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1. 发明公开

EP1229770A1 METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD 有权
标题翻译： HERSTELLUNGSVERFAHRENFÜREINE LEITERPLATTE
公开(公告)号：EP1229770A1
公开(公告)日：2002-08-07
申请号：EP01934557.8
申请日：2001-06-05
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KAWAMOTO, Eiji , YAMANE, Shigeru , TAKENAKA, Toshiaki , NISHII, Toshihiro
IPC分类号： H05K1/11 , H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A method of manufacturing a PCB comprising the steps of: forming through-holes in a substrate having releasing layers on front and back faces; filling conductive paste in the through-holes; removing the releasing layers and disposing metal foil on both faces of the substrate; and heat pressing them. A diameter of the through-holes is larger than that of corresponding holes formed on the releasing layers. According to the present invention, when the conductive paste is compressed, conductive paste protruding from the surface of the substrate is trapped at the edges of the through-holes. This configuration prevents short circuits with undesirable wiring patterns. So, an enough amount of the conductive paste can protrude from the surface of the substrate. Therefore, after the compression, stable electric connections inside the conductive paste and between the conductive paste and the metal foils are ensured, thus PCBs with superior reliability can be produced.
摘要翻译：一种制造PCB的方法，包括以下步骤：在前面和背面上形成具有释放层的基板中形成通孔; 在通孔中填充导电膏; 去除释放层并在金属箔的两个面上设置金属箔; 并热压它们。通孔的直径大于形成在释放层上的相应孔的直径。根据本发明，当导电膏被压缩时，从基板的表面突出的导电糊被捕获在通孔的边缘处。这种配置可以防止出现不良布线图形的短路。因此，足够量的导电糊可以从基板的表面突出。因此，在压缩之后，确保导电性浆料内部和导电性糊料与金属箔之间的稳定的电连接，能够制造出具有优异的可靠性的PCB。

2. 发明授权

EP1428677B1 PRINTING PLATE, CIRCUIT BOARD AND METHOD OF PRINTING CIRCUIT BOARD 有权
标题翻译：高压板，电路板和方法进行印刷的电路板
公开(公告)号：EP1428677B1
公开(公告)日：2007-04-04
申请号：EP03787306.4
申请日：2003-09-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： TAKENAKA, Toshiaki , NISHII, Toshihiro , KOMODA, Hideaki , KONDO, Toshikazu , NAKAMURA, Shinji
IPC分类号： B41N1/24 , B41M1/12 , B41F15/34 , H05K1/11 , H05K3/12
CPC分类号： H05K3/1225 , B41F15/36 , B41F35/003 , B41M1/12 , B41N1/24 , B41N1/248 , H05K3/0052 , H05K3/4053 , H05K3/4069 , H05K2201/09063 , H05K2201/09709 , H05K2203/0191
摘要： A printing plate capable of preventing a highly viscous paste sticking to squeegee edge from remaining on a through hole in a circuit board during paste filling by the squeegeeing method. A metal sheet (3) formed with a squeegee cleaning section (7) is fixed to the back surface of the inclined portion (5) of a mask (2) in a printing plate frame (1), and after the highly viscous paste on the squeegee edge has been removed by the squeegee cleaning section (7), the through hole in the circuit board is filled with the paste; thus a circuit board which is capable of preventing the paste from remaining on the through hole and which is superior in quality is obtained.

3. 发明公开

EP1487245A1 CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME 有权转让
标题翻译：电路板及其制造方法
公开(公告)号：EP1487245A1
公开(公告)日：2004-12-15
申请号：EP03782953.8
申请日：2003-12-26
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： TAKENAKA, Toshiaki , KAWAKITA, Yoshihiro , TOJO, Tadashi , TATSUMI, Kiyohide
IPC分类号： H05K3/00
CPC分类号： H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49147 , Y10T29/49155 , Y10T29/49165
摘要： After disposing metallic foils on either surface of a prepreg sheet of low compressibility having conducting holes filled with conductive paste, the prepreg sheet is compressed in a state of being kept at a relatively low temperature, and after that, the temperature is raised under pressure to melt and harden the resin in the prepreg sheet, and thereby, the connecting resistance is stabilized, and a high-quality circuit board can be obtained.
摘要翻译：将金属箔配置在导电性填充有导电性糊剂的导电性填充剂的低压缩性预浸片材的任一面上后，在保持较低的温度的状态下进行压缩，然后升温至熔融并固化半固化片中的树脂，从而稳定连接电阻，并且可以获得高质量的电路板。

