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1. 发明授权

EP3249081B1 FILM FORMING METHOD FOR METAL FILM AND FILM FORMING APPARATUS THEREFOR 有权
公开(公告)号：EP3249081B1
公开(公告)日：2019-03-27
申请号：EP17171596.4
申请日：2017-05-17
申请人： Toyota Jidosha Kabushiki Kaisha
发明人： SATO, Yuki , HIRAOKA, Motoki , IISAKA, Hirofumi
IPC分类号： C25D5/06 , C25D17/00 , C25D17/14 , C25D17/06 , C25D3/00 , C25D3/38

2. 发明公开

EP3036357A2 FILM FORMATION SYSTEM AND FILM FORMATION METHOD FOR FORMING METAL FILM 有权
标题翻译：成膜装置及成膜方法用于生产金属膜
公开(公告)号：EP3036357A2
公开(公告)日：2016-06-29
申请号：EP14789355.6
申请日：2014-08-20
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki
IPC分类号： C25D5/08 , C25D17/00 , C25D17/12 , C25D21/04
CPC分类号： C25D5/04 , C25D3/00 , C25D5/08 , C25D5/22 , C25D17/00 , C25D17/002 , C25D17/007 , C25D17/12 , C25D17/14 , C25D21/04
摘要： A solid electrolyte membrane (13) is arranged on a surface of an anode (11) between the anode (11) and a substrate (B) that serves as a cathode. The solid electrolyte membrane (13) is brought into contact with the substrate (B). At the same time, a metal film (F) is formed on the surface of the substrate (B) by causing metal to precipitate onto the surface of the substrate (B) from metal ions through application of voltage between the anode (11) and the substrate (B) in a first contact state where the solid electrolyte membrane (13) contacts the substrate (B). The metal ions are contained inside the solid electrolyte membrane (13).

3. 发明授权

EP2818585B1 FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM 有权
公开(公告)号：EP2818585B1
公开(公告)日：2019-11-27
申请号：EP13751478.2
申请日：2013-02-21
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki , YOSHIOKA, Takayasu
IPC分类号： C25D17/12 , C25D3/00 , C25D5/02 , C25D5/34 , C25D5/08 , C25D17/00 , C25D17/14 , C25D3/38

4. 发明授权

EP3105369B1 METHOD OF FORMING METAL COATING 有权
公开(公告)号：EP3105369B1
公开(公告)日：2019-03-27
申请号：EP15708571.3
申请日：2015-02-09
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： YANAGIMOTO, Hiroshi , HIRAOKA, Motoki , SATO, Yuki , SHINMEI, Yoshitaka
IPC分类号： C25D3/00 , C25D5/02 , C25D5/18 , C25D5/06 , C25D17/12 , C25D17/14 , C25D17/00 , C25D5/12 , C25D3/12

5. 发明公开

EP1644555A2 RESIN SUBSTRATE HAVING A RESIN-METAL COMPOSITE LAYER AND METHOD FOR MANUFACTURING THEREOF 审中-公开
标题翻译：与树脂的金属复合层与相关方法HARZSUBSRTAT
公开(公告)号：EP1644555A2
公开(公告)日：2006-04-12
申请号：EP04748136.1
申请日：2004-07-22
申请人： Toyota Jidosha Kabushiki Kaisha
发明人： HIRAOKA, Motoki , YOSHINAGA, Fumitaka , DAIZA, Setsuto , BESSHO, Takeshi
IPC分类号： C23C18/31 , C23C18/28
CPC分类号： H05K3/38 , C23C18/08 , C23C18/2033 , C23C18/2086 , C23C18/31 , H05K3/181 , H05K2201/2063 , H05K2203/1152 , Y10T428/25 , Y10T428/26 , Y10T428/31504 , Y10T428/31678
摘要： A resin-metal composite layer is formed by modifying a surface of a resin substrate to a modified layer, contacting the modified layer with a metal compound solution, and adsorbing at least either metal colloids or ions are adsorbed to the polar group, so that metal particles are dispersed into the modified layer. Because of the fineness of the metal particles in the resin-metal composite layer, high transparent can be achieved. The resin-metal composite layer functions as a transparent conductive layer and the like.

6. 发明公开

EP4187560A1 RARE EARTH MAGNET AND PRODUCTION METHOD THEREOF 审中-公开
公开(公告)号：EP4187560A1
公开(公告)日：2023-05-31
申请号：EP22208018.6
申请日：2022-11-17
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA , Nichia Corporation
发明人： ITO, Masaaki , HIRAOKA, Motoki , TABUCHI, Reimi , MAEHARA, Hisashi , KUME, Michiya
IPC分类号： H01F1/059 , H01F1/055 , H01F41/02
摘要： A Sm-Fe-N-based rare earth magnet more resistant to demagnetization than ever before in an environment where an external magnetic field is applied, particularly at high temperatures, and a production method thereof are provided.
The present disclosure presents a production method of a rare earth magnet, including preparing a coated magnetic powder, compression-molding the coated magnetic powder in a magnetic field to obtain a magnetic-field molded body, pressure-sintering the magnetic-field molded body to obtain a sintered body, and heat-treating the sintered body, and a rare earth magnet obtained by the method. D 50 of the magnetic powder in the coated magnetic powder is 1.50 µm or more and 3.00 µm or less, the content ratio of the zinc component in the coated magnetic powder is 3 mass% or more and 15 mass% or less, and the heat treatment temperature is 350°C or more and 410°C or less.

