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1. 发明公开

EP4414478A1 FILM FORMING METHOD FOR METAL FILM 审中-实审
公开(公告)号：EP4414478A1
公开(公告)日：2024-08-14
申请号：EP24155479.9
申请日：2024-02-02
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： INAGAKI, Koji , MURAI, Jyunya , YOSHITOMI, Jun , SATO, Yoji , YAMASHITA, Osamu , NAKATA, Hiromichi , NISHIYAMA, Masaaki
IPC分类号： C25D3/00 , C25D17/00
CPC分类号： C25D17/002 , C25D3/00 , C25D21/10 , C25D5/08
摘要： A film forming method for a metal film (F) includes steps of, after a substrate material (B) is mounted on a mounting table (40), forming the metal film (F) on a surface of the substrate material (B) with a plating solution (L) brought into contact with the substrate material (B) through an electrolyte membrane (13), and with the plating solution (L) sealed, separating the electrolyte membrane (13) from the substrate material (B) by moving at least one of the mounting table (40) and a container (15) in a direction away from the other. The plating solution (L) contained in the container (15) is circulated through a circulation path (50) outside the container (15), before or during the film forming step. A circulation path (50) is blocked and the plating solution (L) in the container (15) is sealed, before this separating step.

2. 发明公开

EP3953419A1 POLYMER COMPOSITIONS SUITABLE FOR PRODUCING PLATED PRODUCTS 有权
公开(公告)号：EP3953419A1
公开(公告)日：2022-02-16
申请号：EP20711619.5
申请日：2020-03-23
申请人： Basell Poliolefine Italia S.r.l.
发明人： LUNGHI, Luca , LUJAN ABARCA, Maria Aranzazu , FOGUET ROCA, Alberto
IPC分类号： C08L23/12 , C25D3/00 , C25D5/14 , C25D5/56 , C25D7/00 , C23C18/16 , C23C18/20 , C23C18/24 , C23C18/26 , C23C18/28 , C23C18/30 , C25D5/12 , C23C18/52

3. 发明授权

EP2449154B1 PLATING OR COATING METHOD FOR PRODUCING METAL-CERAMIC COATING ON A SUBSTRATE 有权转让
公开(公告)号：EP2449154B1
公开(公告)日：2021-09-29
申请号：EP10794416.7
申请日：2010-06-29
发明人： GAO, Wei , CHEN, Weiwei
IPC分类号： C25D3/00 , C23C18/16 , C23C18/54 , C25D21/14 , C25D15/02 , C23C18/31 , C25D15/00 , C25D3/12 , C25D3/56

4. 发明公开

EP3461934A1 FILM FORMING METHOD FOR METAL FILM AND FILM FORMING APPARATUS FOR METAL FILM 有权
公开(公告)号：EP3461934A1
公开(公告)日：2019-04-03
申请号：EP18194887.8
申请日：2018-09-17
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： IISAKA, Hirofumi
IPC分类号： C25D17/00 , C25D3/00 , C25D5/02 , C25D7/12 , C25D3/12 , C25D17/12
摘要： A solid electrolyte membrane (13) is disposed between an anode (11) and a substrate (W), and voltage is applied between the anode (11) and the substrate (W) while the solid electrolyte membrane (13) is pressed onto the substrate (W) so as to form a metal film (F) on the substrate (W). In this film forming method, there is used the solid electrolyte membrane (13) that includes: a first portion (13a) made of an ion permeable material; and a second portion (13b) made of a material having an electric insulating property and having a low permeability of metallic ions, the second portion (13b) being embedded in the first portion (13a) so as to be exposed from a surface of the solid electrolyte membrane (13), the surface of the solid electrolyte membrane (13) facing the substrate (W).

5. 发明公开

EP2454496A4 MOUNTING SCREW, METHOD AND ARRANGEMENT 有权转让
公开(公告)号：EP2454496A4
公开(公告)日：2018-01-17
申请号：EP10799480
申请日：2010-07-14
申请人： KINGI OY
发明人： KINNUNEN JORMA
IPC分类号： F16B33/00 , B05D1/18 , C23C22/60 , C23C22/62 , C23C22/64 , C23C22/66 , C25D3/00
CPC分类号： F16B33/008 , B05D3/102 , B05D7/16 , B05D7/54 , B05D2350/20 , C09D5/08 , C23C8/80 , C23C22/60 , C23C22/62 , C23C22/64 , C23C22/66 , C23C22/83 , C23C28/00 , C23C28/321 , C23C28/3225 , C23C28/345 , C23C2222/20 , C23F13/08 , C25D13/20 , F16B25/103 , F16B43/001
摘要： A mounting screw (1) as well as a method and arrangement for manufacturing it. The mounting screw (1) comprises a metallic basic body part (3) and it is at least partly painted. The mounting screw (1) comprises two or more paint coat layer (5, 6), of which the ground coat layer (5) comprises a component that increases corrosion resistance.

