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1. 发明授权

EP4043618B1 SUBSTRATE HOLDING AND LOCKING SYSTEM FOR CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT 有权
公开(公告)号：EP4043618B1
公开(公告)日：2024-06-19
申请号：EP22167592.9
申请日：2020-01-21
IPC分类号： C25D17/00 , C25D17/06
CPC分类号： C25D17/06 , C25D17/001 , C25D17/004 , C25D17/005

2. 发明公开

EP4341464A1 GESTELL FÜR DIE VERWENDUNG IN EINEM VERFAHREN ZUM BEIZEN ZU METALLISIERENDER KUNSTSTOFFTEILE 审中-实审
公开(公告)号：EP4341464A1
公开(公告)日：2024-03-27
申请号：EP22730434.2
申请日：2022-05-23
申请人： DELTA Engineering & Chemistry GmbH
发明人： DRESCHER, Johannes , SCHMITZ, Sarah
IPC分类号： C23C18/16 , C25D5/56 , C25D17/06 , C25D17/08 , C23C18/20 , C23C18/24 , C08K5/103 , C08J7/00 , C09D127/06 , C23C18/32

3. 发明公开

EP4332277A1 APPARATUS AND METHOD FOR NON-IMMERSIVE WET-CHEMICAL TREATMENT OF A PLANAR SUBSTRATE AND DEVICE FOR HOLDING THE SUBSTRATE 审中-实审
公开(公告)号：EP4332277A1
公开(公告)日：2024-03-06
申请号：EP22192691.8
申请日：2022-08-29
申请人： Atotech Deutschland GmbH & Co. KG
发明人： Schirmer, Christian , Schafsteller, Britta , Weinhold, Ray , Kiehl, Markus , Jang, Don , Lorenz, Olaf , Gaul, Florian
IPC分类号： C25D17/06 , C23G3/02 , H01L21/687 , B08B3/04 , B05C5/00
摘要： A device for holding a planar substrate (1) in an apparatus for non-immersive wet-chemical treatment of the substrate (1) comprises a support structure (34). The support structure (34) comprises at least one part (36a,b) for engaging a support such as to suspend the support structure (34) in the apparatus. The device comprises at least one clamping device, supported by the support structure (34), for holding the substrate (1) in a plane; and at least a first upper flow guidance part (37), arranged on one side of the plane and having an inward-facing surface (44) facing inwards and an outward-facing surface facing outwards with respect to the plane. The outward-facing surface comprises an upper outward-facing surface section (46), wettable by a stream of liquid directed onto the upper outward-facing surface section (46), and a lower outward-facing surface section (47), extending from a transition between at least a central part of the upper outward-facing surface section (46) and the lower outward-facing surface section (47) to a lower edge (49). A strip (45) of the inward-facing surface extends longitudinally along the lower edge (49) and transversely up to the lower edge (49). At least a central longitudinal section of the strip (45) is movable into engagement with a major surface of the substrate (1) over an entire length of that section.

4. 发明公开

EP4321655A1 DEVICE FOR ROTATABLY SUPPORTING A SECTION OF A SHAFT OF A ROLLER OF A CONVEYING SYSTEM, CORRESPONDING ASSEMBLY, CONVEYING SYSTEM AND APPARATUS FOR WET-CHEMICAL TREATMENT OF WORKPIECES 审中-实审
公开(公告)号：EP4321655A1
公开(公告)日：2024-02-14
申请号：EP22189748.1
申请日：2022-08-10
申请人： Atotech Deutschland GmbH & Co. KG
发明人： Wiener, Ferdinand , Bachmann, Falk , Scheller, Britta , Chen, Charles , Han, Frank
IPC分类号： C25D17/06 , B65G39/02 , H05K3/00
摘要： A device for rotatably supporting a section of a shaft (4) of a roller (2) of a conveying system in a bath of an apparatus for wet-chemical treatment of workpieces comprises at least one body (14). A space for receiving the shaft section is formed in the at least one body (14). The space comprises a first section (17) having a cross-section, centred on a reference axis (15), of which a perimeter lies on a circle over at least a majority of the perimeter; and a second section (18), extending in axial direction from the first section (17) to an axial end of the space. The second section (18) has, at multiple, e.g. all, axial positions, a respective cross-section of which a boundary, at at least one particular angular position (φ 0 ), is at a radial distance to the reference axis (15) equal to a length (Ri) of the radius of the circle and has a radius of curvature extending from the reference axis (15) to the boundary. The respective cross-sections of the second section (18) have, over at least a range of angular positions ([-φ 1 ,φ 1 ]) other than the particular angular positions (φ 0 ), a radial extent from the reference axis (15) that is increased with respect to the radial extent of the cross-section of the first section (17) at corresponding angular positions.

