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1. 发明授权

EP2564435B1 METHOD FOR FABRICATING A LIGHT EMITTING DIODE WITH A LAMINATED PHOSPHOR LAYER 有权转让
标题翻译：具有叠层荧光层的发光二极管的制造方法
公开(公告)号：EP2564435B1
公开(公告)日：2017-09-27
申请号：EP11722561.5
申请日：2011-04-27
申请人： Koninklijke Philips N.V. , Philips Lumileds Lighting Company, LLC
发明人： BASIN, Grigoriy , MARTIN, Paul, S.
IPC分类号： H01L23/00 , H01L33/50 , H01L33/00 , H01L33/22
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L2224/14 , H01L2224/81 , H01L2924/181 , H01L2933/0041 , H01L2924/00012

2. 发明授权

EP2266149B1 UNDERFILL PROCESS FOR FLIP-CHIP LED 有权转让
标题翻译： FLIP-CHIP LED的底部填充工艺
公开(公告)号：EP2266149B1
公开(公告)日：2017-08-23
申请号：EP09722834.0
申请日：2009-03-13
申请人： Koninklijke Philips N.V. , Philips Lumileds Lighting Company LLC
发明人： BASIN, Grigoriy , DIANA, Frederic , MARTIN, Paul, S. , SIMONIAN, Dima
IPC分类号： H01L33/54 , H01L33/56 , H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L33/0079 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00

3. 发明授权

EP1922767B1 COLOR CONVERTED LIGHT EMITTING DIODE 有权转让
标题翻译：发光的色彩转换二极管
公开(公告)号：EP1922767B1
公开(公告)日：2016-08-17
申请号：EP06795708.4
申请日：2006-08-21
申请人： Koninklijke Philips N.V. , Philips Lumileds Lighting Company, LLC.
发明人： BASIN, Grigoriy , MARTIN, Paul, S. , WEST, Robert, S. , MORITA, Yasumasa , HEEMSTRA, Tewe, H.
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2933/0041 , H01L2224/81

4. 发明公开

EP1503434A3 Semiconductor light emitting devices with improved light extraction efficiency 审中-公开
标题翻译： Lichtemittierendes Halbleiterbauelement mit verbesserter Lichtauskopplung
公开(公告)号：EP1503434A3
公开(公告)日：2011-01-05
申请号：EP04103573.4
申请日：2004-07-26
申请人： Philips Lumileds Lighting Company LLC
发明人： CAMRAS, Michael, D. , TICHY, Ladislav , HARBERS, Gerard , IMLER, William, R. , KEUPER, Matthijs, H. , MARTIN, Paul, S. , POCIUS, Douglas, W. , STERANKA, Frank, M. , TICHA, Helena , WEST, Robert, S.
IPC分类号： H01L33/58 , H01L33/44 , H01L33/60
CPC分类号： H01L33/58 , H01L33/44 , H01L33/505 , H01L33/60 , H01L2924/0002 , H01L2924/00
摘要： A device includes a light emitting semiconductor device bonded to an optical element. In some embodiments, the optical element may be elongated or shaped to direct a portion of light emitted by the active region in a direction substantially perpendicular to a central axis of the semiconductor light emitting device and the optical element. In some embodiments, the semiconductor light emitting device and optical element are positioned in a reflector or adjacent to a light guide. The optical element may be bonded to the first semiconductor light emitting device by a bond at an interface disposed between the optical element and the semiconductor light emitting device. In some embodiments, the bond is substantially free of organic-based adhesives.
摘要翻译：一种器件包括结合到光学元件的发光半导体器件。在一些实施例中，光学元件可以是细长的或成形的，以将基于垂直于半导体发光器件和光学元件的中心轴的方向引导由有源区域发射的光的一部分。在一些实施例中，半导体发光器件和光学元件被定位在反射器中或与光导相邻。光学元件可以通过在设置在光学元件和半导体发光器件之间的界面处的结合键合到第一半导体发光器件。在一些实施方案中，该键基本上不含有机基粘合剂。

