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1. 发明授权

EP1672662B1 MEMS switch and method of fabricating the same 有权
标题翻译： MEMS开关以及其制备方法
公开(公告)号：EP1672662B1
公开(公告)日：2008-06-25
申请号：EP05025063.8
申请日：2005-11-16
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H1/5822 , H01H59/0009 , H01H2059/0054 , H01H2059/0063

2. 发明授权

EP1653494B1 Micro thin-film structure, MEMS switch employing such a micro thin-film, and method of fabricating them 有权
标题翻译：薄膜的微结构的MEMS开关具有这样的薄膜的微结构和对应Herstellunsverfahren
公开(公告)号：EP1653494B1
公开(公告)日：2011-03-23
申请号：EP05022713.1
申请日：2005-10-18
申请人： Samsung Electronics Co., Ltd.
发明人： Kweon, Soon-cheol , Shin, Hyung-jae , Jeon, Byung-hee , Hong, Seok-kwan , Kim, Che-heung , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036

3. 发明公开

EP1753036A2 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译： Leuchtdioden-Verpackung und dessen Herstellungsverfahren
公开(公告)号：EP1753036A2
公开(公告)日：2007-02-14
申请号：EP06013382.4
申请日：2006-06-28
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Shin, Kyu-ho , Kweon, Soon-cheol , Moon, Chang-youl , Darbinian, Arthur , Choi, Seung-tae , Shin, Su-ho
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译：提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。保护盖包围并保护上下金属板的暴露表面。

4. 发明公开

EP1653494A3 Micro thin-film structure, MEMS switch employing such a micro thin-film, and method of fabricating them 有权
标题翻译：薄膜的微结构的MEMS开关具有这样的薄膜的微结构和对应Herstellunsverfahren
公开(公告)号：EP1653494A3
公开(公告)日：2007-08-22
申请号：EP05022713.1
申请日：2005-10-18
申请人： Samsung Electronics Co., Ltd.
发明人： Kweon, Soon-cheol , Shin, Hyung-jae , Jeon, Byung-hee , Hong, Seok-kwan , Kim, Che-heung , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H1/0036
摘要： A micro thin-film structure, a micro electro-mechanical system (MEMS) switch, and methods of fabricating them. The micro thin-film structure includes at least two thin-films having different properties and laminated in sequence to form an upper layer and a lower layer, wherein an interface between the upper and lower layers is formed to be oriented to at least two directions. The micro thin film structure, and method of forming, may be applied to a movable electrode of an MEMS switch. The thin-film structure may be formed by forming through-holes in the lower layer, and depositing the upper layer in the form of being engaged in the through-holes. Alternatively, the thin-film structure may be made by forming prominence and depression parts on the top side of the lower layer and then depositing the upper layer on the top side of the lower layer having the prominence and depression parts.

5. 发明公开

EP1672661A2 MEMS switch and method of fabricating the same 审中-公开
标题翻译： MEMS开关及其制造方法
公开(公告)号：EP1672661A2
公开(公告)日：2006-06-21
申请号：EP05024606.5
申请日：2005-11-10
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0054
摘要： A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.
摘要翻译：一种微机电系统开关和一种制造微机电系统开关的方法。微机电系统开关包括：基板;多个信号线，形成在基板上，并包括开关接点和在基板上的信号线之间形成的多个不可移动电极。多个锚定件从基板突出到预定高度并且支撑安装在同一平面上的至少两个致动梁以上下移动。连接单元连接至少两个致动梁。设置在基板上的支撑单元支撑连接单元，并且接触板安装在至少两个致动梁的下表面上以接触开关触点。

6. 发明公开

EP1753036A3 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译：发光二极管封装件及其制造方法
公开(公告)号：EP1753036A3
公开(公告)日：2010-09-15
申请号：EP06013382.4
申请日：2006-06-28
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Shin, Kyu-ho , Kweon, Soon-cheol , Moon, Chang-youl , Darbinian, Arthur Samsung Advanced Institute of Technology. , Choi, Seung-tae , Shin, Su-ho
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

7. 发明公开

EP1672661A3 MEMS switch and method of fabricating the same 审中-公开
标题翻译： MEMS开关及其制造方法
公开(公告)号：EP1672661A3
公开(公告)日：2007-08-29
申请号：EP05024606.5
申请日：2005-11-10
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H59/0009 , H01H2059/0054
摘要： A micro electro mechanical system switch and a method of fabricating the micro electro mechanical system switch. The micro electro mechanical system switch includes a substrate, a plurality of signal lines formed on the substrate and including switching contact points and a plurality of immovable electrodes formed among the signal lines on the substrate. A plurality of anchors protrude from the substrate to predetermined heights and support at least two actuating beams installed on an identical plane so as to move up and down. A connecting unit connects the at least two actuating beams. A support unit provided on the substrate supports the connecting unit and contacting plates are installed on lower surfaces of the at least two actuating beams so as to contact the switching contact points.

