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    • 6. 发明公开
    • VERFAHREN ZUM HERSTELLEN EINES LASERCHIPS
    • EP3192135A1
    • 2017-07-19
    • EP15760121.2
    • 2015-08-27
    • OSRAM Opto Semiconductors GmbH
    • GERHARD, SvenADLHOCH, ThomasVEIT, ThomasLELL, AlfredPFEIFFER, JoachimMUELLER, JensEICHLER, Christoph
    • H01S5/02H01S5/22
    • H01S5/0202H01S5/0203H01S5/22H01S5/2201
    • The invention relates to a method for producing a laser chip (140) comprising steps for providing a semiconductor wafer (100) having a top side (101) and a bottom side (102), wherein the semiconductor wafer has a plurality of integrated laser diode structures (141), which are arranged one after the other along a defined fracture direction (10), for creating a plurality of recesses (200) on the top side of the semiconductor wafer, which recesses are arranged one after the other along the fracture direction, wherein each recess has a front boundary surface (210) and a rear boundary surface (220) following one another in the fracture direction, wherein the rear boundary surface is tilted by an angle between 95° and 170° in relation to the top side of the semiconductor wafer in the case of at least one recess, and for fracturing the semiconductor wafer in the fracture direction at a fracture plane that is oriented perpendicularly to the top side of the semiconductor wafer and that extends through the recesses.
    • 本发明涉及一种用于制造激光芯片(140)的方法,其包括用于提供具有顶侧(101)和底侧(102)的半导体晶片(100)的步骤,其中所述半导体晶片具有多个集成激光二极管 (141),其沿着限定的断裂方向(10)一个接一个地布置,用于在所述半导体晶片的顶侧上形成多个凹部(200),所述凹部沿着所述断裂一个接一个地布置 其中每个凹部具有在断裂方向上彼此接连的前边界表面(210)和后边界表面(220),其中后边界表面相对于顶部倾斜95°与170°之间的角度 在半导体晶片的至少一个凹部的情况下,在断裂方向上在垂直于半导体晶片的顶面定向的断裂面处断裂半导体晶片, 穿过凹处。