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    • 8. 发明公开
    • LIGHT EMITTING ELEMENT AND METHOD OF MANUFACTURING SAME
    • EP4216291A1
    • 2023-07-26
    • EP23151908.3
    • 2023-01-17
    • Nichia Corporation
    • ASADA, KojiOKADA, Takuya
    • H01L33/06H01L33/14H01L33/32H01L33/04H01L33/24
    • A light emitting element (1) comprises a semiconductor structure (100) which includes an n-side layer (20 = 21, 22), a p-side layer (50), and an ultraviolet light emitting active layer (30) positioned between the n-side layer (20) and the p-side layer (50), each being made of a nitride semiconductor, an n-electrode electrically connected to the n-side layer (60), and a p-electrode (70) electrically connected to the p-side layer (50). The active layer (30) has a well layer (31) containing Al, a barrier layer (32) containing Al, and holes (33) defined by the lateral faces of the well layer (31) and the lateral faces of the barrier layer (32). The p-side layer (50) has a first layer (51) containing Al, a second layer (52) containing Al disposed on the first layer (51) and in contact with the lateral faces of the well layer (31), and a third layer (53) disposed on the second layer (52). The third layer (53) is smaller in thickness than the first layer (51). The Al composition ratio difference between the second layer (52) and the well layer (31) is 10% or less, and the third layer (53) has a lower Al composition ratio than the Al composition ratio of the second layer (52) or contains no Al. The p-electrode (70) is disposed on the third layer (53).