8. 发明公开

EP2474865A2 Developing device including toner concentration sensor and image forming apparatus including the developing device 审中-公开
标题翻译： Entwicklervorrichtung mit Tonerkonzentrationssensor und Bilderzeugungsvorrichtung mit der Entwicklungsvorrichtung
公开(公告)号：EP2474865A2
公开(公告)日：2012-07-11
申请号：EP11173434.9
申请日：2011-07-11
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Otsuka, Tatsuhiro , Kweon, Soon-cheol , Ha, Dong-woo
IPC分类号： G03G15/08
CPC分类号： G03G15/0851 , G03G15/0891 , G03G2215/0634 , G03G2215/0802
摘要： A developing device using a two-component developing agent including a toner and a carrier. The developing device includes a toner concentration sensor which detects a concentration of a toner contained in the developing agent within the accommodation unit by using electrostatic capacity. The toner concentration sensor includes a frame combined with a housing that forms the accommodation unit, a measuring groove formed in the frame to be concave with respect to an inner surface of the housing so that the developing agent conveyed by the agitator is flowed into the measuring groove, and a pair of opposite electrodes disposed on the measuring groove.
摘要翻译：一种使用包括调色剂和载体的双组分显影剂的显影装置。显影装置包括调色剂浓度传感器，其通过使用静电电容来检测容纳单元内的显影剂中所含的调色剂的浓度。调色剂浓度传感器包括与形成收纳单元的壳体组合的框架，形成在框架中的相对于壳体的内表面凹入的测量槽，使得由搅拌器输送的显影剂流入测量凹槽和设置在测量槽上的一对相对电极。

9. 发明公开

EP1732144A2 LED package, manufacturing method thereof, and LED array module using the same 审中-公开
标题翻译： LED布置，其制备方法和发光二极管矩阵模块与使用LED阵列的
公开(公告)号：EP1732144A2
公开(公告)日：2006-12-13
申请号：EP06009788.8
申请日：2006-05-11
申请人： Samsung Electronics Co., Ltd.
发明人： Shin, Kyu-ho , Shin, Su-ho , Kweon, Soon-cheol , Moon, Chang-youl , Choi, Jin-seung
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/58 , H01L33/647 , H01L2224/48091 , H01L2224/73265 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , Y10T29/49002 , H01L2924/00014
摘要： An LED package includes a substrate (30), an LED (20), and a cap (40). The substrate includes a first conductor unit (31), a second conductor unit (33), and a non-conductor unit (35) which electrically insulates the first and second conductor units. The LED is bonded to the first conductor unit. The cap is mounted on the substrate over the LED and comprises a conductive wire (41) which connects the LED to the second conductor unit.
摘要翻译：的LED封装件包括：基板（30）的LED（20）和盖（40）。基板包括第一导体部（31），第二导体部（33），并且该电绝缘的第一和第二导体单元的非导体部（35）。 LED被粘合到第一导体部。该盖被安装在基板上的LED和包括所述LED连接到第二导体部的导线（41）。

10. 发明公开

EP1672662A1 MEMS switch and method of fabricating the same 有权
标题翻译： MEMS Schalter und Methode zu dessen Herstellung
公开(公告)号：EP1672662A1
公开(公告)日：2006-06-21
申请号：EP05025063.8
申请日：2005-11-16
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Che-heung , Shin, Hyung-jae , Kweon, Soon-cheol , Kim, Kyu-sik , Lee, Sang-hun
IPC分类号： H01H59/00
CPC分类号： H01H1/5822 , H01H59/0009 , H01H2059/0054 , H01H2059/0063
摘要： A micro electro mechanical system switch and a method of fabricating the same. The micro electro mechanical system switch includes a substrate a plurality of signal lines formed at sides an upper surface of the substrate and including switching contact points and a plurality of immovable electrodes on the upper surface of the substrate and between the plurality of signal lines. An inner actuating member performs a seesaw based on a center of the substrate and together with an outer actuating member. Pushing rods are formed at ends of an upper surface of the inner actuating member with ends protruding from and overlapping with an upper portion of the outer actuating member. Contacting members are formed on a lower surface of the outer actuating member so as to be pushed by the pushing rods and contacting the switching contact points of the signal lines.
摘要翻译：微机电系统开关及其制造方法。微电子机械系统开关包括基板，在基板的上表面的侧面形成多个信号线，并且在基板的上表面和多个信号线之间包括开关接触点和多个不可移动的电极。内部致动构件基于衬底的中心并与外部致动构件一起执行跷跷板。推动杆形成在内致动构件的上表面的端部处，其端部从外致动构件的上部突出并与其重叠。接触构件形成在外部致动构件的下表面上，以被推杆推动并接触信号线的开关接触点。

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