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1. 发明公开

EP4380323A2 LIFT PRINTING OF CONDUCTIVE TRACES ONTO A SEMICONDUCTOR SUBSTRATE 审中-实审
公开(公告)号：EP4380323A2
公开(公告)日：2024-06-05
申请号：EP24170624.1
申请日：2015-10-19
申请人： Orbotech Ltd.
发明人： ZENOU, Michael , KOTLER, Zvi
IPC分类号： H05K3/14
CPC分类号： H05K3/14 , H05K2203/052820130101 , H05K2203/10720130101 , H05K2203/12820130101 , H01L21/4846 , H01L21/2855 , C23C14/048 , C23C14/28 , B23K26/0006 , B23K26/0861 , B23K26/123 , B23K26/34 , B23K26/1224 , B23K26/0624 , B23K2101/4020180801 , B23K2103/5620180801 , H01L31/022425 , C23C14/04 , C23C14/48
摘要： An apparatus for material deposition, comprising a transparent donor substrate having deposited thereon a donor film comprising a metal with a thickness less than 2 µm. The apparatus further comprising a positioning assembly, which is configured to position the donor substrate in proximity to an acceptor substrate comprising a semiconductor material with the donor film facing toward the acceptor substrate and with a gap of at least 0.1 mm between the donor film and the acceptor substrate; and an optical assembly, which is configured to direct pulses of laser radiation, having a pulse duration less than 2 ns, to impinge on the donor substrate so as to cause droplets of the metal to be ejected from the donor layer and land on the acceptor substrate, thereby forming a circuit trace in ohmic contact with the semiconductor material.

2. 发明公开

EP3368311A1 ADDITIVE MANUFACTURING SYSTEM AND METHOD 有权
公开(公告)号：EP3368311A1
公开(公告)日：2018-09-05
申请号：EP16860806.5
申请日：2016-10-27
申请人： Seurat Technologies, Inc.
发明人： DEMUTH, James A. , TOOMRE, Erik , LEARD, Francis L. , KAMSHAD, Kourosh , FEES, Heiner , BERDICHEVSKY, Eugene
IPC分类号： B33Y10/00 , B33Y30/00 , B33Y50/02 , B29C67/00
CPC分类号： B22F3/1055 , B22F3/24 , B22F2003/1056 , B22F2003/1057 , B22F2003/1058 , B22F2003/1059 , B22F2003/247 , B22F2003/248 , B22F2998/10 , B22F2999/00 , B23K15/0006 , B23K15/0013 , B23K15/002 , B23K15/0026 , B23K15/0086 , B23K15/0093 , B23K15/06 , B23K26/0006 , B23K26/03 , B23K26/032 , B23K26/082 , B23K26/083 , B23K26/0846 , B23K26/1224 , B23K26/123 , B23K26/127 , B23K26/142 , B23K26/144 , B23K26/16 , B23K26/342 , B23K26/36 , B23K26/702 , B23K26/703 , B23K26/704 , B23K37/0408 , B23K37/0426 , B23K2101/001 , B23K2101/008 , B23K2101/02 , B23K2101/24 , B23K2103/00 , B23K2103/42 , B23K2103/50 , B25J11/00 , B28B1/001 , B29C64/386 , B29K2105/251 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , B33Y99/00 , G02B7/14 , G02B7/16 , G02B7/1827 , G02B15/04 , G02B15/10 , G02B19/0028 , G02B19/0047 , G02B26/0816 , G02B27/0068 , G02B27/0905 , G02B27/141 , G02B27/283 , G02B27/286 , G02F1/0136 , G02F1/133362 , G02F1/135 , G05B17/02 , G05B2219/49023 , G07C3/146 , H01S5/005 , H01S5/4012 , Y02P10/295 , Y02P80/40 , B22F2203/03
摘要： A method and an apparatus of a powder bed fusion additive manufacturing system that enables a quick change in the optical beam delivery size and intensity across locations of a print surface for different powdered materials while ensuring high availability of the system. A dynamic optical assembly containing a set of lens assemblies of different magnification ratios and a mechanical assembly may change the magnification ratios as needed. The dynamic optical assembly may include a transitional and rotational position control of the optics to minimize variations of the optical beam sizes across the print surface.

