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1. 发明公开

EP3022779A1 PC LED WITH OPTICAL ELEMENT AND WITHOUT SUBSTRATE CARRIER 有权转让
标题翻译： PC与LED光学元件与无衬底载体
公开(公告)号：EP3022779A1
公开(公告)日：2016-05-25
申请号：EP14766210.0
申请日：2014-07-17
申请人： Koninklijke Philips N.V.
发明人： BASIN, Grigoriy , HAQUE, Ashim Shatil , KAGEYAMA, Hideo , MORAN, Brendan Jude , BHARDWAJ, Jyoti Kiron
IPC分类号： H01L33/62 , H01L33/00
摘要： Intermediate removable placement and processing structures are provided to enable the formation of optical elements upon light emitting elements, including the formation of a reflective layer beneath the optical elements. These removable placement and processing structures are substantially independent of the particular dimensions of the produced light emitting device, allowing their re-use in a variety of applications. The resultant light emitting device includes the light emitting element,the optical element with reflector, and, optionally, a wavelength conversion material, but does not include remnants of the placement and processing structures, such as a carrier substrate.

2. 发明公开

EP2917938A1 WAVELENGTH CONVERTED LIGHT EMITTING DEVICE 有权转让
标题翻译：长光发射装置
公开(公告)号：EP2917938A1
公开(公告)日：2015-09-16
申请号：EP13820902.8
申请日：2013-10-25
申请人： Koninklijke Philips N.V.
发明人： SCHRICKER, April Dawn , MAI, Kim Kevin , BASIN, Grigoriy
IPC分类号： H01L25/075
摘要： A structure according to embodiments of the invention includes a plurality of LEDs attached to a mount. A wavelength converting layer is disposed over the LEDs. A transparent layer is disposed over the wavelength converting layer. Reflective material is disposed between neighboring LEDs.

3. 发明公开

EP2751852A1 METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE 审中-公开
标题翻译： METHOD FOR结合底物的半导体发光器件
公开(公告)号：EP2751852A1
公开(公告)日：2014-07-09
申请号：EP12766151.0
申请日：2012-07-30
申请人： Koninklijke Philips N.V.
发明人： BASIN, Grigoriy , EPLER, John Edward , MARTIN, Paul Scott
IPC分类号： H01L33/00 , H01L33/22 , H01L33/50
CPC分类号： H01L33/48 , H01L21/6836 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/94 , H01L33/005 , H01L33/0079 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L33/501 , H01L33/505 , H01L33/507 , H01L2224/0345 , H01L2224/0346 , H01L2224/05147 , H01L2224/05155 , H01L2224/05166 , H01L2224/05644 , H01L2224/05647 , H01L2224/27436 , H01L2224/29191 , H01L2224/32225 , H01L2224/83005 , H01L2224/8309 , H01L2224/83097 , H01L2224/83191 , H01L2224/83209 , H01L2224/94 , H01L2924/12041 , H01L2924/12042 , H01L2924/15788 , H01L2933/0091 , H01L2924/00014 , H01L2224/27 , H01L2224/83 , H01L2924/01074 , H01L2924/00
摘要： A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

4. 发明公开

EP2748277A1 PHOSPHOR IN WATER GLASS FOR LEDs 有权转让
标题翻译： EINEM WASSERGLASFÜRLED中的磷光体
公开(公告)号：EP2748277A1
公开(公告)日：2014-07-02
申请号：EP12813517.5
申请日：2012-12-05
申请人： Koninklijke Philips N.V.
发明人： KUIPER, Stein , BASIN, Grigoriy
IPC分类号： C09K11/59
CPC分类号： H01L33/50 , C01B33/32 , C03C4/12 , C03C14/004 , C03C2214/04 , C09K11/592 , H01L33/502 , H01L2933/0091
摘要： The invention provides a lighting unit comprising a light source and a light conversion layer, wherein the light source is configured to provide light source light and comprises a light emitting diode (LED), wherein the light conversion layer comprises an alkali silicate matrix containing a particulate luminescent material, and wherein the light conversion layer is configured to convert at least part of the light source light into luminescent material light.
摘要翻译：本发明提供了一种包括光源和光转换层的照明单元，其中所述光源被配置为提供光源光并且包括发光二极管（LED），其中所述光转换层包括含有颗粒的碱性硅酸盐基质发光材料，并且其中所述光转换层被配置为将所述光源光的至少一部分转换成发光材料光。