5. 发明公开

EP2266149A1 UNDERFILL PROCESS FOR FLIP-CHIP LEDS 有权转让
标题翻译： UNTERFÜLLUNGSVERFAHRENFÜRFLIP-CHIP-LED
公开(公告)号：EP2266149A1
公开(公告)日：2010-12-29
申请号：EP09722834.0
申请日：2009-03-13
申请人： Koninklijke Philips Electronics N.V. , Philips Lumileds Lighting Company LLC
发明人： BASIN, Grigoriy , DIANA, Frederic , MARTIN, Paul, S. , SIMONIAN, Dima
IPC分类号： H01L33/00
CPC分类号： H01L33/54 , H01L24/97 , H01L33/0079 , H01L33/56 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00
摘要： An underfill technique for LEDs (10, 12) uses compression molding (50) to simultaneously encapsulate an array of flip-chip LED dies mounted on a submount wafer (22). The molding process causes liquid or softened underfill material (41) to fill the gap between the LED dies and the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material (54) over the top and sides of the LED dies is removed using microbead blasting (58). The exposed growth substrate (12) is then removed from all the LED dies by laser lift-off (60), and the underfill supports the brittle epitaxial layers (10) of each LED die during the lift-off process. The submount wafer is then singulated. This wafer-level processing of many LEDs simultaneously greatly reduces fabrication time, and a wide variety of materials may be used for the underfill since a wide range of viscosities is tolerable.
摘要翻译：用于LED的底部填充技术使用压缩成型来同时封装安装在底座晶片上的倒装芯片LED管芯阵列。成型工艺使液体底部填充材料（或软化的底部填充材料）填充LED管芯和底座晶片之间的间隙。然后将底部填充材料硬化，例如通过固化。使用微珠喷砂除去在LED管芯的顶部和侧面上固化的底部填充材料。然后通过激光剥离从裸露的生长衬底去除所有的LED管芯，并且底部填充物在剥离过程中支持每个LED管芯的脆性外延层。然后将底座晶片分割。许多LED的晶片级处理同时大大减少了制造时间，并且可以使用各种各样的材料用于底部填充，因为宽范围的粘度是可以容忍的。

6. 发明公开

EP1503433A3 Mount for semiconductor light emitting device 审中-公开
标题翻译：安装发光二极管
公开(公告)号：EP1503433A3
公开(公告)日：2011-03-09
申请号：EP04103571.8
申请日：2004-07-26
申请人： Philips Lumileds Lighting Company LLC
发明人： BHAT, Jerome, C. , ELPEDES, Cresente, S. , MARTIN, Paul, S. , RUDAZ, Serge, L.
IPC分类号： H01L33/62 , H05K1/03
CPC分类号： H01L33/62 , H01L24/73 , H01L25/167 , H01L33/64 , H01L2224/16145 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/01327 , H01L2924/0133 , H01L2924/0134 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/14 , H05K3/3442 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A device (100) includes a submount (114), and a semiconductor light emitting device (110) mounted on first (118-1) and second (118-2) conductive regions on a first side of the submount in a flip chip architecture configuration. The submount has third and fourth conductive regions on a second side of the submount. The third and fourth conductive regions may be used to solder the submount to structure such as a board (134), without the use of wire bonds. The first and third conductive regions are electrically connected by a first conductive layer and the second and fourth conductive regions are electrically connected by a second conductive layer. The first and second conductive layers may be disposed on the outside of the submount or within the submount.

7. 发明公开

EP1927142A1 INTERCONNECTS FOR SEMICONDUCTOR LIGHT EMITTING DEVICES 审中-公开
标题翻译：链接，半导体发光元件
公开(公告)号：EP1927142A1
公开(公告)日：2008-06-04
申请号：EP06795827.2
申请日：2006-08-30
申请人： Koninklijke Philips Electronics N.V. , Philips Lumileds Lighting Company, LLC.
发明人： SCHIAFFINO, Stefano , HAQUE, Ashim, S. , MARTIN, Paul, S. , STEIGERWALD, Daniel, A. , SUN, Decai
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L33/0095 , H01L33/20 , H01L33/38 , H01L2224/0603 , H01L2224/06102 , H01L2224/48091 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H01L2924/3011 , H01L2924/00014
摘要： A semiconductor light emitting device including a light emitting layer disposed between an n-type region and a p-type region and contacts electrically connected to the n-type region and. the p-type region is connected to a mount. A metal layer (78, 79) arbitrarily patterned to cover at least 20% of the area of the semiconductor light emitting device is plated on either a metal layer (76a, 77a) formed on the mount (70) or a metal layer (76b, 77b) formed on one of the contacts (71, 72). The plated metal layer may replace other known interconnecting techniques such as stud bumps . The semiconductor light emitting device is physically connected to the mount by causing interdif fusion between the contact surfaces of the metal layers. In some embodiments, a layer of solder (84, 85) is formed over the plated metal layer, and then the semiconductor light emitting device is physically connected to the mount by heating the solder.

