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    • 7. 发明公开
    • APPARATUS AND METHOD FOR FORMING METAL COATING FILM
    • 用于形成金属涂层膜的装置和方法
    • EP2980281A1
    • 2016-02-03
    • EP14774595.4
    • 2014-02-04
    • TOYOTA JIDOSHA KABUSHIKI KAISHA
    • SATO, YukiHIRAOKA, MotokiYANAGIMOTO, Hiroshi
    • C25D17/00C25D7/12C25D3/00C25D17/10
    • C25D5/00C25D3/00C25D3/38C25D7/00C25D17/00C25D17/002C25D17/10C25D17/12
    • To provide a film formation apparatus and a film formation method for forming a metal film that can continuously form metal films with desired thickness on the surfaces of a plurality of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation apparatus includes an anode (11); a solid electrolyte membrane (13) disposed between the anode and a substrate (B) serving as a cathode such that a metal ion solution (L) is disposed on the anode (11) side thereof; and a power supply portion (14) adapted to apply a voltage across the anode (11) and the substrate (B). A voltage is applied across the anode (11) and the substrate (B) to deposit metal out of the metal ions contained in the solid electrolyte membrane (13) onto the surface of the substrate (B), thereby forming a metal film (F) made of the metal of the metal ions. The anode (11) has a base material (11a), which is insoluble in the metal ion solution (L), and a metal plating film (11c), which is made of the same metal as the metal film (F), formed over the base material (11a).
    • 本发明提供一种成膜装置和成膜方法,其能够在多个基板的表面上连续形成所希望的厚度的金属膜,并且能够抑制金属膜的异常并提高成膜速度。 成膜装置包括阳极(11); 配置在阳极与作为阴极的基板(B)之间,在阳极(11)侧配置金属离子溶液(L)的固体电解质膜(13) 和适于在阳极(11)和衬底(B)上施加电压的电源部分(14)。 在阳极(11)和基板(B)之间施加电压,使固体电解质膜(13)中含有的金属离子中的金属析出到基板(B)的表面,形成金属膜(F )由金属离子的金属制成。 阳极(11)具有不溶于金属离子溶液(L)的基材(11a)和由与金属膜(F)相同的金属构成的金属镀膜(11c) 覆盖基材(11a)。