4. 发明授权

EP1278405B1 CIRCUIT BOARD PRODUCING METHOD AND CIRCUIT BOARD PRODUCING DEVICE 有权
标题翻译：电路板的制造方法和电路板的制造工厂
公开(公告)号：EP1278405B1
公开(公告)日：2007-02-14
申请号：EP01270088.6
申请日：2001-12-04
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： TAKENAKA, Toshiaki , NISHII, Toshihiro , SUGITA, Yuichiro , NAKAMURA, Shinji , KOMODA, Hideaki , KONDO, Toshikazu
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K1/095 , H05K3/1233 , H05K3/247 , H05K2201/035 , H05K2201/0355 , H05K2203/1461 , H05K2203/1476 , Y10T29/49155 , Y10T29/49165
摘要： A multi-layer circuit board producing method comprising a hole-forming step in which a sheet-like board material (1) is formed with through or non-through holes and a filling step in which the through or non-through holes (3) formed in the hole- forming step are filled with a paste (7) by use of a filling means, wherein in the filling step, the paste is supplemented with a second paste (11) for supplementary purposes by using a paste supplementing means, whereby the viscosity of the paste is stabilized to improve the fillability of paste into the through or non-through holes.

5. 发明公开

EP1589540A1 CONDUCTIVE PASTE, METHOD FOR PRODUCING SAME, CIRCUIT BOARD USING SUCH CONDUCTIVE PASTE AND METHOD FOR PRODUCING SAME 审中-公开
标题翻译：导电膏，制造方法，具有产生这样的导电浆料与PCB方法
公开(公告)号：EP1589540A1
公开(公告)日：2005-10-26
申请号：EP04703883.1
申请日：2004-01-21
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： SUGITA, Yuichiro , TAKENAKA, Toshiaki
IPC分类号： H01B1/20 , H05K1/11 , H05K3/40 , H05K1/09
CPC分类号： H05K3/4069 , H01B1/22 , H05K1/095 , H05K2201/0266 , H05K2201/0355 , H05K2203/1461 , Y10T29/49126 , Y10T428/2982
摘要： It is intended to reliably form high-quality via-hole conductor with less variation, and to realize a circuit forming board having excellent connection reliability. It provides a conductive paste comprising primary particles and agglomerate of primary particles, conductive particles of 0.5 to 20 µm in average particle diameter and 0.07 to 1.7 m 2 /g in specific surface area, and a binder based on thermosetting resin, and also provides an inexpensive circuit forming board with high connection reliability by using the paste.
摘要翻译：它的目的是可靠地形成高品质的通孔导体与较小的变化，并实现具有优异的连接可靠性的电路形成用基板。它提供了一个导电浆料，其包含一次颗粒和一次颗粒的聚集体，在平均粒径的0.5〜20微米的导电性粒子和0点07在比表面积1.7米<2> / g，并且基于热固性树脂的粘合剂，并且所以提供便宜的电路，通过使用糊形成具有高的连接可靠性板上。

