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1. 发明公开

EP2448015A2 Semiconductor light emitting device 有权转让
标题翻译：半导体发光器件
公开(公告)号：EP2448015A2
公开(公告)日：2012-05-02
申请号：EP11187247.9
申请日：2011-10-31
申请人： Samsung LED Co., Ltd.
发明人： Hwang, Seok Min , Kim, Jae Yoon , Lee, Jin Bock
IPC分类号： H01L33/38
CPC分类号： H01L33/38 , H01L33/42 , H01L2933/0016
摘要： A semiconductor light emitting device includes: first and second conductive type semiconductor layers; an active layer disposed between the first and second conductive type semiconductor layers; and first and second electrodes disposed on one surface of each of the first and second conductive type semiconductor layers, respectively, wherein at least one of the first and second electrodes includes a pad part and a finger part formed to extend from the pad part, and the end of the finger part has an annular shape. Because a phenomenon in which current is concentrated in a partial area of the finger part is minimized, tolerance to electrostatic discharge (ESD) can be strengthened and light extraction efficiency can be improved.
摘要翻译：一种半导体发光器件包括：第一和第二导电型半导体层; 设置在第一和第二导电类型半导体层之间的有源层; 以及分别设置在所述第一导电类型半导体层和所述第二导电类型半导体层中的每一个的一个表面上的第一电极和第二电极，其中所述第一电极和所述第二电极中的至少一个包括焊盘部分和形成为从所述焊盘部分延伸的指状部分，手指部分的末端具有环形形状。由于电流集中在手指部分的局部区域的现象被最小化，因此可以增强对静电放电（ESD）的容忍度并且可以改善光提取效率。

2. 发明公开

EP2365527A2 Semiconductor light emitting device having multi-cell attray, light emitting module, and illumination apparatus 有权转让
标题翻译： Lichtemittierende Halbleitervorrichtung mit Mehrzellenanordnung，lichtemittierendes Modul und Beleuchtungsvorrichtung
公开(公告)号：EP2365527A2
公开(公告)日：2011-09-14
申请号：EP11155000.0
申请日：2011-02-18
申请人： Samsung LED Co., Ltd.
发明人： Kim, Sung Tae , Kim, Tae Hun , Kim, Jae Yoon , Ha, Hae Soo
IPC分类号： H01L27/15 , H01L25/075
CPC分类号： H01L27/156 , H01L33/20 , H01L33/46 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2933/0091 , H01L2924/00014
摘要： A semiconductor light emitting device includes a substrate, a plurality of light emitting cells, a connection part, and a concavo-convex part. The light emitting cells are arrayed on the top surface of the substrate. Each of the light emitting cells has a first-conductivity-type semiconductor layer, an active layer, and a second-conductivity-type semiconductor layer that are sequentially stacked on the top surface of the substrate. The connection part is formed to connect the light emitting cells in series, parallel or series-parallel. The concavo-convex part is formed in at least one of the bottom surface of the substrate and the top surface of an isolation region between the light emitting cells.
摘要翻译：半导体发光器件包括衬底，多个发光单元，连接部分和凹凸部分。发光单元排列在基板的顶表面上。每个发光单元具有依次堆叠在基板的顶表面上的第一导电型半导体层，有源层和第二导电型半导体层。连接部分形成为将发光单元串联，并联或串联连接。凹凸部形成在基板的底表面和发光单元之间的隔离区域的上表面中的至少一个中。

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