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1. 发明公开

EP2528122A1 Light emitting device 审中-公开
标题翻译：发光装置
公开(公告)号：EP2528122A1
公开(公告)日：2012-11-28
申请号：EP12162158.5
申请日：2012-03-29
申请人： Samsung LED Co., Ltd.
发明人： You, Jae Sung , Song, Jong Sup
IPC分类号： H01L33/58 , H01L25/075 , F21V5/04
CPC分类号： H01L25/0753 , G02B19/0014 , G02B19/0066 , H01L33/54 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A light emitting device includes: a substrate (10) having a bar shape; a plurality of light emitting elements (30) separately mounted in a lengthwise direction of the substrate (10) on an upper surface of the substrate (10); and a light-transmissive cover (20) formed to be upwardly convex, having one or more localized concave portions (21), and installed on the substrate (20) to cover at least two of the plurality of light emitting elements (30) together.
摘要翻译：发光装置包括：棒状的基板（10）多个发光元件（30），分别安装在基板（10）的上表面上的基板（10）的长度方向上; 和形成为向上凸出的具有一个或多个局部凹入部分（21）的透光盖（20），并且安装在基底（20）上以将多个发光元件（30）中的至少两个一起覆盖。

2. 发明公开

EP2528116A1 Semiconductor Light Emitting Device and Method of Manufacturing the Same 有权转让
标题翻译： Lichtemittierendes Halbleiterbauelement und Verfahren zu dessen Herstellung
公开(公告)号：EP2528116A1
公开(公告)日：2012-11-28
申请号：EP12169106.7
申请日：2012-05-23
申请人： Samsung LED Co., Ltd.
发明人： Kim, Tae Hun , Chae, Seung Wan , Kim, Yong Il , Lee, Seung Jae , Jang, Tae Sung , Sohn, Jong Rak , Kim, Bo Kyoung
IPC分类号： H01L33/20 , H01L33/46
CPC分类号： H01L33/46 , H01L33/20 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49107 , H01L2224/73265 , H01L2224/83385 , H01L2924/00014 , H01L2924/00
摘要： There is provided a semiconductor light emitting device including: a light transmissive substrate; a light emitting part; first and second electrodes electrically connected to the first and second conductivity type semiconductor layers, respectively; and a rear reflective part including a reflective metallic layer, and a light transmissive dielectric layer interposed between the light transmissive substrate and the reflective metallic layer.
摘要翻译：提供了一种半导体发光器件，包括：透光基板; 发光部分; 分别与第一和第二导电类型半导体层电连接的第一和第二电极; 以及包括反射金属层的后反射部分和介于透光基板和反射金属层之间的透光电介质层。

3. 发明公开

EP2525419A2 Light emitting device package and manufacturing method thereof 有权转让
标题翻译：发光器件封装及其制造方法
公开(公告)号：EP2525419A2
公开(公告)日：2012-11-21
申请号：EP12160241.1
申请日：2012-03-20
申请人： Samsung LED Co., Ltd.
发明人： You, Jae Sung , Song, Young Hee
IPC分类号： H01L33/50 , H01L33/64 , H01L33/62
CPC分类号： H01L33/505 , H01L24/32 , H01L33/486 , H01L33/504 , H01L33/62 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H01L2924/12041 , H01L2924/15787 , H01L2933/0033 , H01L2924/00012 , H01L2924/00 , H01L2924/00014
摘要： There is provided a light emitting device package including: a substrate (10)having a cavity (14) formed therein; a heat sink provided on a bottom surface of the cavity to be adjacent to an inner wall of the cavity; a light emitting device (40) mounted on the heat sink; and a phosphor layer (50) provided within the cavity and covering the heat sink and the light emitting device.
摘要翻译：提供了一种发光器件封装，包括：衬底（10），其具有在其中形成的空腔（14）;衬底散热器，设置在所述空腔的底表面上以与所述空腔的内壁相邻; 安装在散热器上的发光器件（40）以及设置在所述空腔内并覆盖所述散热器和所述发光器件的荧光体层（50）。

