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1. 发明授权

EP3000138B1 CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME 有权转让
标题翻译：具有圆顶的芯片尺寸发光器件封装
公开(公告)号：EP3000138B1
公开(公告)日：2017-07-12
申请号：EP14729441.7
申请日：2014-05-05
申请人： Koninklijke Philips N.V.
发明人： AKRAM, Salman , BHARDWAJ, Jyoti Kiron
IPC分类号： H01L33/00 , H01L33/48 , H01L33/54 , H01L33/50 , H01L33/60
CPC分类号： H01L33/54 , H01L33/0079 , H01L33/486 , H01L33/502 , H01L33/60 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： Light Emitting Devices (LEDs) are fabricated on a wafer substrate with one or more thick metal layers that provide structural support to each LED. The streets, or lanes, between individual LEDs do not include this metal, and the wafer can be easily sliced/diced into singulated self-supporting LEDs. Because these devices are self-supporting, a separate support submount is not required. Before singulation, further processes may be applied at the wafer-level; after singulation, these self-supporting LEDs may be picked and placed upon an intermediate substrate for further processing as required. In an embodiment of this invention, protective optical domes are formed over the light emitting devices at the wafer-level or while the light emitting devices are situated on the intermediate substrate.
摘要翻译：发光装置（LED）制造在具有一个或多个厚金属层的晶圆衬底上，所述金属层为每个LED提供结构支撑。单个LED之间的街道或车道不包含这种金属，并且晶圆可以很容易地切成单个自支撑的LED。由于这些设备是自支撑的，因此不需要单独的支撑基座。在单体化之前，可能会在晶圆级采用进一步的工艺; 在分割之后，可以将这些自支撑LED拾取并放置在中间衬底上以根据需要进行进一步处理。在本发明的一个实施例中，保护光学圆顶在晶片级上形成在发光器件上或者当发光器件位于中间衬底上时。

2. 发明公开

EP3022779A1 PC LED WITH OPTICAL ELEMENT AND WITHOUT SUBSTRATE CARRIER 有权转让
标题翻译： PC与LED光学元件与无衬底载体
公开(公告)号：EP3022779A1
公开(公告)日：2016-05-25
申请号：EP14766210.0
申请日：2014-07-17
申请人： Koninklijke Philips N.V.
发明人： BASIN, Grigoriy , HAQUE, Ashim Shatil , KAGEYAMA, Hideo , MORAN, Brendan Jude , BHARDWAJ, Jyoti Kiron
IPC分类号： H01L33/62 , H01L33/00
摘要： Intermediate removable placement and processing structures are provided to enable the formation of optical elements upon light emitting elements, including the formation of a reflective layer beneath the optical elements. These removable placement and processing structures are substantially independent of the particular dimensions of the produced light emitting device, allowing their re-use in a variety of applications. The resultant light emitting device includes the light emitting element,the optical element with reflector, and, optionally, a wavelength conversion material, but does not include remnants of the placement and processing structures, such as a carrier substrate.

3. 发明公开

EP3000138A1 CHIP SCALE LIGHT EMITTING DEVICE PACKAGE WITH DOME 有权转让
标题翻译： VERPACKUNG MIT EINER KUPPELFÜREINE LED INCHIPGRÖSSE
公开(公告)号：EP3000138A1
公开(公告)日：2016-03-30
申请号：EP14729441.7
申请日：2014-05-05
申请人： Koninklijke Philips N.V.
发明人： AKRAM, Salman , BHARDWAJ, Jyoti Kiron
IPC分类号： H01L33/00 , H01L33/48 , H01L33/54
CPC分类号： H01L33/54 , H01L33/0079 , H01L33/486 , H01L33/502 , H01L33/60 , H01L2933/0041 , H01L2933/005 , H01L2933/0058
摘要： Light Emitting Devices (LEDs) are fabricated on a wafer substrate with one or more thick metal layers that provide structural support to each LED. The streets, or lanes, between individual LEDs do not include this metal, and the wafer can be easily sliced/diced into singulated self-supporting LEDs. Because these devices are self-supporting, a separate support submount is not required. Before singulation, further processes may be applied at the wafer-level; after singulation, these self-supporting LEDs may be picked and placed upon an intermediate substrate for further processing as required. In an embodiment of this invention, protective optical domes are formed over the light emitting devices at the wafer-level or while the light emitting devices are situated on the intermediate substrate.
摘要翻译：发光器件（LED）在具有一个或多个提供对每个LED的结构支撑的厚金属层的晶片衬底上制造。单个LED之间的街道或车道不包括该金属，并且可以容易地将晶片切片/切割成单独的自支撑LED。因为这些设备是自支持的，因此不需要单独的支持子安装。在分割之前，可以在晶片级应用进一步的处理; 在分离之后，可以将这些自支撑LED拾取并放置在中间基板上，以便根据需要进一步处理。在本发明的一个实施例中，保护性光学圆顶形成在晶片级的发光器件上，或者在发光器件位于中间衬底上时。

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