5. 发明公开

EP2689458A1 PATTERNED UV SENSITIVE SILICONE-PHOSPHOR LAYER OVER LEDS 有权转让
标题翻译： GEMUSTERTE UV-EMPFINDLICHE SILICONPHOSCHICCHICHTÜBERLEDS
公开(公告)号：EP2689458A1
公开(公告)日：2014-01-29
申请号：EP12714374.1
申请日：2012-03-20
申请人： Koninklijke Philips N.V.
发明人： BASIN, Grigoriy , MARTIN, Paul, Scott
IPC分类号： H01L25/075 , H01L33/50
CPC分类号： H01L33/50 , H01L33/501 , H01L33/505 , H01L33/54 , H01L33/62 , H01L2224/13 , H01L2224/73204 , H01L2224/73265 , H01L2933/0041 , H01L2933/0091
摘要： LED dies are mounted a single submount tile (or wafer). The LED dies have a light emitting top surface. A uniformly thick layer of UV sensitive silicone infused with phosphor is then deposited over the tile, including over the tops and sides of the LED dies. Only the silicone/phosphor over the top and sides of the LED dies is desired, so the silicone/phosphor directly on the tile needs to be removed. The silicone/phosphor layer is then masked to expose the areas that are to remain to UV light, which creates a cross-linked silicone. The unexposed silicone/phosphor layer is then dissolved with a solvent and removed from the tile surface. The silicone/phosphor layer may be defined to expose a wire bond electrode on the LED dies. The tile is ultimately singulated to produce individual phosphor-converted LEDs.
摘要翻译： LED芯片安装在单个底座瓦片（或晶片）上。 LED管芯具有发光顶表面。然后将沉积有磷光体的均匀厚的紫外线敏感硅胶层沉积在瓦片上，包括在LED管芯的顶部和侧面。仅需要在LED管芯的顶部和侧面上的硅氧烷/磷光体，因此需要去除直接在瓷砖上的硅氧烷/磷光体。然后将硅氧烷/磷光体层掩蔽以暴露出保持为UV光的区域，这产生交联的硅氧烷。然后将未曝光的硅氧烷/磷光体层用溶剂溶解并从瓷砖表面除去。可以限定硅氧烷/磷光体层以暴露LED管芯上的引线接合电极。瓦片最终被单独化以产生单个的磷光体转换的LED。

6. 发明授权

EP2266149B1 UNDERFILL PROCESS FOR FLIP-CHIP LED 有权转让
标题翻译： FLIP-CHIP LED的底部填充工艺
公开(公告)号：EP2266149B1
公开(公告)日：2017-08-23
申请号：EP09722834.0
申请日：2009-03-13
申请人： Koninklijke Philips N.V. , Philips Lumileds Lighting Company LLC
发明人： BASIN, Grigoriy , DIANA, Frederic , MARTIN, Paul, S. , SIMONIAN, Dima
IPC分类号： H01L33/54 , H01L33/56 , H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L33/0079 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00

7. 发明授权

EP1922767B1 COLOR CONVERTED LIGHT EMITTING DIODE 有权转让
标题翻译：发光的色彩转换二极管
公开(公告)号：EP1922767B1
公开(公告)日：2016-08-17
申请号：EP06795708.4
申请日：2006-08-21
申请人： Koninklijke Philips N.V. , Philips Lumileds Lighting Company, LLC.
发明人： BASIN, Grigoriy , MARTIN, Paul, S. , WEST, Robert, S. , MORITA, Yasumasa , HEEMSTRA, Tewe, H.
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2933/0041 , H01L2224/81