4. 发明公开

EP2506315A2 Light-emitting device and method of manufacturing the same 审中-公开
标题翻译：发光装置及其制造方法
公开(公告)号：EP2506315A2
公开(公告)日：2012-10-03
申请号：EP12160657.8
申请日：2012-03-22
申请人： Samsung LED Co., Ltd.
发明人： Paek, Ho-sun , KIM, Hak-hwan , Oh, Sung-kyong
IPC分类号： H01L33/00 , H01L33/38 , H01L33/44 , H01L33/20
摘要： A light-emitting device and a method of manufacturing the same are provided. The light-emitting device (100) includes a compound semiconductor structure (120) having a first N-type compound semiconductor layer (123), an active layer (122), and a P-type compound semiconductor layer (121), a P-type electrode layer (150) that is disposed on the P-type compound semiconductor layer and electrically connects with the P-type compound semiconductor layer, at least one insulation wall (131,132) disposed on the compound semiconductor structure and the P-type electrode layer, at least one N-type electrode layer (141,142) penetrating the at least one insulation wall, and a conductive substrate (170) in which at least one N-type electrode connecting layer (171,172) corresponding to the N-type electrode layer is separated from a P-type electrode connecting layer (173) corresponding to the P-type electrode layer.
摘要翻译：提供了一种发光器件及其制造方法。发光器件（100）包括具有第一N型化合物半导体层（123），有源层（122）和P型化合物半导体层（121）的化合物半导体结构（120），P 型电极层（150），其设置在所述P型化合物半导体层上并与所述P型化合物半导体层电连接;至少一个设置在所述化合物半导体结构上的绝缘壁（131,132）和所述P型电极层，穿透所述至少一个绝缘壁的至少一个N型电极层（141,142），以及导电衬底（170），其中至少一个N型电极连接层（171,172）对应于所述N型电极层与对应于P型电极层的P型电极连接层（173）分离。

5. 发明公开

EP2500626A2 LED engine for illumination 审中-公开
标题翻译： LeuchtmodulefürBeleuchtung
公开(公告)号：EP2500626A2
公开(公告)日：2012-09-19
申请号：EP12158790.1
申请日：2012-03-09
申请人： Samsung LED Co., Ltd.
发明人： Koo, Won-hoe , Woo, Yun-seok , Lim, Dong-il , Han, Deok-hee , Park, Chul , Lee, Il-seok
IPC分类号： F21S8/02 , F21V19/00
CPC分类号： F21V19/001 , F21K9/00 , F21S2/005 , F21V5/007 , F21V29/508 , F21V29/713 , F21Y2105/10 , F21Y2115/10 , H01L27/156 , H01L33/504 , H01L2224/48091 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： A light-emitting device (LED) engine (100) includes: a body (110) having a through-hole; a light-emitting module (130) that is disposed under the body, includes at least one light emitting device (C), and is disposed to expose a light-emitting surface via the through-hole; and a printed circuit board (120)(PCB) which is disposed under the body, to which the light-emitting module (130) is coupled, and includes a terminal unit for supplying power to the light-emitting module (130).
摘要翻译：发光装置（LED）发动机（100）包括：主体（110），具有通孔; 设置在所述主体下方的发光模块（130）包括至少一个发光装置（C），并且设置成经由所述通孔露出发光表面; 以及布置在所述主体下方的所述发光模块（130）耦合的印刷电路板（PCB），并且包括用于向所述发光模块（130）供电的端子单元。

6. 发明公开

EP2498581A2 LIGHTING CONTROL APPARATUS 有权转让
标题翻译：照明控制
公开(公告)号：EP2498581A2
公开(公告)日：2012-09-12
申请号：EP10827173.5
申请日：2010-11-02
申请人： Samsung LED Co., Ltd.
发明人： OH, Tae Keun , CHO, Ho Chan , KIM, Chang Seob , KWAG, Heui Sam , PARK, Jung Hwan , JUNG, Jin Sun , LEE, Dong-Won , YUN, Sang Kyeong , YANG, Haeng Seok
IPC分类号： H05B37/02
CPC分类号： H05B37/0272 , H05B33/0869 , H05B37/02 , H05B37/0218 , H05B37/0227 , H05B41/325
摘要： Disclosed is a lighting control apparatus. According to one embodiment of the present invention, a lighting system control be easily configured, maintained, and repaired since additional light and block control of the lighting can be provided with ease by wireless control of the lighting through wireless communication. In addition, the present invention can control individual lamps by storing a control signal corresponding to an address for each lamp in a gateway according to a predetermined scenario.

7. 发明公开

EP1717872A3 Method of producing nitride layer and method of fabricating vertical semiconductor light emitting device 审中-公开
标题翻译：一种用于制造氮化物层和垂直发光半导体组件的方法
公开(公告)号：EP1717872A3
公开(公告)日：2012-08-22
申请号：EP06252227.1
申请日：2006-04-26
申请人： Samsung LED Co., Ltd.
发明人： Park, Hee Seok , Koike, Masayoshi, Samsung Electro-Mecanics Co. Ltd , Min, Kyeong Ik
IPC分类号： H01L33/00 , H01L21/762 , C30B29/40 , C30B33/00
CPC分类号： C30B29/403 , C30B29/64 , C30B33/00 , H01L21/0242 , H01L21/02447 , H01L21/0254 , H01L21/02664 , H01L33/007 , H01L33/0079
摘要： The present invention provides methods for manufacturing a nitride layer and a vertical nitride semiconductor light emitting device. In manufacturing the nitride layer according to the invention, a sapphire substrate is prepared. A buffer layer made of a material having a melting point and a thermal conductivity higher than those of nitride is formed on the sapphire substrate. Also, the nitride layer is formed on the buffer layer. Then a laser beam is irradiated to an underside of the sapphire substrate to remove the nitride layer. According to the invention, the nitride layer is made of a material having a composition expressed by AlxIn y Ga (1-x-y) N, where 0≤x≤1, 0≤y≤1, and 0≤x+y≤1. In addition, the buffer layer is made of SiC.