6. 发明公开

EP1289356A1 METHOD AND DEVICE FOR DRYING MATERIALS AND METHOD OF PRODUCING CIRCUIT BOARDS USING THE SAME 审中-公开
标题翻译：用于干燥MATRERIALIEN和方法的方法和设备制造印刷电路板等
公开(公告)号：EP1289356A1
公开(公告)日：2003-03-05
申请号：EP01938558.2
申请日：2001-06-07
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KISHIMOTO, Kunio , NISHII, Toshihiro , TAKENAKA, Toshiaki , NAKAMURA, Shinji , MIURA, Akihiro
IPC分类号： H05K3/26 , F26B5/04 , H05K3/46
CPC分类号： H05K3/4069 , F26B5/04 , H05K3/0032 , H05K3/0055 , H05K3/227 , H05K2201/0355 , H05K2203/0191 , H05K2203/081 , H05K2203/085 , H05K2203/1461
摘要： The present invention relates to a method and a system of cleaning to remove cutting dusts and the like generated and adhering to a board material (1a) during drilling for electrical connection, and drying the board material, in a process of manufacturing a circuit board for small electronic equipment and the like. A large amount of board materials can be treated without receiving thermal damage by performing the steps of: placing sheets of the board material that have absorbed moisture resulting from cleaning, like a stack in a vacuum chamber (11); and drying the board material by repeating evacuation and pressurization under predetermined conditions while heating the board material. Thus, high-quality drilling can be achieved without losing quickness of laser machining, and highly reliable circuit boards can be obtained at low cost.

7. 发明公开

EP1167029A1 PRINTING PLATE, AND PRINTING METHOD USING THE SAME 有权
标题翻译：爱尔兰DRUCKVERFAHREN的DRUKPLATTE UND VERWENDUNG DER DRUCKPLATTE
公开(公告)号：EP1167029A1
公开(公告)日：2002-01-02
申请号：EP01902686.3
申请日：2001-01-31
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： TAKENAKA, Toshiaki , KONDO, Toshikazu , MAEDA, Mitsunori , TAHARA, Hiroshi , NAKAMURA, Shinji , SUGITA, Yuichiro
IPC分类号： B41F15/36
CPC分类号： H05K3/1225 , B41F15/36
摘要： A circuit board with high quality is provided by preventing the falling of paste which comes around to the squeegee complementary angle side during the pattem printing or paste filling by the squeegeeing method. While lowering, the squeegee is passed through the inclined portion of a paste removing section (3) provided on a mask (2) before pattern printing or paste filling, whereby the paste on the non-printing side (complementary angle) of the squeegee can be removed; thus, a circuit board superior in quality is obtained.
摘要翻译：通过在图案印刷或糊状物填充期间通过刮板方法防止在刮板互补角侧附近的糊料的落下而提供高质量的电路板。在下降时，在图案印刷或糊状填充之前，刮板穿过设置在掩模（2）上的糊剂去除部分（3）的倾斜部分，由此在刮板的非印刷侧（互补角）上的浆料可以被删除因此，获得了质量优异的电路板。

8. 发明授权

EP1229770B1 METHOD FOR MANUFACTURING PRINTED-CIRCUIT BOARD 有权
标题翻译：方法线路板
公开(公告)号：EP1229770B1
公开(公告)日：2006-11-22
申请号：EP01934557.8
申请日：2001-06-05
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KAWAMOTO, Eiji , YAMANE, Shigeru , TAKENAKA, Toshiaki , NISHII, Toshihiro
IPC分类号： H05K3/40
CPC分类号： H05K3/4069 , H05K2201/0355 , H05K2201/09827 , H05K2201/09845 , H05K2203/0191 , H05K2203/1461 , Y10T29/49126
摘要： A PCB manufacturing method comprising: forming through holes in a substrate having parting layers formed on its front and back surfaces; filling the through holes with a conductive paste; removing the parting layers and arranging metal foils on the front and back surfaces of the substrate; and heating and compressing them to manufacture a PCB, wherein the through holes in the front and back surfaces of the substrate have diameters larger than those in the corresponding parting layers. When the conductive paste compresses, according to this method, the outflow of the conductive paste from the surface of the substrate stops at the boundary portions of the through holes so that the protrusion of the conductive paste from the substrate surface can be ensured while eliminating the short-circuit with other wiring patterns. Even after the substrate compression, therefore, the electric connections of the inside of the conductive paste and between the conductive paste and the metal foils can be improved to manufacture a highly reliable PCB.

