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1. 发明公开

EP2287931A2 A light emitting diode package 审中-公开
标题翻译： Gehäusefürlichtemittierende二极管
公开(公告)号：EP2287931A2
公开(公告)日：2011-02-23
申请号：EP10171947.4
申请日：2010-08-05
申请人： Samsung LED Co., Ltd.
发明人： Lee, Jin Bock , Park, Hee Seok , Kim, Hyung Kun , Lee, Young Jin
IPC分类号： H01L33/48 , H01L33/62 , H01L33/60
CPC分类号： H01L33/483 , H01L24/48 , H01L24/73 , H01L33/60 , H01L33/62 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/10329 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/05599
摘要： The present invention provides a light emitting diode package including: a package mold having a first cavity and a second cavity with a smaller size than that of the first cavity; first and second electrode pads provided on the bottom surfaces of the first cavity and the second cavity, respectively; a n LED chip mounted on the first electrode pad; a wire for providing electrical connection between the LED chip and the second electrode pad; and a molding material filled within the first cavity and the second cavity.
摘要翻译：本发明提供了一种发光二极管封装，其包括：封装模具，其具有第一空腔和具有比第一空腔小的尺寸的第二空腔; 分别设置在第一腔和第二腔的底表面上的第一和第二电极焊盘; 安装在第一电极焊盘上的n个LED芯片; 用于在所述LED芯片和所述第二电极焊盘之间提供电连接的导线; 以及填充在第一腔和第二腔内的成型材料。

2. 发明公开

EP2424333A2 AC driven light emitting device 审中-公开
标题翻译： Wechselstrombetriebene lichtemittierende Vorrichtung
公开(公告)号：EP2424333A2
公开(公告)日：2012-02-29
申请号：EP11178363.5
申请日：2011-08-23
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun , Moon, Kyung Mi
IPC分类号： H05B33/08
CPC分类号： H05B33/0821 , H05B33/0806
摘要： There is provided an alternating current (AC) driven light emitting device including a plurality of LED arrays connected in series, each having a structure in which a plurality of LEDs are electrically connected to form a two-terminal circuit and emit light by a bidirectional voltage when an AC voltage is applied to the two-terminal circuit; and a switching device connected to at least one of the plurality of LED arrays and controlling a total driving voltage with respect to the plurality of LED arrays. The AC driven light emitting device permits operation from a low driving voltage Vf while having a high driving voltage at a high voltage Vf, thereby achieving excellence in terms of power factor, THD, and energy efficiency.
摘要翻译：提供了一种包括串联连接的多个LED阵列的交流（AC）驱动发光器件，每个LED阵列具有多个LED电连接以形成两端电路并通过双向电压发光的结构当交流电压施加到两端电路时; 以及连接到所述多个LED阵列中的至少一个并且控制相对于所述多个LED阵列的总驱动电压的开关装置。交流驱动发光器件允许从低驱动电压Vf进行工作，同时具有高电压Vf的高驱动电压，从而在功率因数，THD和能量效率方面实现卓越。

3. 发明公开

EP2327582A2 LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof 审中-公开
标题翻译： LED封装，LED封装模块，从而及其制造方法，从而聚光灯及其控制方法
公开(公告)号：EP2327582A2
公开(公告)日：2011-06-01
申请号：EP10192862.0
申请日：2010-11-29
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun
IPC分类号： B60Q1/04 , F21S8/12 , H05K1/02 , H01L33/64
CPC分类号： H01L33/647 , F21S41/147 , F21V29/677 , F21V29/89 , H01L2224/13 , H05K1/056 , H05K2201/09054 , H05K2201/10106 , H05K2201/10174 , H05K2201/10969
摘要： Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
摘要翻译：本发明公开了LED封装上的具有相同的LED封装模块及其制造方法，以及具有该以及它们的控制方法的头灯模块。发光二极管封装包括：封装基板; 安装在封装基板的一个表面上的发光二极管芯片; 上形成的封装基板的另一表面上的电极焊盘，并电连接到所述发光二极管芯片; 和热辐射垫形成在封装基板的另一表面上，并从所述电极焊盘电绝缘。

4. 发明公开

EP2426744A2 Light emitting diode package and manufacturing method thereof 审中-公开
标题翻译： Leuchtdiodenbaugruppe und deren Herstellungsverfahren
公开(公告)号：EP2426744A2
公开(公告)日：2012-03-07
申请号：EP11179555.5
申请日：2011-08-31
申请人： Samsung LED Co., Ltd.
发明人： Lee, Young Jin , Kim, Hyung Kun , Moon, Kyung Mi , Woo, Gwang Bok
IPC分类号： H01L33/48 , H01L33/64
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2933/0075 , H01L2924/00014
摘要： A light emitting diode (LED) package is disclosed. The LED package includes a lead frame comprising a thermal pad and at least two electrode pads disposed at a distance from the thermal pad; at least one LED mounted on the thermal pad and electrically connected with the at least two electrode pads through a wire; a package mold comprising a first cavity to receive the thermal pad and the at least two electrode pads and to partially expose the thermal pad and the at least two electrode pads through a first surface of the package mold, the first surface on which the at least one LED is mounted, and exposing the thermal pad and the at least two electrode pads through a surface coplanar with a second surface opposite to the first surface; and a molding unit disposed in the first cavity.
摘要翻译：公开了一种发光二极管（LED）封装。所述LED封装包括引线框架，所述引线框架包括散热焊盘和至少两个电极焊盘，所述至少两个电极焊盘设置在与所述散热焊盘相距一定距离处; 至少一个LED，其安装在所述散热焊盘上并通过导线与所述至少两个电极焊盘电连接; 封装模具，其包括用于接收所述热垫和所述至少两个电极焊盘并且通过所述封装模具的第一表面部分地暴露所述热焊盘和所述至少两个电极焊盘的第一腔体，所述第一表面至少在所述第一表面上，安装一个LED，并且通过与第一表面相对的第二表面共面的表面暴露所述热焊盘和所述至少两个电极焊盘; 以及设置在所述第一腔中的模制单元。

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