pipe, which acts as the evaporator, is positioned proximate to a heat-generating component. In an alternative embodiment, additional layers of plastic and optional wicking are attached to an otherwise exposed surface of the bottom plate. The heat pipe is narrow and can thus be installed in existing space proximate to a heat generating component, flexing and/or elastically deforming as necessary to facilitate installation. Further, the heat pipe can be bent, to conform to the shape of the component.

8. 发明公开

EP0751365A2 Heat transfer device having metal band formed with longitudinal holes 失效
标题翻译：具有形成有纵向孔的金属带的传热装置
公开(公告)号：EP0751365A2
公开(公告)日：1997-01-02
申请号：EP96110229.0
申请日：1996-06-25
申请人： Actronics Kabushiki Kaisha , Akachi, Hisateru
发明人： Akachi, Hisateru
IPC分类号： F28D15/02
CPC分类号： F28D15/0241 , F28D15/0233 , F28D15/0275
摘要： A heat exchanger utilizes a multi-hole flexible band (1) of light metal which is formed, by extrusion, with a plurality of longitudinal small holes (2) extending in parallel to one another from one band end to the other end (3). The longitudinal holes (2) are connected at each of the end portions (3) of the band, and both ends of the band is closed by welding to form a sealed cavity partly filled with a working fluid in partial vacuum. The sealed cavity may be in the form of a single long continuous passage, or in the form of parallel passages connected together at both ends. The multi-hole band is bent in such a shape that the band meanders between a high temperature region and a low temperature region. The thus-constructed heat exchanger is advantageous in heat exchanging performance, and capable of reducing the manufacturing and material costs, the weight of the heat exchanger, and improving the reliability.
摘要翻译：热交换器利用轻金属的多孔柔性带（1），该多孔柔性带通过挤压形成有从一个带端到另一端（3）彼此平行延伸的多个纵向小孔（2）。纵向孔（2）在带的每个端部（3）处连接，并且带的两端通过焊接闭合以形成部分充满部分真空中的工作流体的密封腔。密封的空腔可以是单个长连续通道的形式，或者是两端连接在一起的平行通道的形式。多孔带被弯曲成使得带在高温区域和低温区域之间曲折的形状。这样构造的热交换器在热交换性能方面是有利的，并且能够降低制造和材料成本，热交换器的重量并且提高可靠性。

9. 发明公开

EP0076081A3 Improvements in or relating to heat pipes 失效
标题翻译：改进或相关热管
公开(公告)号：EP0076081A3
公开(公告)日：1983-08-17
申请号：EP82304958
申请日：1982-09-21
申请人： The Secretary of State for Defence in Her Britannic Majesty's Government of the United Kingdom of Great Britain and
发明人： Graveney, Michael James
IPC分类号： F28D15/00 , F24J03/02 , F25B01/06 , F25B19/00 , A41D13/00
CPC分类号： F25B1/06 , A41D13/005 , F24S10/90 , F25B19/00 , F28D15/02 , F28D15/0241 , Y02E10/44
摘要： A heat pipe assembly including a vacuum pump for maintaining a low pressure regime within the assembly. The vacuum pump is preferably a jet pump. Typically the assembly includes a heat pipe in sheet form, and may be rigid as in a solar heat collector panel, or conformable as in a conditioning garment.
摘要翻译：一种热管组件，包括用于在组件内保持低压状态的真空泵。真空泵优选为喷射泵。通常，组件包括片状的热管，并且可以像太阳能集热器面板那样是刚性的，或者如在调理衣服中一样。

10. 发明公开

EP0076078A2 Improvements in heat pipes 失效
标题翻译：热管的改进
公开(公告)号：EP0076078A2
公开(公告)日：1983-04-06
申请号：EP82304955.6
申请日：1982-09-21
申请人： Secretary of State for Defence in Her Britannic Majesty's Gov. of the United Kingdom of Great Britain and Northern Ireland , Larsson, Lars Erik
发明人： Graveney, Michael James , Larsson, Lars Erik
IPC分类号： F28D15/00 , F25B19/00 , A41D13/00
CPC分类号： F25B19/00 , A41D13/005 , F28D15/0241
摘要： A heat pipe assembly having a heat pump arranged in association with a heat sink. The heat pipe is principally a conformable garment, and the assembly may include dis- mantleable connection means and pump means for evacuating the heat pipe interior and/or pumping the fluid.
摘要翻译：具有与散热器相关联布置的热泵的热管组件。热管主要是适形的衣服，并且组件可以包括可拆卸的连接装置和用于抽空热管内部和/或泵送流体的泵装置。

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