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1. 发明公开

EP2287931A2 A light emitting diode package 审中-公开
标题翻译： Gehäusefürlichtemittierende二极管
公开(公告)号：EP2287931A2
公开(公告)日：2011-02-23
申请号：EP10171947.4
申请日：2010-08-05
申请人： Samsung LED Co., Ltd.
发明人： Lee, Jin Bock , Park, Hee Seok , Kim, Hyung Kun , Lee, Young Jin
IPC分类号： H01L33/48 , H01L33/62 , H01L33/60
CPC分类号： H01L33/483 , H01L24/48 , H01L24/73 , H01L33/60 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; a n LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.
摘要翻译：本发明提供了一种发光二极管封装，其包括：封装模具，其具有第一空腔和具有比第一空腔小的尺寸的第二空腔; 分别设置在第一腔和第二腔的底表面上的第一和第二电极焊盘; 安装在第一电极焊盘上的n个LED芯片; 用于在所述LED芯片和所述第二电极焊盘之间提供电连接的导线; 以及填充在第一腔和第二腔内的成型材料。

2. 发明公开

EP2448015A2 Semiconductor light emitting device 有权转让
标题翻译：半导体发光器件
公开(公告)号：EP2448015A2
公开(公告)日：2012-05-02
申请号：EP11187247.9
申请日：2011-10-31
申请人： Samsung LED Co., Ltd.
发明人： Hwang, Seok Min , Kim, Jae Yoon , Lee, Jin Bock
IPC分类号： H01L33/38
CPC分类号： H01L33/38 , H01L33/42 , H01L2933/0016
摘要： A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.
摘要翻译：一种半导体发光器件包括：第一和第二导电型半导体层; 设置在第一和第二导电类型半导体层之间的有源层; 以及分别设置在所述第一导电类型半导体层和所述第二导电类型半导体层中的每一个的一个表面上的第一电极和第二电极，其中所述第一电极和所述第二电极中的至少一个包括焊盘部分和形成为从所述焊盘部分延伸的指状部分，手指部分的末端具有环形形状。由于电流集中在手指部分的局部区域的现象被最小化，因此可以增强对静电放电（ESD）的容忍度并且可以改善光提取效率。

3. 发明公开

EP2362420A1 Semiconductor Light Emitting Device Having Multi-Cell Array, Light Emitting Module, and Illumination Apparatus 有权转让
标题翻译：具有多单元阵列的半导体发光器件，发光模块和照明装置
公开(公告)号：EP2362420A1
公开(公告)日：2011-08-31
申请号：EP11156194.0
申请日：2011-02-28
申请人： Samsung LED Co., Ltd.
发明人： Lee, Su Yeol , Kim, Yong Tae , Lee, Jin Bock , Kim, Gi Bum
IPC分类号： H01L27/15 , H01L33/62 , H01L33/30
CPC分类号： H01L27/156 , H01L24/24 , H01L27/153 , H01L33/30 , H01L33/62 , H01L2224/48091 , H01L2924/12041 , H01L2924/12042 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor light emitting device includes a substrate; a plurality of light emitting cells disposed on the top surface of the substrate, the light emitting cells each having an active layer; a plurality of connection parts formed on the substrate with the light emitting cells formed thereon to connect the light emitting cells in a parallel or series-parallel configuration; and an insulation layer formed on the surface of the light emitting cell to prevent an undesired connection between the connection parts and the light emitting cell. The light emitting cells comprise at least one defective light emitting cell, and at least one of the connection parts related to the defective light emitting cell is disconnected.
摘要翻译：一种半导体发光器件，包括：衬底; 多个发光单元，设置在所述基板的顶表面上，所述发光单元各自具有有源层; 多个连接部分，形成在衬底上，其上形成有发光单元，以并联或串并联配置连接发光单元; 以及形成在发光单元的表面上的绝缘层，以防止连接部分与发光单元之间的不期望的连接。发光单元包括至少一个有缺陷的发光单元，并且与有缺陷的发光单元有关的至少一个连接部分被断开。

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