5. 发明授权

EP3168332B2 USE OF A JIG ELECTROLYTIC STRIPPER FOR REMOVING PALLADIUM FROM AN OBJECT AND A METHOD FOR REMOVING PALLADIUM 有权转让
公开(公告)号：EP3168332B2
公开(公告)日：2023-07-26
申请号：EP16764540.7
申请日：2016-01-29
发明人： YOSHIKANE, Yusuke , KITA, Koji
IPC分类号： C25D5/56 , C01B21/38 , C25D17/06 , C25F5/00 , C23C18/16 , C23C18/30

6. 发明公开

EP3885474A1 METHOD FOR A CHEMICAL AND/OR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE IN A PROCESS STATION 审中-实审
公开(公告)号：EP3885474A1
公开(公告)日：2021-09-29
申请号：EP20165608.9
申请日：2020-03-25
申请人： Semsysco GmbH
发明人： LATIFI, Aljbert , ÖTZLINGER, Herbert , MARKUT, Franz , GLEISSNER, Andreas
IPC分类号： C25D5/02 , C25D5/34 , C25D7/00 , C25D17/00 , C25D17/06 , C25D21/12
摘要： The invention relates to a method for a chemical and/or electrolytic surface treatment of a substrate in a process station and a process station for a chemical and/or electrolytic surface treatment of a substrate.
The method for a chemical and/or electrolytic surface treatment comprises the following steps, not necessarily in this order:
- mounting a substrate to be treated to a rotor unit,
- moving the rotor unit with the substrate into a pre-wetting chamber of the process station,
- applying a pre-wetting fluid to the substrate in the pre-wetting chamber,
- moving the rotor unit with the substrate at least partially out of the pre-wetting chamber,
- spinning the rotor unit with the substrate in a spinning plane to centrifugally reduce the pre-wetting fluid at a surface of the substrate,
- rotating the rotor unit with the substrate normal to the spinning plane so that the substrate faces away from the pre-wetting chamber,
- moving the rotor unit with the substrate into an electroplating chamber of the process station,
- applying an electrolyte liquid and an electric current to the substrate for an electroplating process on the substrate in the electroplating chamber, and
- moving the rotor unit with the substrate at least partially out of the electroplating chamber.

7. 发明公开

EP3884084A2 A PLATING HANGER FOR OBTAINING HOMOGENEOUS PLATING 无效
公开(公告)号：EP3884084A2
公开(公告)日：2021-09-29
申请号：EP19887346.5
申请日：2019-10-16
申请人： A-Plas Genel Otomotiv Mamulleri Sanayi Ve Ticaret Anonim Sirketi
发明人： AGAOGLU, Hasan , AKKAYA, Ali , OZTAS KAPLAN, Zahide , GELMEZ, Buket , USANMAZ, Yener
IPC分类号： C25D17/06

8. 发明公开

EP3828317A1 GESTELL FÜR DIE GALVANISIERUNG UND VERFAHREN ZUM SCHÜTZEN VON GESTELLEN FÜR DIE GALVANISIERUNG SOWIE VERWENDUNG EINES DERARTIGEN GESTELLS 有权
公开(公告)号：EP3828317A1
公开(公告)日：2021-06-02
申请号：EP20000270.7
申请日：2020-07-31
申请人： Bongiorno, Salvatore
发明人： Bongiorno, Salvatore
IPC分类号： C25D17/06 , B05D1/24 , C25D17/08
摘要： Ein Gestell für die Galvanisierung mit einem Grundkörper, der mit einer PVC-Schicht umgeben ist, weist eine Schutzschicht auf, die auf die PVC-Schicht aufgebracht ist. Dadurch wird die PVC-Schicht geschützt. Vorteilhaft ist es, wenn die Schutzschicht einen Fluorkohlenstoff aufweist und eingebrannt ist.

9. 发明公开

EP3725922A1 SUBSTRATE HOLDER RECEPTION APPARATUS 审中-实审转让
公开(公告)号：EP3725922A1
公开(公告)日：2020-10-21
申请号：EP19170254.7
申请日：2019-04-18
申请人： Atotech Deutschland GmbH
发明人： Weinhold, Ray , Lorenz, Olaf , Hahn, Roland , Sporer, Matthias
IPC分类号： C25D17/04 , C25D17/06 , H05K3/00 , B65G49/02 , C25D21/10
摘要： This invention concerns a substrate holder reception apparatus (1) for holding a substrate holder (3) that is connected to a substrate (2) for treatment in an electrolyte tank (14), the substrate holder reception apparatus (1) comprising a first positioning device (11), that comprises a first connection device (71) for connecting the substrate holder (3) and a first guiding device (41) for guiding the substrate holder (3) and a drive unit (43) for moving the substrate holder (3) relative to the electrolyte tank (14), and a second positioning unit (12), that comprises a second connection device (72) for connecting the substrate holder (3) and a second guiding device (42) for guiding the substrate holder (3), wherein, in a state of connection with the first connection device (71) and the second connection device (72) with the substrate holder (3), the first guide device (41) and the second guiding device (42) are movable together with the substrate holder (3) by the drive unit (43), wherein the first guide device (41) and the second guide device (42) are movable independently from each other in a state of disconnection of the first connection device (71) and the second connection device (72) from the substrate holder (3) and the second guiding device (42) is connected to a spring mechanism (5) which, in the disconnected state, is configured to move the second guiding device (42) to the loading position. The invention further concerns an electrochemical treatment apparatus (1000). (Fig. 1)

10. 发明授权

EP3309279B1 WAFER-LIKE SUBSTRATE PROCESSING METHOD, APPARATUS AND USE THEREOF 有权
公开(公告)号：EP3309279B1
公开(公告)日：2020-07-15
申请号：EP16193990.5
申请日：2016-10-14
申请人： Atotech Deutschland GmbH
发明人： RAUENBUSCH, Ralph , BUSSENIUS, Tobias , BUCHBERGER, Daniel , WEINHOLD, Ray
IPC分类号： C25D17/00 , C25D17/06 , H01L21/677 , H01L21/683 , C25F1/00 , C23C18/16 , C23F1/00

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