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1. 发明公开

EP2524763A1 SOLDER PASTE 有权转让
标题翻译： LÖTPASTE
公开(公告)号：EP2524763A1
公开(公告)日：2012-11-21
申请号：EP10835925.8
申请日：2010-12-06
申请人： Arakawa Chemical Industries, Ltd. , Toyota Jidosha Kabushiki Kaisha , Denso Corporation , Fujitsu Ten Limited , Koki Company Limited , Harima Chemicals, Inc.
发明人： IWAMURA, Eiji , GOTOH, Kazushi , ISHIGA, Fumio , YOSHIOKA, Takayasu , UTSUNO, Masayoshi , NAKAMURA, Atsuo , OKOCHI, Teruo , SANJI, Masaki , SUKEKAWA, Takuji , IKEDO, Kenshi , ANDOH, Yoshiyuki , SHIRAI, Takeshi , MORI, Kimiaki , WADA, Rie , NAKANISHI, Kensuke , AIHARA, Masami , KUMAMOTO, Seishi
IPC分类号： B23K35/363 , H05K3/34 , B23K35/26 , C22C12/00 , C22C13/00
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.
摘要翻译：公开了一种焊膏，其在焊剂内包含具有分子量不超过250的二元酸，分子量在150至300的一元酸的活化剂和具有分子量在300至600的范围内; 和至少一种选自包括高密度聚乙烯和聚丙烯的树脂添加剂。焊膏在助焊剂内的4质量％〜12质量％的树脂添加剂的范围内，焊膏在80℃下的粘度为400Pa·s以上。

2. 发明授权

EP2818585B1 FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM 有权
公开(公告)号：EP2818585B1
公开(公告)日：2019-11-27
申请号：EP13751478.2
申请日：2013-02-21
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki , YOSHIOKA, Takayasu
IPC分类号： C25D17/12 , C25D3/00 , C25D5/02 , C25D5/34 , C25D5/08 , C25D17/00 , C25D17/14 , C25D3/38

3. 发明公开

EP2511043A1 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 有权转让
标题翻译： FLUSSMITTELFÜREINELÖTPASTEUNDLÖTPASTE
公开(公告)号：EP2511043A1
公开(公告)日：2012-10-17
申请号：EP10835926.6
申请日：2010-12-06
申请人： Arakawa Chemical Industries, Ltd. , Toyota Jidosha Kabushiki Kaisha , Denso Corporation , Fujitsu Ten Limited , Koki Company Limited , Harima Chemicals, Inc.
发明人： IWAMURA, Eiji , GOTOH, Kazushi , NAGASAKA, Shinsuke , YOSHIOKA, Takayasu , UTSUNO, Masayoshi , NAKAMURA, Atsuo , OKOCHI, Teruo , SANJI, Masaki , SUKEKAWA, Takuji , IKEDO, Kenshi , ANDOH, Yoshiyuki , SHIRAI, Takeshi , MORI, Kimiaki , WADA, Rie , NAKANISHI, Kensuke , AIHARA, Masami , KUMAMOTO, Seishi
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).
摘要翻译：公开了即使在通过丝网印刷法等反复施加剪切力之后也具有足够的流动性的焊膏。具体公开了一种用于焊膏的焊剂，其包含：通过使具有C 6 -C 15烷基的（甲基）丙烯酸酯和除上述以外的（甲基）丙烯酸酯）自由基共聚得到的丙烯酸树脂（甲基）丙烯酸酯; 和松香。当松香的重量为1时，丙烯酸树脂的重量比为0.5-1.2（含），通过施加10-150Pa（含）的剪切力使焊膏的焊剂流动，。