3. 发明公开

EP3368271A1 LONG AND HIGH RESOLUTION STRUCTURES FORMED BY ADDITIVE MANUFACTURING TECHNIQUES 有权
公开(公告)号：EP3368271A1
公开(公告)日：2018-09-05
申请号：EP16860880.0
申请日：2016-10-28
申请人： Seurat Technologies, Inc.
发明人： DEMUTH, James, A. , TOOMRE, Erik , LEARD, Francis, L. , KAMSHAD, Kourosh , FEES, Heiner , BERDICHEVSKY, Eugene
IPC分类号： B29C64/10 , B29C64/141 , B29C64/153 , B29C64/188 , B29C64/20 , B29C64/205 , B29C64/227 , B29C64/232 , B29C64/236
CPC分类号： B22F3/1055 , B22F3/24 , B22F2003/1056 , B22F2003/1057 , B22F2003/1058 , B22F2003/1059 , B22F2003/247 , B22F2003/248 , B22F2998/10 , B22F2999/00 , B23K15/0006 , B23K15/0013 , B23K15/002 , B23K15/0026 , B23K15/0086 , B23K15/0093 , B23K15/06 , B23K26/0006 , B23K26/03 , B23K26/032 , B23K26/082 , B23K26/083 , B23K26/0846 , B23K26/1224 , B23K26/123 , B23K26/127 , B23K26/142 , B23K26/144 , B23K26/16 , B23K26/342 , B23K26/36 , B23K26/702 , B23K26/703 , B23K26/704 , B23K37/0408 , B23K37/0426 , B23K2101/001 , B23K2101/008 , B23K2101/02 , B23K2101/24 , B23K2103/00 , B23K2103/42 , B23K2103/50 , B25J11/00 , B28B1/001 , B29C64/386 , B29K2105/251 , B33Y10/00 , B33Y30/00 , B33Y40/00 , B33Y50/02 , B33Y70/00 , B33Y80/00 , B33Y99/00 , G02B7/14 , G02B7/16 , G02B7/1827 , G02B15/04 , G02B15/10 , G02B19/0028 , G02B19/0047 , G02B26/0816 , G02B27/0068 , G02B27/0905 , G02B27/141 , G02B27/283 , G02B27/286 , G02F1/0136 , G02F1/133362 , G02F1/135 , G05B17/02 , G05B2219/49023 , G07C3/146 , H01S5/005 , H01S5/4012 , Y02P10/295 , Y02P80/40 , B22F2203/03
摘要： A method and an apparatus of a powder bed fusion additive manufacturing system that enables a quick change in the optical beam delivery size and intensity across locations of a print surface for different powdered materials while ensuring high availability of the system. A dynamic optical assembly containing a set of lens assemblies of different magnification ratios and a mechanical assembly may change the magnification ratios as needed. The dynamic optical assembly may include a transitional and rotational position control of the optics to minimize variations of the optical beam sizes across the print surface.

4. 发明公开

EP3275576A1 VERFAHREN ZUM VERBINDEN VON METALLISCHEN BAUTEILEN 审中-公开
标题翻译：连接金属部件的方法
公开(公告)号：EP3275576A1
公开(公告)日：2018-01-31
申请号：EP16181495.9
申请日：2016-07-27
申请人： Airbus Defence and Space GmbH
发明人： GREITEMEIER, Daniel , PALM, Frank
IPC分类号： B22F3/105 , B23K26/342 , B23K26/12 , B23K13/01 , B23K13/04 , B23K35/28 , B23K35/30 , B23K35/32
CPC分类号： B23K26/1224 , B22F3/105 , B22F2003/1053 , B23K13/01 , B23K13/04 , B23K26/342 , B23K35/286 , B23K35/302 , B23K35/3033 , B23K35/3046 , B23K35/3053 , B23K35/325
摘要： Die vorliegende Erfindung schafft ein Verfahren zum Verbinden von metallischen Bauteilen, welche gleiche oder verschiedene Metalllegierung umfassen, wobei hierbei die Metalllegierungen in einen thixotropen Zustand überführt werden und unter Vakuum verbunden werden, sowie eine Anordnung, welche durch das erfindungsgemäße Verfahren hergestellt wird.
摘要翻译：本发明提供了一种连接包含相同或不同金属合金的金属部件的方法，在该情况下，金属合金被转化为触变状态并在真空下结合，以及由本发明方法生产的组件。