7. 发明授权

EP3070191B1 FILM FORMING APPARATUS FOR METAL COATING FILM AND FILM FORMING METHOD THEREFOR 有权
标题翻译：用于金属涂覆膜的成膜装置及其成膜方法
公开(公告)号：EP3070191B1
公开(公告)日：2017-08-16
申请号：EP14861239.3
申请日：2014-11-12
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki
IPC分类号： C25D17/00 , C25D5/06 , C25D17/14 , C25D3/00
CPC分类号： C25D5/06 , C25D3/00 , C25D17/00 , C25D17/002 , C25D17/005 , C25D17/14

8. 发明公开

EP3037571A1 METAL-FILM FORMING APPARATUS AND METAL-FILM FORMING METHOD 有权
标题翻译： METALLFILMHERSTELLUNGSVORRICHTUNG发布METALLFILMHERSTELLUNGSVERFAHREN
公开(公告)号：EP3037571A1
公开(公告)日：2016-06-29
申请号：EP15202454.3
申请日：2015-12-23
申请人： Toyota Jidosha Kabushiki Kaisha
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki
IPC分类号： C25D3/00 , C25D5/02 , C25D17/00 , C25D17/14 , H05K3/00
摘要： A metal-film forming apparatus (1A) includes: an anode (11); a resin substrate (B) having a surface on which a conductor pattern layer (D) that serves as a cathode is formed; a solid electrolyte membrane (13) that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply (16); and a conductive member (17A) that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.
摘要翻译：金属膜形成装置（1A）包括：阳极（11）; 形成有作为阴极的导体图案层（D）的表面的树脂基板（B）含有金属离子并且位于阳极和树脂基板之间的固体电解质膜（13），当形成金属膜时，所述固体电解质膜与所述导体图案层的表面接触; 电源（16）; 以及导电构件（17A），其在形成所述金属膜时被布置成与所述导体图案层接触，使得所述电源的负极电连接到所述导体图案层，所述导电构件可从所述导体图案层拆卸其中，当施加电压时，金属离子被还原以沉积在导体图案层的表面上形成金属膜的金属。

9. 发明公开

EP3105369A1 METHOD OF FORMING METAL COATING 有权
标题翻译：一种用于生产METALLBESCHICHTUNG
公开(公告)号：EP3105369A1
公开(公告)日：2016-12-21
申请号：EP15708571.3
申请日：2015-02-09
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： YANAGIMOTO, Hiroshi , HIRAOKA, Motoki , SATO, Yuki , SHINMEI, Yoshitaka
IPC分类号： C25D3/00 , C25D5/02 , C25D5/18 , C25D5/06 , C25D17/12 , C25D17/14 , C25D17/00 , C25D5/12 , C25D3/12
CPC分类号： C25D5/18 , C25D3/00 , C25D3/12 , C25D5/02 , C25D5/06 , C25D5/12 , C25D17/001 , C25D17/12 , C25D17/14
摘要： A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.

10. 发明公开

EP3070191A1 FILM FORMING APPARATUS FOR METAL COATING FILM AND FILM FORMING METHOD THEREFOR 有权
标题翻译： FILMBILDENDE VORRICHTUNGFÜREINEN METALLBESCHICHTUNGSFILM UND FILMBILDUNGSVERFAHRENDAFÜR
公开(公告)号：EP3070191A1
公开(公告)日：2016-09-21
申请号：EP14861239.3
申请日：2014-11-12
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki
IPC分类号： C25D17/00 , C25D13/00
CPC分类号： C25D5/06 , C25D3/00 , C25D17/00 , C25D17/002 , C25D17/005 , C25D17/14
摘要： Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed. The film formation apparatus 1A includes a mounting base 21 on which the base B is to be placed, and the mounting base 21 has a suction unit 22 to suck the solid electrolyte membrane 13 from a side of the base B so that the solid electrolyte membrane 13 is brought into intimate contact with the surface of the base B during formation of the metal film F.
摘要翻译：提供一种金属膜的成膜装置及其成膜方法，能够稳定地形成均匀厚度均匀的金属膜，同时受到阳极表面状态的影响较小。成膜装置1A包括：阳极11; 设置在阳极11和用作阴极的基体B之间的固体电解质膜13; 以及在阳极11和基体B之间施加电压的电源单元14，成膜装置被构造成使得当固体电解质膜13与基体B的表面接触时，阳极11和基底B，金属由固体电解质膜13内部的金属离子沉积在基体B的表面上，形成由金属制成的金属膜F. 成膜装置1A包括：安装基座21，其上放置有基座B;安装基座21具有吸引单元22，用于从基座B侧吸取固体电解质膜13，使固体电解质膜 13在金属膜F的形成期间与基体B的表面紧密接触。

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