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1. 发明授权

EP3684148B1 METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD 审中-实审
公开(公告)号：EP3684148B1
公开(公告)日：2023-11-29
申请号：EP18855357.2
申请日：2018-09-07
发明人： KATO, Hiromasa , HIRABAYASHI, Hideaki , KAWASHIMA, Fumiyuki , SASAKI, Akito
IPC分类号： H05K3/26 , C04B41/88 , C23F1/02 , C23F1/16 , H05K3/20 , H05K3/06 , C04B37/02

2. 发明公开

EP4183234A1 A MANUFACTURING PROCESS TO ENHANCE SURFACE MOUNT SOLDER PAD JOINT FORMATION VIA A LASER SUBTRACTIVE METHOD 审中-公开
公开(公告)号：EP4183234A1
公开(公告)日：2023-05-24
申请号：EP21749252.9
申请日：2021-07-16
申请人： Watt Laser Limited
发明人： SHAW, Fraser Murray
IPC分类号： H05K3/26 , H05K3/34

3. 发明授权

EP3733316B1 WASCH- UND/ODER REINIGUNGSGERÄT 有权
公开(公告)号：EP3733316B1
公开(公告)日：2022-08-24
申请号：EP19171673.7
申请日：2019-04-29
发明人： Axel, Hallensleben
IPC分类号： B08B3/04 , B08B3/10 , H05K3/26

4. 发明公开

EP3697883A1 COMPOSITIONS CONTAINING TRANS-1,2-DICHLOROETHYLENE AND A HYDROFLUOROETHER, AND METHODS OF USING THE SAME 审中-实审
公开(公告)号：EP3697883A1
公开(公告)日：2020-08-26
申请号：EP18797492.8
申请日：2018-10-22
申请人： Shellef, Dov , Shellef, Edo
发明人： Shellef, Dov , Shellef, Edo
IPC分类号： C11D7/50 , C09K5/10 , C09K5/04 , D06L1/02 , C23G5/028 , C11D11/00 , H05K3/26

5. 发明公开

EP3684148A1 METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD 审中-实审
公开(公告)号：EP3684148A1
公开(公告)日：2020-07-22
申请号：EP18855357.2
申请日：2018-09-07
申请人： Kabushiki Kaisha Toshiba , Toshiba Materials Co., Ltd.
发明人： KATO, Hiromasa , HIRABAYASHI, Hideaki , KAWASHIMA, Fumiyuki , SASAKI, Akito
IPC分类号： H05K3/26 , C04B41/88 , C23F1/02 , C23F1/16 , H05K3/20 , H05K3/06
摘要： A method for manufacturing a ceramic circuit board in which a copper plate is joined to at least one surface of a ceramic substrate via a brazing material layer containing Ag, Cu, and active metal, wherein the method is provided with: a first chemical polishing step for preparing a ceramic circuit board in which a copper plate is joined to a ceramic substrate via a brazing material layer, with a portion of the brazing material layer exposed between pattern shapes of the copper plate, and chemically polishing the portion of the brazing material layer; and a first brazing material etching step for etching the portion of the chemically polished brazing material layer with an etchant at pH of 6 or below that contains one or two selected from hydrogen peroxide and ammonium peroxodisulfate.

6. 发明授权

EP2292360B1 Method of and apparatus for removing a metal oxide from a treating surface of a substrate ; Method of reducing metal oxides and forming a solder joint in a substrate 有权
标题翻译：用于从衬底的处理表面去除金属氧化物的方法和装置; 还原金属氧化物和在衬底中形成的焊料连接的方法
公开(公告)号：EP2292360B1
公开(公告)日：2015-06-17
申请号：EP10009084.4
申请日：2010-09-01
申请人： Air Products and Chemicals, Inc.
发明人： Dong, Chun Christine , Ghosh, Ranajit , Arslanian, Gregory Khosrov
IPC分类号： B23K1/008 , B23K1/20 , B23K35/38 , C23G5/00 , H01L21/00 , H05K3/26 , H05K3/34 , H01L21/02
CPC分类号： B23K1/008 , B23K1/206 , B23K35/262 , B23K35/38 , B23K2201/40 , C21D9/50 , C23G5/00 , H01L21/02068 , H01L21/4864 , H01L21/67069 , H01L24/16 , H01L2224/16 , H01L2924/0102 , H01L2924/01077 , H01L2924/01078 , H01L2924/01087 , H01L2924/01322 , H01L2924/09701 , H01L2924/12042 , H01L2924/14 , H01L2924/3025 , H05K3/3457 , H05K3/3489 , H05K2203/087 , H05K2203/105 , H01L2924/00