8. 发明公开

EP2997610A1 LIGHT EMITTING DEVICE WITH AN OPTICAL ELEMENT AND A REFLECTOR 有权转让
标题翻译： EINEM REFLEKTOR LICHTEMITTIERENDE VORRICHTUNG MIT EINEM OPTISCHEN ELEMENT UND EINEM REFLEKTOR
公开(公告)号：EP2997610A1
公开(公告)日：2016-03-23
申请号：EP14729051.4
申请日：2014-05-15
申请人： Koninklijke Philips N.V.
发明人： BHAT, Jerome Chandra , BASIN, Grigoriy , VAMPOLA, Kenneth
IPC分类号： H01L33/58 , H01L33/60 , H01L33/44
CPC分类号： H01L33/60 , H01L33/44 , H01L33/50 , H01L33/58 , H01L2933/0041 , H01L2933/0058
摘要： A structure according to embodiments of the invention includes a semiconductor light emitting device and an optical element disposed over the semiconductor light emitting device. The semiconductor light emitting device is disposed in a recess in the optical element. A reflector is disposed on a bottom surface of the optical element. A method according to embodiments of the invention includes disposing a semiconductor light emitting device on a substrate and forming a reflector adjacent the semiconductor light emitting device. An optical element is formed over the semiconductor light emitting device. The semiconductor light emitting device is removed from the substrate.
摘要翻译：根据本发明的实施例的结构包括半导体发光器件和设置在半导体发光器件上的光学元件。半导体发光器件设置在光学元件的凹部中。反射器设置在光学元件的底表面上。根据本发明的实施例的方法包括将半导体发光器件设置在衬底上并形成邻近半导体发光器件的反射器。在半导体发光器件上形成光学元件。半导体发光器件从衬底移除。

9. 发明公开

EP2984686A1 LED WITH HIGH THERMAL CONDUCTIVITY PARTICLES IN PHOSPHOR CONVERSION LAYER AND THE METHOD OF FABRICATING THE SAME 有权转让
标题翻译：具有高导热性的在荧光体中转换层和方法颗粒LED及其制造
公开(公告)号：EP2984686A1
公开(公告)日：2016-02-17
申请号：EP14718771.0
申请日：2014-04-02
申请人： Koninklijke Philips N.V.
发明人： BASIN, Grigoriy , FOUKSMAN, Mikhail
IPC分类号： H01L33/50 , H01L33/64 , H01L25/075
摘要： In one embodiment, a solid cylindrical tablet is pre-formed for a reflective cup containing an LED die, such as a blue LED die. The tablet comprises uniformly-mixed phosphor particles and transparent/translucent particles of a high TC material, such as quartz, in a hardened silicone binder, where the index of refraction of the high TC material is matched to that of the silicone to minimize internal reflection. Tablets can be made virtually identical in composition and size. The bulk of the tablet will be the high TC material. After the tablet is placed in the cup, the LED module is heated, preferably in a vacuum, to melt the silicone so that the mixture flows around the LED die and fills the voids to encapsulate the LED die. The silicone is then cooled to harden.
摘要翻译：在一个实施方式中，实心圆柱形片剂预先形成为包含在所述LED，彩色反射杯：诸如蓝色LED。该片剂包含均匀混合磷颗粒和高TC材料的透明/半透明颗粒，颜色：例如石英，在硬化硅氧烷粘合剂，其中以做了硅酮的以最小化内部反射的高TC材料的折射率被匹配，片剂可以由在组成和大小几乎是相同的。该片剂的体积将是高TC材料。片剂在杯中放置之后，LED模块被加热时，优选在真空中，以熔化硅所以做了混合物在LED周围流动，填充空隙封装LED这一点。然后将硅树脂被冷却以硬化。

10. 发明公开

EP2859597A1 CHIP SCALE LIGHT EMITTING DEVICE WITH METAL PILLARS IN A MOLDING COMPOUND FORMED AT WAFER LEVEL 有权转让
标题翻译：发光器件芯片的尺寸与金属柱晶圆级ON形连接
公开(公告)号：EP2859597A1
公开(公告)日：2015-04-15
申请号：EP13739506.7
申请日：2013-06-04
申请人： Koninklijke Philips N.V.
发明人： LEI, Jipu , SCHIAFFINO, Stefano , NICKEL, Alexander H. , NG, Mooi, Guan , BASIN, Grigoriy , AKRAM, Salman
IPC分类号： H01L33/62 , H01L23/00
摘要： Thick metal pillars are formed upon light emitting dies while the dies are still on their supporting wafer. A molding compound is applied to fill the space between the pillars on each die, and contact pads are formed atop the pillars. The metal pillars provide electrical contact between the contact pads and the electrical contacts of each light emitting die. The metal pillars maybe formed upon an upper metal layer of each die, and this upper metal layer maybe patterned to provide connections to individual elements within the die.

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