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1. 发明公开

EP1753036A3 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译：发光二极管封装件及其制造方法
公开(公告)号：EP1753036A3
公开(公告)日：2010-09-15
申请号：EP06013382.4
申请日：2006-06-28
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Shin, Kyu-ho , Kweon, Soon-cheol , Moon, Chang-youl , Darbinian, Arthur Samsung Advanced Institute of Technology. , Choi, Seung-tae , Shin, Su-ho
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.

2. 发明公开

EP2474865A2 Developing device including toner concentration sensor and image forming apparatus including the developing device 审中-公开
标题翻译： Entwicklervorrichtung mit Tonerkonzentrationssensor und Bilderzeugungsvorrichtung mit der Entwicklungsvorrichtung
公开(公告)号：EP2474865A2
公开(公告)日：2012-07-11
申请号：EP11173434.9
申请日：2011-07-11
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Otsuka, Tatsuhiro , Kweon, Soon-cheol , Ha, Dong-woo
IPC分类号： G03G15/08
CPC分类号： G03G15/0851 , G03G15/0891 , G03G2215/0634 , G03G2215/0802
摘要： A developing device using a two-component developing agent including a toner and a carrier. The developing device includes a toner concentration sensor which detects a concentration of a toner contained in the developing agent within the accommodation unit by using electrostatic capacity. The toner concentration sensor includes a frame combined with a housing that forms the accommodation unit, a measuring groove formed in the frame to be concave with respect to an inner surface of the housing so that the developing agent conveyed by the agitator is flowed into the measuring groove, and a pair of opposite electrodes disposed on the measuring groove.
摘要翻译：一种使用包括调色剂和载体的双组分显影剂的显影装置。显影装置包括调色剂浓度传感器，其通过使用静电电容来检测容纳单元内的显影剂中所含的调色剂的浓度。调色剂浓度传感器包括与形成收纳单元的壳体组合的框架，形成在框架中的相对于壳体的内表面凹入的测量槽，使得由搅拌器输送的显影剂流入测量凹槽和设置在测量槽上的一对相对电极。

3. 发明公开

EP1995637A1 Image forming element and fabricating method thereof, and image forming apparatus 有权
标题翻译： Bilderzeugungselement und Herstellungsverfahrendafürund Bilderzeugungsvorrichtung
公开(公告)号：EP1995637A1
公开(公告)日：2008-11-26
申请号：EP08151540.5
申请日：2008-02-15
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Woon-bae , Kwon, Jong-oh , Choi, Seung-tae , Moon, Chang-youl , Kwon, Soon-cheol , Kwon, Ki-hwan
IPC分类号： G03G5/02 , G03G5/10 , G03G15/34 , B41J2/395
CPC分类号： G03G5/105 , G03G5/0205 , G03G15/05 , G03G15/348 , G03G2217/0075
摘要： An image forming element, a fabricating method of the image forming element, and an image forming apparatus having the image forming element is provided. The image forming element includes a drum body, a driving circuit mounted within the drum body, a support plate which penetrates through the drum body longitudinally along the drum body, the support plate being coupled to the driving circuit, an insulating layer formed on at least one portion of an outer circumference of the drum body, a conductive polymer layer formed on the insulating layer, the conductive polymer layer including one or more conductive areas and one or more insulating areas, which are aligned in an alternating pattern, and a protective layer formed on the conductive polymer layer, wherein the conductive areas on the conductive polymer layer are electrically connected to the driving circuit. Therefore, an image forming element can be provided in which a conductive layer is formed so that conductive areas and insulating areas are patterned without stepped portions therebetween, simplifying the fabricating process and improving the precision.
摘要翻译：提供了图像形成元件，图像形成元件的制造方法和具有图像形成元件的图像形成装置。图像形成元件包括鼓本体，安装在鼓本体内的驱动电路，沿着鼓体纵向穿过鼓体的支撑板，支撑板与驱动电路连接，至少形成绝缘层滚筒主体的外周的一部分，形成在绝缘层上的导电聚合物层，导电聚合物层包括以交替图案排列的一个或多个导电区域和一个或多个绝缘区域，以及保护层形成在导电聚合物层上，其中导电聚合物层上的导电区域电连接到驱动电路。因此，可以提供一种图像形成元件，其中形成导电层，使得导电区域和绝缘区域被图案化而没有阶梯部分，简化了制造工艺并提高了精度。

4. 发明授权

EP1995637B1 Image forming element and fabricating method thereof, and image forming apparatus 有权
标题翻译：摄像元件及其制造方法和图像形成装置
公开(公告)号：EP1995637B1
公开(公告)日：2010-05-19
申请号：EP08151540.5
申请日：2008-02-15
申请人： Samsung Electronics Co., Ltd.
发明人： Kim, Woon-bae , Kwon, Jong-oh , Choi, Seung-tae , Moon, Chang-youl , Kwon, Soon-cheol , Kwon, Ki-hwan
IPC分类号： G03G5/02 , G03G5/10 , G03G15/34 , B41J2/395
CPC分类号： G03G5/105 , G03G5/0205 , G03G15/05 , G03G15/348 , G03G2217/0075

5. 发明公开

EP1753036A2 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译： Leuchtdioden-Verpackung und dessen Herstellungsverfahren
公开(公告)号：EP1753036A2
公开(公告)日：2007-02-14
申请号：EP06013382.4
申请日：2006-06-28
申请人： Samsung Electronics Co., Ltd.
发明人： Kwon, Ki-hwan , Shin, Kyu-ho , Kweon, Soon-cheol , Moon, Chang-youl , Darbinian, Arthur , Choi, Seung-tae , Shin, Su-ho
IPC分类号： H01L33/00
CPC分类号： H01L33/647 , H01L24/97 , H01L33/486 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/49109 , H01L2224/73265 , H01L2924/01019 , H01L2924/07802 , H01L2924/12041 , Y10T29/49002 , H01L2924/00014 , H01L2924/00
摘要： An LED package and a fabrication method thereof are provided. The LED package includes an upper metal plate having an LED-receiving hole therein; a lower metal plate disposed under the upper metal plate; and an insulator which the upper metal plate and the lower metal plate from each other. A portion of the lower metal plate is exposed via the LED-receiving hole and an LED is mounted on the exposed portion of the lower metal plate and is electrically connected to both of the upper and lower metal plates. A protective cover encloses and protects exposed surfaces of the upper and lower metal plates.
摘要翻译：提供一种LED封装及其制造方法。 LED封装包括在其中具有LED接收孔的上金属板; 设置在所述上金属板下方的下金属板; 以及上金属板和下金属板彼此之间的绝缘体。下部金属板的一部分经由LED接收孔露出，并且LED被安装在下部金属板的暴露部分上并与上部和下部金属板电连接。保护盖包围并保护上下金属板的暴露表面。

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