5. 发明公开

EP3237649A1 LIGHTHOUSE SCANNER WITH A ROTATING MIRROR AND A CIRCULAR RING TARGET 无效转让
标题翻译：带有旋转镜和圆环目标的LIGHTHOUSE SCANNER
公开(公告)号：EP3237649A1
公开(公告)日：2017-11-01
申请号：EP15872025.0
申请日：2015-12-16
申请人： Picodeon Ltd OY
发明人： KEKKONEN, Ville , PIIRTO, Jarkko , LIIMATAINEN, Jari , CLARKE, Fergus
IPC分类号： C23C14/28 , C23C14/54 , C23C14/56 , G02B26/10 , B23K26/08
CPC分类号： C23C14/28 , B23K26/0624 , B23K26/0821 , B23K26/1224 , B23K26/36 , B23K26/361 , B23K2203/02 , B23K2203/08 , B23K2203/42 , B23K2203/50 , C23C14/54 , C23C14/562 , G02B26/10 , G02B26/124 , G02B26/125
摘要： The present invention introduces a scanning arrangement and a method suitable for coating processes applying laser ablation. The arrangement is suited to prolonged, industrial processes. The arrangement comprises a target, which has an annular form. The laser beam direction is controlled by a rotating mirror locating along the center axis of the annular target. The scanning line will rotate circularly along the inner target surface when the mirror rotates. The focal point of the laser beams may be arranged to locate on the inner target surface to ensure a constant spot size. A ring-formed, a cylinder-shaped or a cut conical-shaped target may be used. The inner surface of the target may thus be tapered in order to control the release direction of the ablated material towards a substrate to be coated.
摘要翻译：本发明引入了适用于应用激光烧蚀的涂布工艺的扫描装置和方法。这种安排适合于长时间的工业过程。该装置包括具有环形形式的靶（15）。激光束方向（12）由沿环形靶（15）的中心轴定位的旋转镜（13）控制。当反射镜（13）旋转时，扫描线将沿内部目标表面循环旋转。激光束（12）的焦点可以被布置为定位在内目标表面上以确保恒定的光斑尺寸。可以使用环形，圆柱形或切割的圆锥形靶（15）。靶的内表面因此可以是锥形的，以便控制朝向待涂覆的基底（17）的被切割材料（16）的释放方向。

6. 发明授权

EP2950967B1 MATERIAL PROCESSING THROUGH OPTICALLY TRANSMISSIVE SLAG 有权
标题翻译： MATERIALBEARBEITUNG DURCH OPTISCHDURCHLÄSSIGESCHLACKE
公开(公告)号：EP2950967B1
公开(公告)日：2016-12-28
申请号：EP14704056.2
申请日：2014-01-30
申请人： Siemens Energy, Inc.
发明人： BRUCK, Gerald J. , KAMEL, Ahmed
IPC分类号： B23K26/00 , B23K26/122 , B23K26/21 , B23K26/18 , C30B11/04 , B23K26/211 , B23K26/34 , B23K9/18 , C30B11/00 , C30B29/52
CPC分类号： B23K26/009 , B23K9/18 , B23K26/122 , B23K26/1224 , B23K26/18 , B23K26/211 , B23K26/34 , C30B11/005 , C30B11/04 , C30B29/52 , Y10T428/12458

7. 发明授权

EP2469989B1 MANUFACTURING METHOD FOR SUPERCONDUCTING ACCELERATION CAVITY 有权
标题翻译：过程的超导加速区
公开(公告)号：EP2469989B1
公开(公告)日：2016-07-06
申请号：EP10809898.9
申请日：2010-08-11
申请人： Mitsubishi Heavy Industries Mechatronics Systems, Ltd.
发明人： SENNYU, Katsuya
IPC分类号： H05H7/20 , B23K26/00 , B23K26/12
CPC分类号： H05H7/20 , B23K26/1224 , B23K26/206 , B23K26/28