8. 发明公开

EP1922767A2 COLOR CONVERTED LIGHT EMITTING DIODE 有权转让
标题翻译：发光的色彩转换二极管
公开(公告)号：EP1922767A2
公开(公告)日：2008-05-21
申请号：EP06795708.4
申请日：2006-08-21
申请人： Koninklijke Philips Electronics N.V. , Philips Lumileds Lighting Company, LLC.
发明人： BASIN, Grigoriy , MARTIN, Paul, S. , WEST, Robert, S. , MORITA, Yasumasa , HEEMSTRA, Tewe, H.
IPC分类号： H01L33/00
CPC分类号： H01L33/504 , H01L24/97 , H01L2224/97 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01033 , H01L2924/01051 , H01L2924/01058 , H01L2924/01063 , H01L2924/01079 , H01L2924/01082 , H01L2924/12041 , H01L2933/0041 , H01L2224/81
摘要： A technique for forming a white light LED is disclosed. In one embodiment, the LED emits blue light. A first phosphor for producing red, yellow, yellow-green, or green light is formed to conformably coat the LED die. One suitable deposition technique is electrophoretic deposition (EPD). Over the resulting LED structure is deposited another phosphor (to add the remaining color component) in a binder (e.g., silicone) for encapsulating the die. The blue LED light combines with the two phosphor colors to create white light. Since the two different deposition techniques are independent and easily controllable, the resulting white light temperature is highly controllable and the color emission is substantially uniform.

9. 发明公开

EP2564435A1 LED WAFER WITH LAMINATED PHOSPHOR LAYER 有权转让
标题翻译： LED-WAFER MIT LAMINIERTER PHOSPHORSCHICHT
公开(公告)号：EP2564435A1
公开(公告)日：2013-03-06
申请号：EP11722561.5
申请日：2011-04-27
申请人： Koninklijke Philips Electronics N.V. , Philips Lumileds Lighting Company, LLC
发明人： BASIN, Grigoriy , MARTIN, Paul, S.
IPC分类号： H01L33/00 , H01L33/50 , H01L33/22
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/0095 , H01L33/22 , H01L33/50 , H01L2224/14 , H01L2224/81 , H01L2924/181 , H01L2933/0041 , H01L2924/00012
摘要： An LED wafer with a growth substrate (32) is attached to a carrier substrate by (38), for example, a heat - releasable adhesive (36) so that the LED layers are sandwiched between the two substrates. The growth substrate (32) is then removed, such as by laser lift-off. The exposed surface (46) of the LED layers is then etched (44) to improve light extraction. A preformed phosphor sheet (48), matched to the LEDs, is then affixed to the exposed LED layer. The phosphor sheet (48), LED layers (30), and, optionally, the carrier substrate (38) are then diced (54) to separate the LEDs. The LED dice are released from the carrier substrate by heat or other means, and the individual LED dice are mounted on a submount wafer using a pick-and-place machine. The submount wafer is then diced to produce individual LEDs. The active layer may generate blue light, and the blue light and phosphor light may generate white light having a predefined white point.

10. 发明公开

EP2803093A1 CONTROLLED LED LIGHT OUTPUT BY SELECTIVE AREA ROUGHENING 有权转让
标题翻译：受控LED光源输出通过选择性BEREICHSAUFRAUUNG
公开(公告)号：EP2803093A1
公开(公告)日：2014-11-19
申请号：EP13705009.2
申请日：2013-01-03
申请人： Koninklijke Philips N.V.
发明人： BENEDICT, Maciej , MARTIN, Paul, S. , KHARAS, Boris
IPC分类号： H01L33/00 , H01L33/22
CPC分类号： H01L33/22 , H01L33/0008 , H01L33/005 , H01L33/0079 , H01L33/36
摘要： The surface of a light emitting device is roughened to enhance the light extraction efficiency of the surface, but the amount of roughened area is selected to achieve a desired level of light extraction efficiency. Photo-lithographic techniques may be used to create a mask that limits the roughening to select areas of the light emitting surface. Because the amount of roughened area can be precisely controlled, the light extraction efficiency can be precisely controlled, substantially independent of the particular process used to roughen the surface. Additionally, the selective roughening of the surface may be used to achieve a desired light emission output pattern.

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