4. 发明授权

EP2524763B1 SOLDER PASTE 有权转让
公开(公告)号：EP2524763B1
公开(公告)日：2018-12-05
申请号：EP10835925.8
申请日：2010-12-06
申请人： Arakawa Chemical Industries, Ltd. , TOYOTA JIDOSHA KABUSHIKI KAISHA , Denso Corporation , DENSO TEN Limited , Koki Company Limited , Harima Chemicals, Inc.
发明人： IWAMURA, Eiji , GOTOH, Kazushi , ISHIGA, Fumio , YOSHIOKA, Takayasu , UTSUNO, Masayoshi , NAKAMURA, Atsuo , OKOCHI, Teruo , SANJI, Masaki , SUKEKAWA, Takuji , IKEDO, Kenshi , ANDOH, Yoshiyuki , SHIRAI, Takeshi , MORI, Kimiaki , WADA, Rie , NAKANISHI, Kensuke , AIHARA, Masami , KUMAMOTO, Seishi
IPC分类号： B23K35/36 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

5. 发明授权

EP2511043B1 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 有权转让
公开(公告)号：EP2511043B1
公开(公告)日：2018-07-11
申请号：EP10835926.6
申请日：2010-12-06
申请人： Arakawa Chemical Industries, Ltd. , TOYOTA JIDOSHA KABUSHIKI KAISHA , Denso Corporation , Fujitsu Ten Limited , Koki Company Limited , Harima Chemicals, Inc.
发明人： IWAMURA, Eiji , GOTOH, Kazushi , NAGASAKA, Shinsuke , YOSHIOKA, Takayasu , UTSUNO, Masayoshi , NAKAMURA, Atsuo , OKOCHI, Teruo , SANJI, Masaki , SUKEKAWA, Takuji , IKEDO, Kenshi , ANDOH, Yoshiyuki , SHIRAI, Takeshi , MORI, Kimiaki , WADA, Rie , NAKANISHI, Kensuke , AIHARA, Masami , KUMAMOTO, Seishi
IPC分类号： H05K3/34 , B23K35/36 , B23K35/362 , C22C13/00 , B23K35/02
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

6. 发明公开

EP2818585A1 FILM FORMATION DEVICE AND FILM FORMATION METHOD FOR FORMING METAL FILM 有权
标题翻译： FILMBILDUNGSVORRICHTUNG电影电视节目ZUR HERSTELLUNG VON METALLSCHICHTEN
公开(公告)号：EP2818585A1
公开(公告)日：2014-12-31
申请号：EP13751478.2
申请日：2013-02-21
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： HIRAOKA, Motoki , YANAGIMOTO, Hiroshi , SATO, Yuki , YOSHIOKA, Takayasu
IPC分类号： C25D17/12 , C25D17/14
摘要： Provided are a film formation device and a film formation method for forming a metal film, with which metal films with a desired thickness can be continuously formed on surfaces of a plurality of substrates. A film formation device 1A includes at least a positive electrode 11, a negative electrode 12, a solid electrolyte membrane 13 arranged on a surface of the positive electrode 12, between the positive electrode and a substrate to serve as the negative electrode, and a power supply unit E adapted to apply a voltage across the positive electrode 11 and the substrate B. A voltage is applied across the positive electrode 11 and the substrate B to deposit metal on a surface of the substrate from metal ions contained in the solid electrolyte membrane 13, whereby a metal film F made of metal is formed. The positive electrode 11 is made of a porous body that allows a solution L containing metal ions to pass therethrough and supplies the metal ions to the solid electrolyte membrane 13.
摘要翻译：提供一种用于形成金属膜的成膜装置和成膜方法，可以在多个基板的表面上连续地形成具有所需厚度的金属膜。成膜装置1A至少包括正极11，负极12，布置在正极12的表面上的固体电解质膜13，正极和基板之间用作负极，功率供给单元E适于在正电极11和基板B两端施加电压。在正电极11和基板B两端施加电压，以将固体电解质膜13中所含的金属离子上的金属沉积在基板的表面上由此形成由金属制成的金属膜F. 正极11由允许包含金属离子的溶液L通过并将金属离子供给固体电解质膜13的多孔体制成。

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