8. 发明公开

EP2477241A2 Method and Apparatus for Depositing Phosphor on Semiconductor Light-Emitting Device 审中-公开
标题翻译：用于发光的半导体器件上沉积磷的方法和装置
公开(公告)号：EP2477241A2
公开(公告)日：2012-07-18
申请号：EP12150694.3
申请日：2012-01-11
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol-jun , HONG, Seong-jae
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L2224/16245 , H01L2224/81 , H01L2933/0041
摘要： A method and apparatus for depositing a phosphor via a compression molding process, the method involving forming a plurality of light-emitting devices on a wafer, evaluating emission characteristics of the plurality of light-emitting devices, and re-arraying and aligning the plurality of light-emitting devices on a carrier substrate according to the emission characteristics; depositing the phosphor on the plurality of re-arrayed light-emitting devices via a compression molding process; and dicing the plurality of re-arrayed light-emitting devices on the carrier substrate.
摘要翻译：一种用于经由压缩模制过程中沉积磷的方法和装置，该方法涉及形成在晶片上的发光器件复数，评价发光器件，并重新排列的所述多个发光特性和对准的多元性发光在载体基板gemäß到发射特性的装置; 沉积在通过压模工艺重新排列发光装置的所述多个磷; 和切割的载体基底重新排列光发射器件的多元性。

9. 发明公开

EP2469616A2 Method and apparatus for depositing phosphor on semiconductor-light emitting device 审中-公开
标题翻译：为荧光体的半导体发光器件上的沉积的方法和设备
公开(公告)号：EP2469616A2
公开(公告)日：2012-06-27
申请号：EP11194223.1
申请日：2011-12-19
申请人： Samsung LED Co., Ltd.
发明人： Yoo, Cheol-jun , Hong, Seong-jae
IPC分类号： H01L33/50
CPC分类号： H01L22/20 , H01L33/005 , H01L33/0095 , H01L33/50 , H01L33/52 , H01L2924/0002 , H01L2933/0041 , H01L2924/00
摘要： A method and apparatus for depositing a phosphor using transfer molding. The method includes: forming a plurality of light-emitting devices on a wafer and rearranging the light-emitting devices on a carrier substrate according to luminance characteristics of the plurality of light-emitting devices by examining the luminance characteristics of the plurality of light-emitting devices; depositing the phosphor on the rearranged light-emitting devices using transfer molding; and separating the light-emitting devices on the carrier substrate.
摘要翻译：一种用于沉积使用传递模塑磷方法和装置。该方法包括：形成在晶片上的发光器件一个多元化和载体上重新排列的光发射器件通过检查的发光，所述多个的亮度特性基板雅丁到的光发射器件，所述多个亮度特性设备; 沉积使用转移模塑用重排的发光器件上的磷; 和在所述载体基片分离的发光器件。

10. 发明公开

EP2466367A2 Light emitting module and backlight unit using the same 审中-公开
标题翻译： Lichtemittierendes Modul undRückbeleuchtungseinheitdamit
公开(公告)号：EP2466367A2
公开(公告)日：2012-06-20
申请号：EP11194029.2
申请日：2011-12-16
申请人： Samsung LED Co., Ltd.
发明人： Jang, Kyu Ho
IPC分类号： G02F1/13357 , H01L33/50 , F21K99/00
CPC分类号： H01L25/0753 , G02F1/133603 , H01L33/507 , H01L2224/48091 , H05K3/0067 , H01L2924/00014
摘要： There is provided a light emitting module including: a circuit board; at least one light source part disposed on the circuit board; a wavelength conversion part coupled with the circuit board, the wavelength conversion part covering a light emitting surface of the light source part and converting a wavelength of light; and a coupling part coupling the wavelength conversion part to the circuit board.
摘要翻译：提供了一种发光模块，包括：电路板; 设置在所述电路板上的至少一个光源部; 与所述电路板耦合的波长转换部，所述波长转换部覆盖所述光源部的发光面并转换光的波长; 以及将波长转换部分耦合到电路板的耦合部分。

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