7. 发明公开

EP2760260A1 DESMEAR SOLUTION AND DESMEAR METHOD 有权
标题翻译： DESMEAR解和DESMEAR方法
公开(公告)号：EP2760260A1
公开(公告)日：2014-07-30
申请号：EP12834179.9
申请日：2012-09-11
申请人： C. Uyemura & Co., Ltd.
发明人： SAIJO, Yoshikazu , YAMAMOTO, Hisamitsu , UTSUMI, Masayuki
IPC分类号： H05K3/42 , H05K3/26
CPC分类号： C09K13/02 , H05K3/0055 , H05K3/381 , H05K2203/0793 , H05K2203/0796
摘要： The present invention provides a desmear solution and a desmear method using said desmear solution, the desmear solution being capable of certainly removing a smear inside a non-through hole formed in a resin substrate and also capable of forming a plating film excellent in adhesion without excessive roughening of a surface of the resin substrate. The present invention uses the desmear solution containing a permanganate having a concentration of 0.2 to 0.4 mol/L and an alkali metal hydroxide and having a molar concentration ratio of said permanganate to said alkali metal hydroxide of 1:5 to 1:20.
摘要翻译：本发明提供一种使用所述除胶渣溶液的除胶渣溶液和除胶渣方法，所述去杂涂溶液能够可靠地除去树脂基材中形成的非贯通孔内的拖尾，并且还能够形成粘合性优异的镀膜粗糙化树脂基板的表面。本发明使用含有浓度为0.2至0.4mol / L的高锰酸盐和碱金属氢氧化物并且所述高锰酸盐与所述碱金属氢氧化物的摩尔浓度比为1:5至1:20的去钻污溶液。

8. 发明公开

EP2563105A1 PRINTED SUBSTRATE MANUFACTURING METHOD AND PRINTED SUBSTRATE EMPLOYING SAME 有权
标题翻译：用于生产安装基板和安装MADE基板这个过程
公开(公告)号：EP2563105A1
公开(公告)日：2013-02-27
申请号：EP11771803.1
申请日：2011-03-02
申请人： Meiko Electronics Co., Ltd.
发明人： SAITO, Yoichi , MICHIWAKI, Shigeru , TANEKO, Noriaki , TAKII, Shukichi
IPC分类号： H05K3/26 , H05K3/18 , H05K3/20 , H05K3/22
CPC分类号： H05K3/205 , H05K3/26 , H05K2201/0376 , H05K2201/098 , H05K2203/0152 , H05K2203/025 , H05K2203/1572
摘要： A method of producing a printed circuit board includes: forming a metal layer on a support plate; forming a mask layer on the metal layer; forming a pattern plating (6) having a stem (7) as a portion of plating up to a level equal to the height of the mask layer, and a cap (8) as a portion of plating exceeding the height of the mask layer and having an outgrowth (8a) lying over the surface of the mask layer; laminating an insulating base (10) on a conductive circuit board constituted by the support plate, the metal layer and the pattern plating (6) to form a circuit board intermediate in which the pattern plating (6) is buried in the insulating base (10); removing the support plate and the metal layer to form an exposed surface; and mechanically polishing the exposed surface until the stem (7) of the pattern plating is removed, to increase the line width of the conductive pattern on the exposed surface.
摘要翻译：制造印刷电路板的方法包括：形成在支撑板上的金属层; 形成在金属层上形成掩模层; 形成图案电镀（6）具有杆（7）作为电镀到等于掩模层的高度的电平的部分，和一个盖（8）镀敷的一部分超过该掩模层的高度和具有到生长（8A）位于所述掩模层的表面上; 由所述支撑板，所述金属层和所述图案电镀构成的导电电路板绝缘基底（10）的层合（6）以形成一电路板中间，其中所述图案镀层（6）埋设在绝缘基底（10 ）; 去除所述支撑板和所述金属层以形成暴露的表面上; 机械和抛光的暴露表面直到所述杆（7）的图案电镀被移除，以增加暴露的表面上的导电图案的线宽。

9. 发明授权

EP1803804B1 Method and material for cleaning a substrate 有权
标题翻译：清洁衬底材料的方法，和
公开(公告)号：EP1803804B1
公开(公告)日：2013-02-27
申请号：EP06256133.7
申请日：2006-11-30
申请人： Lam Research Corporation
发明人： Freer, Erik M. , De Larios, John M. , Mikhaylichenko, Katrina , Ravkin Michael , Korolik Mikhail , Redeker Fred C.
IPC分类号： C11D17/00 , B08B3/04 , C11D3/20 , B08B3/10 , C11D11/00 , G03F7/42 , H05K3/26 , H01L21/306
CPC分类号： H01L21/02052 , B08B3/04 , B08B7/00 , C11D11/0047 , C11D17/0013 , C11D17/0017 , G03F1/82 , H01L21/02057 , H01L21/02096 , H01L21/67051

10. 发明授权

EP1678288B1 COMPOSITIONS BASED ON FLUORINATED HYDROCARBONS AND SECONDARY BUTANOL FOR DEFLUXING ELECTRONIC BOARDS 有权
标题翻译：基于氢氟碳化物和二次组合物丁醇脱除资金流量在电路板上
公开(公告)号：EP1678288B1
公开(公告)日：2012-08-22
申请号：EP04740640.0
申请日：2004-07-02
申请人： ARKEMA FRANCE
发明人： LALLIER, Jean-Pierre , RASTELLETTI, Emmanuel
IPC分类号： C11D11/00 , C11D7/50 , C23G5/028 , H05K3/26
CPC分类号： C11D7/261 , C11D7/28 , C11D7/34 , C11D7/5009 , C11D7/5018 , C11D11/0047 , C23G5/02 , C23G5/032 , H05K3/26
摘要： The present invention concerns the field of fluorinated hydrocarbons and relates to novel compositions containing fluorinated hydrocarbons, secondary butanol and optionally DMSO. These novel compositions are particularly advantageous for defluxing electronic boards in particular for defluxing electronic boards containing “no clean' solder fluxes.

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