8. 发明公开

EP2752269A1 DEVICE AND METHOD FOR UNDERWATER WELDING 有权
标题翻译：用于水下焊接的装置和方法
公开(公告)号：EP2752269A1
公开(公告)日：2014-07-09
申请号：EP12826236.7
申请日：2012-08-22
申请人： Kabushiki Kaisha Toshiba
发明人： ISHIGAKI, Tatsuya , UEHARA, Takuya , HAMAMOTO, Yoshio , YAMAGUCHI, Osamu , MAEHARA, Takeshi , KATO, Hiromi
IPC分类号： B23K26/12 , B23K26/16 , B23K26/20
CPC分类号： B23K26/123 , B23K26/1224
摘要： An underwater welding apparatus comprises: an underwater welding head (11) provided underwater and having, at its leading end, a nozzle section (16) from which laser light is emitted; a shied cover (18) formed of an elastic member and provided around the nozzle section (16) so as to form, at the leading end of the underwater welding head (11), a space where water is excluded by means of shield gas; and an expansion/contraction member (21) having a discharge hole for discharging water and shield gas containing metal dust particles from an inside of the shield cover (18), the discharge hole being increased in diameter as pressure inside the shield cover (18) rises, while being reduced in diameter as the pressure inside the shield cover (18) falls.
摘要翻译：本发明提供一种水中焊接装置，其特征在于，具备：水下焊接头（11），其在前端具有照射激光的喷嘴部（16）由弹性部件形成并围绕喷嘴部分（16）设置的罩盖（18），以便在水下焊接头（11）的前端形成一个用保护气体除去水分的空间; 以及具有用于从所述防护罩（18）的内部排出水和含有金属粉尘颗粒的保护气体的排出孔的膨胀/收缩构件（21），所述排出孔的直径随着所述防护罩（18）内的压力而增大，随着防护罩（18）内的压力下降而上升，直径减小。

9. 发明授权

EP1911855B1 Laser peening apparatus 有权转让
标题翻译：激光喷丸机
公开(公告)号：EP1911855B1
公开(公告)日：2014-06-18
申请号：EP07117696.0
申请日：2007-10-02
申请人： Fuji Jukogyo Kabushiki Kaisha , The Society of Japanese Aerospace Companies
发明人： Adachi, Takafumi c/o Fuji Jukogyo Kabushiki Kaisha , Ogisu, Toshimichi c/o Fuji Jukogyo Kabushiki Kaisha
IPC分类号： C21D10/00 , B23K26/00
CPC分类号： C21D10/005 , B23K26/0069 , B23K26/1224 , C21D7/06

10. 发明公开

EP2739429A2 LASER SYSTEMS AND METHODS FOR THE REMOVAL OF STRUCTURES 有权
标题翻译： LASERSYSTEME UND VERFAHREN ZUR ENTFERNUNG VON STRUKTUREN
公开(公告)号：EP2739429A2
公开(公告)日：2014-06-11
申请号：EP12820743.8
申请日：2012-08-02
申请人： Foro Energy Inc.
发明人： ZEDIKER, Mark, S. , GRUBB, Daryl, L. , DE WITT, Ronald, A. , DEUTCH, Paul, D. , MOXLEY, Joel, F. , MARSHALL, Scott, A. , LINYAEV, Eugene, J. , SCHROIT, Sam, N. , KOLACHALAM, Sharath, K.
IPC分类号： B23K26/00
CPC分类号： B23K26/38 , B23K26/1224 , E02B2017/0052 , E02B2017/0095 , E21B29/02
摘要： There is provided high power laser systems, high power laser tools, and methods of using these tools and systems for cutting, sectioning and removing structures objects, and materials, and in particular, for doing so in difficult to access locations and environments, such as offshore, underwater, or in hazardous environments, such as nuclear and chemical facilities. Thus, there is also provided high power laser systems, high power laser tools, and methods of using these systems and tools for removing structures, objects, and materials located offshore, under bodies of water and under the seafloor.
摘要翻译：提供高功率激光系统，大功率激光工具以及使用这些工具和系统来切割，切割和去除结构物体和材料的方法，特别是在难以接近的位置和环境中，例如海上，水下或危险环境，如核能和化学设施。因此，还提供了高功率激光系统，大功率激光工具，以及使用这些系统和工具来去除位于海上，在水下和海底下的结构，物体和材料的方法。

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