6. 发明公开

EP3055897A4 ELECTROCHEMICAL METHOD AND APPARATUS FOR FORMING A VACUUM IN A SEALED ENCLOSURE 有权
标题翻译：用于产生真空密封外壳的电化学方法和设备
公开(公告)号：EP3055897A4
公开(公告)日：2017-06-07
申请号：EP14852415
申请日：2014-10-03
申请人： SCHERSON DANIEL
发明人： SCHERSON DANIEL
IPC分类号： H01J7/18 , C25D3/00 , C25D17/00 , C25D17/10 , C25D21/04 , C25D21/12 , F04B37/02 , F16L59/06 , H01M16/00
CPC分类号： C25D21/04 , C25D3/00 , C25D5/48 , C25D17/00 , C25D17/002 , C25D17/10 , C25D21/12 , F04B37/02 , F16L59/065 , H01J7/18 , H01J9/385 , H01M16/00
摘要： An apparatus for forming a vacuum in a sealed enclosure through an electrochemical reaction includes an electrochemical cell comprising a cathode and an anode supported on a solid electrolyte. The solid electrolyte is a Li-ion non-volatile electrolyte containing a dissolved metal salt. The cathode is constructed of a material with which lithium is known to form alloys. The anode is constructed of a lithium-ion containing material. The cell is operable to expose lithium metal on the cathode.
摘要翻译：用于通过形成在密封外壳中的真空，以电化学反应的装置包括在电化学电池，包括阴极和阳极，以支承在固体电解质。固体电解质是含有溶解的金属盐的锂离子非易失性电解质。阴极被构造有已知以形成锂合金的材料制成。阳极被构筑的锂离子的材料组成。所述细胞是可操作以对所述阴极暴露的锂金属。

7. 发明公开

EP3105369A1 METHOD OF FORMING METAL COATING 有权
标题翻译：一种用于生产METALLBESCHICHTUNG
公开(公告)号：EP3105369A1
公开(公告)日：2016-12-21
申请号：EP15708571.3
申请日：2015-02-09
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： YANAGIMOTO, Hiroshi , HIRAOKA, Motoki , SATO, Yuki , SHINMEI, Yoshitaka
IPC分类号： C25D3/00 , C25D5/02 , C25D5/18 , C25D5/06 , C25D17/12 , C25D17/14 , C25D17/00 , C25D5/12 , C25D3/12
CPC分类号： C25D5/18 , C25D3/00 , C25D3/12 , C25D5/02 , C25D5/06 , C25D5/12 , C25D17/001 , C25D17/12 , C25D17/14
摘要： A method of forming a metal coating includes: disposing a solid electrolyte membrane (13) between an anode (11) and a substrate (B) which forms a cathode; bringing a solution (L) containing metal ions into contact with an anode-side portion of the solid electrolyte membrane (13); and causing, in a state where the solid electrolyte membrane (13) is in contact with the substrate (B), a current to flow from the anode (11) to the cathode so as to form a metal coating formed of the metal on the surface of the substrate (B). The metal coating is formed by repeating a current-flowing period (T) in which a current flows from the anode (11) to the cathode and a non-current-flowing period (N) in which a current does not flow between the anode (11) and the cathode.