9. 发明公开

EP1694105A1 METHOD OF MANUFACTURING CIRCUIT BOARD 审中-公开
标题翻译： VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE
公开(公告)号：EP1694105A1
公开(公告)日：2006-08-23
申请号：EP04818363.6
申请日：2004-11-30
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KAWAKITA, Yoshihiro , TAKENAKA, Toshiaki , TOJYO, Tadashi
IPC分类号： H05K3/00 , H05K3/40 , B32B15/08
CPC分类号： H05K3/022 , B32B3/266 , B32B5/022 , B32B15/14 , B32B15/20 , B32B2250/40 , B32B2260/021 , B32B2260/046 , B32B2262/0261 , B32B2307/202 , B32B2457/08 , H05K3/4069 , H05K3/4614 , H05K3/4652 , H05K2201/0116 , H05K2201/0355 , H05K2203/068 , H05K2203/1461 , H05K2203/1476 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165
摘要： A pre-preg sheet including a substrate and a resin impregnated in the substrate is provided. A first metal foil is placed on the pre-preg sheet to provide a laminated body. The laminated body is put in a heating device having a temperature maintained at a temperature close to a softening temperature of the resin. The laminated body is compressed at the temperature at a predetermined pressure. The first metal foil is bonded to the pre-preg sheet of the laminated body and hardening the resin, thus providing a circuit board. This method provides a stable resistance of a conductive paste filling a through-hole in the pre-preg sheet to be compressed at a small rate.
摘要翻译：提供了包括基材和浸渍在基材中的树脂的预浸片。将第一金属箔放置在预浸片上以提供层压体。将层叠体放入温度保持在接近树脂的软化温度的温度的加热装置中。层压体在预定压力的温度下被压缩。将第一金属箔接合到层压体的预浸片材上并硬化树脂，从而提供电路板。该方法提供了一种导电浆料的稳定电阻，该导电浆料填充预压片中的通孔以以较小的速率被压缩。

10. 发明公开

EP1499169A1 METHOD FOR MANUFACTURING SUBSTRATE, RELEASE SHEET, SUBSTRATE MANUFACTURING APPARATUS AND METHOD FOR MANUFACTURING SUBSTRATE USING SAME 审中-公开
标题翻译：制造方法SUBSTRATE剥离片，基板生产DEVICE AND METHOD FOR SO用基板
公开(公告)号：EP1499169A1
公开(公告)日：2005-01-19
申请号：EP04703242.0
申请日：2004-01-19
申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
发明人： KISHIMOTO, Kunio , TAKENAKA, Toshiaki , HIRAISHI, Yukihiro
IPC分类号： H05K3/46 , C08J5/24
CPC分类号： B29C70/46 , B29L2031/3425 , B32B37/26 , B32B2037/268 , B32B2305/08 , B32B2311/12 , B32B2398/10 , B32B2457/08 , C08J5/24 , H05K3/022 , H05K3/4069 , H05K3/4611 , H05K3/4614 , H05K3/4638 , H05K3/4652 , H05K3/4679 , H05K2201/0355 , H05K2203/0195 , H05K2203/0264 , H05K2203/065 , H05K2203/068 , Y10T29/49126 , Y10T29/49128 , Y10T156/16 , Y10T156/1712 , Y10T428/31
摘要： A highly reliable and productive manufacturing method of boards and a manufacturing apparatus are provided. The manufacturing apparatus includes heater-punches (4a) and (4b) disposed above and under pressuring holes (24) provided on positioning stage (6) which positions and laminates board materials. The apparatus also includes a supplying and discharging means of a mold-releasing sheet, and the means is formed of supply reel (22), take-up reel (23), and guide rolls (25a) and (25b). The sheet is supplied and discharged passing between heater-punches (4a) placed above pressuring holes (24) and heater-punches (4b) placed under pressuring holes (24).
摘要翻译：提供板高度可靠的生产性制造方法和制造装置。该制造装置包括：加热冲头（4a）和（4b）的上方和下方设置在定位台（6），其位置和层压板板材加压的孔（24）地设置。该装置包括一个脱模片的供给，以便和放电装置，以及装置是形成供给卷轴（22），收取卷盘（23）和引导辊（25A）和（25B）。片材的供给和排出的加压孔（24）和加压孔（24）下放在加热冲头（4b）的上面放置加热冲头（4a）的之间通过。

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