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    • 8. 发明公开
    • METAL-FILM FORMING APPARATUS AND METAL-FILM FORMING METHOD
    • METALLFILMHERSTELLUNGSVORRICHTUNG发布METALLFILMHERSTELLUNGSVERFAHREN
    • EP3037571A1
    • 2016-06-29
    • EP15202454.3
    • 2015-12-23
    • Toyota Jidosha Kabushiki Kaisha
    • HIRAOKA, MotokiYANAGIMOTO, HiroshiSATO, Yuki
    • C25D3/00C25D5/02C25D17/00C25D17/14H05K3/00
    • A metal-film forming apparatus (1A) includes: an anode (11); a resin substrate (B) having a surface on which a conductor pattern layer (D) that serves as a cathode is formed; a solid electrolyte membrane (13) that contains metal ions and is between the anode and the resin substrate, the solid electrolyte membrane contacting a surface of the conductor pattern layer when a metal film is formed; a power supply (16); and a conductive member (17A) that is arranged contacting the conductor pattern layer when the metal film is formed, such that a negative electrode of the power supply is electrically connected to the conductor pattern layer, the conductive member being detachable from the conductor pattern layer, wherein the metal ions are reduced to deposit metal that forms the metal film on the surface of the conductor pattern layer when the voltage is applied.
    • 金属膜形成装置(1A)包括:阳极(11); 形成有作为阴极的导体图案层(D)的表面的树脂基板(B) 含有金属离子并且位于阳极和树脂基板之间的固体电解质膜(13),当形成金属膜时,所述固体电解质膜与所述导体图案层的表面接触; 电源(16); 以及导电构件(17A),其在形成所述金属膜时被布置成与所述导体图案层接触,使得所述电源的负极电连接到所述导体图案层,所述导电构件可从所述导体图案层拆卸 其中,当施加电压时,金属离子被还原以沉积在导体图案层的表面上形成金属膜的金属。