8. 发明公开

EP2980281A1 APPARATUS AND METHOD FOR FORMING METAL COATING FILM 有权
标题翻译：用于形成金属涂层膜的装置和方法
公开(公告)号：EP2980281A1
公开(公告)日：2016-02-03
申请号：EP14774595.4
申请日：2014-02-04
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： SATO, Yuki , HIRAOKA, Motoki , YANAGIMOTO, Hiroshi
IPC分类号： C25D17/00 , C25D7/12 , C25D3/00 , C25D17/10
CPC分类号： C25D5/00 , C25D3/00 , C25D3/38 , C25D7/00 , C25D17/00 , C25D17/002 , C25D17/10 , C25D17/12
摘要： To provide a film formation apparatus and a film formation method for forming a metal film that can continuously form metal films with desired thickness on the surfaces of a plurality of substrates, and increase the film forming speed while suppressing abnormality of the metal films. A film formation apparatus includes an anode (11); a solid electrolyte membrane (13) disposed between the anode and a substrate (B) serving as a cathode such that a metal ion solution (L) is disposed on the anode (11) side thereof; and a power supply portion (14) adapted to apply a voltage across the anode (11) and the substrate (B). A voltage is applied across the anode (11) and the substrate (B) to deposit metal out of the metal ions contained in the solid electrolyte membrane (13) onto the surface of the substrate (B), thereby forming a metal film (F) made of the metal of the metal ions. The anode (11) has a base material (11a), which is insoluble in the metal ion solution (L), and a metal plating film (11c), which is made of the same metal as the metal film (F), formed over the base material (11a).
摘要翻译：本发明提供一种成膜装置和成膜方法，其能够在多个基板的表面上连续形成所希望的厚度的金属膜，并且能够抑制金属膜的异常并提高成膜速度。成膜装置包括阳极（11）; 配置在阳极与作为阴极的基板（B）之间，在阳极（11）侧配置金属离子溶液（L）的固体电解质膜（13）和适于在阳极（11）和衬底（B）上施加电压的电源部分（14）。在阳极（11）和基板（B）之间施加电压，使固体电解质膜（13）中含有的金属离子中的金属析出到基板（B）的表面，形成金属膜（F ）由金属离子的金属制成。阳极（11）具有不溶于金属离子溶液（L）的基材（11a）和由与金属膜（F）相同的金属构成的金属镀膜（11c）覆盖基材（11a）。

9. 发明公开

EP2959030A1 METHOD FOR MANUFACTURING A METAL COATED AND HOT-FORMED STEEL COMPONENT AND A METAL COATED STEEL STRIP PRODUCT 审中-公开
标题翻译：方法用于生产金属涂层和热成形钢部件和金属钢带产品
公开(公告)号：EP2959030A1
公开(公告)日：2015-12-30
申请号：EP14754753.3
申请日：2014-02-21
申请人： Rautaruukki OYJ
发明人： PEURA, Pasi , LAATIKAINEN, Mika , LANKILA, Arimo , LYYTINEN, Oskari
IPC分类号： C23C2/04 , C23C2/40 , C21D8/02 , C21D9/46 , C21D9/52 , C21D7/13 , C23C2/06 , C25D3/00
CPC分类号： C23C2/40 , C21D1/673 , C21D6/005 , C21D7/13 , C21D8/0473 , C21D8/0478 , C21D9/48 , C21D2211/001 , C21D2211/005 , C21D2211/008 , C23C2/02 , C23C2/06 , C23C2/26 , C23C2/28 , C25D5/36 , C25D5/50 , C25D7/0614
摘要： The present invention relates to a method for manufacturing a metal coated and hot-formed steel component by direct hot-forming techniques and to a metal coated steel strip product for direct hot-forming. Improvements in mechanical properties of the metal coated and hot-formed steel component are difficult to be obtained without weakening the weldability. According to the invention, the grain structure of a metal coated steel strip made of hardenable steel alloy is deformed comprising non-recrystallized grains and a yield ratio (YS/TS) of said steel strip is higher than 0.75. Recrystallization of said grain structure is at least retarded or even totally avoided or leaved out prior to and during applying metal coating on the surface of the steel strip. This kind of material cannot be used in indirect press hardening, but fits excellently to direct hot press forming and provides possibility to affect mechanical properties without weakening weldability.

10. 发明公开

EP2753731A1 ELECTRODEPOSITION OF HARD MAGNETIC COATINGS 审中-公开
标题翻译：电镀HART磁性涂层
公开(公告)号：EP2753731A1
公开(公告)日：2014-07-16
申请号：EP12829576.3
申请日：2012-08-08
申请人： MacDermid Acumen, Inc.
发明人： PEARSON, Trevor , LIU, Yun, Li , STEINECKER, Carl P. , BECKETT, Duncan P.
IPC分类号： C25D3/56 , C25D3/00
CPC分类号： C25D3/562 , C25D7/001 , H01F41/26 , Y10T428/31678
摘要： An aqueous electrolytic plating solution and a method, of using the same for depositing a cobalt/nickel/phosphorus alloy on an electrically conductive substrate are provided. The aqueous electrolytic plating solution comprises: a) a source of nickel ions; b) a source of cobalt ions; c) a source of phosphite ions; d) an amino acid; and e) optionally, boric acid. The deposited cobalt/nickel/phosphorus alloy exhibits high coercivity and high remanence.

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