专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP0342141A2 Compliant thermally conductive compound 失效
标题翻译： WeichewärmeleistungsfähigeZuammensetzung。
公开(公告)号：EP0342141A2
公开(公告)日：1989-11-15
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253
摘要： A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semi-conductor chips. The compound has chemically stable thermal conduction and viscosity properties, is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.
摘要翻译：兼容导热的，优选介电的化合物，其增强诸如双极VLSI半导体芯片的大功率电气部件的功率耗散能力。该化合物具有化学稳定的热传导和粘度特性，在使用过程中不会进行相分离，并可以以小间隙施加，以使热传导最大化。该化合物优选包括其中分散有热填料颗粒的液体载体和具有与热填料颗粒的煅烧表面反应的官能团的偶联剂，以及在自缩合下优先润湿热填料颗粒的官能团。另外的添加剂如热解法二氧化硅和聚异丁烯增强了在功能使用期间遇到的导热化合物的热机械剪切力降解的相位稳定性和抗性，例如波动的功率循环。

2. 发明公开

EP0237700A3 Method of bonding inorganic particulate material, particularly for multilayer ceramic substrates 失效
标题翻译：粘结无机颗粒材料的方法，特别适用于多层陶瓷基板
公开(公告)号：EP0237700A3
公开(公告)日：1989-02-22
申请号：EP87100210.1
申请日：1987-01-09
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Araps, Constance Joan , Divakaruni, Renuka Shastri , Sachdev, Krishna Gandhi , Zalar, Stoyan Mathias , Kirby, Daniel Patrick , Wolffnufer, Robert , Sachdev, Harbans Singh , Suryanarayana, Darbha
IPC分类号： C04B35/00 , C03C10/00 , H01L21/48 , H05K3/46
CPC分类号： C04B35/6342 , C03C10/00 , C04B35/195 , C04B35/6264 , C04B35/6268 , C04B35/628 , C04B35/6281 , C04B35/62821 , C04B35/6316 , C04B35/6325 , C04B35/634 , C04B35/638 , C04B2235/3232 , C04B2235/449 , C04B2235/6021 , C04B2235/6562 , C04B2235/658 , C04B2235/6582 , C04B2235/6584 , C04B2235/9661 , H01L21/4807 , H05K1/0306
摘要： In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.

3. 发明授权

EP0342141B1 Compliant thermally conductive compound 失效
标题翻译：合格的导电化合物
公开(公告)号：EP0342141B1
公开(公告)日：1993-08-18
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253

4. 发明授权

EP0134938B1 Dry process for forming metal patterns on a surface 失效
标题翻译：在表面形成金属图案的干燥工艺
公开(公告)号：EP0134938B1
公开(公告)日：1988-08-24
申请号：EP84107435.4
申请日：1984-06-28
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Araps, Constance Joan , Lotsko, Catherine Agnes
IPC分类号： H01L21/312 , H01L21/00 , G03F7/02
CPC分类号： G03F7/039 , C23C14/042 , G03F7/36

6. 发明公开

EP0164675A2 Lift-off process 失效
标题翻译： Abhebe-Verfahren。
公开(公告)号：EP0164675A2
公开(公告)日：1985-12-18
申请号：EP85106842.9
申请日：1985-06-03
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Sachdev, Harbans Singh , Sachdev, Krishna Gandhi
IPC分类号： G03F7/10
CPC分类号： H01L21/7688 , G03F7/039 , H01L21/0272 , H05K3/048 , Y10S438/951
摘要： An improved lift-off process for multilevel metal structure in the fabrication of integrated circuits by employing lift-off layer formed from polymers which undergo clean depolymerization under the influence of heat or radiation and allow rapid and residue-free release of an "expendable mask". An embedded interconnection metallurgy system is formed by application of the lift-off layer of this invention over a cured polymer film or on an oxygen RIE barrier layer previously deposited on organic or inorganic substrate, followed by another barrier over which is then coated a radiation sensitive resist layer. After definition of the desired resist pattern by imagewise exposure and development, the image is replicated into the barrier by sputter etching in a fluorine containing ambient and subsequently into the base layer down to the substrate by oxygen reactive ion etching which is followed by blanket metal evaporation and finally the lift-off by brief heat treatment at the depolymerization temperature of the lift-off layer, and brief solvent soak.
摘要翻译：通过使用由在热或辐射的影响下经历清洁解聚的聚合物形成的剥离层，并且允许快速和无残留地释放“消耗性掩模”，在多层金属结构制造集成电路中改进了多层金属结构的剥离工艺，。通过将本发明的剥离层施加在固化的聚合物膜上或预先沉积在有机或无机基底上的氧RIE阻挡层上，然后再涂覆有辐射敏感的另一个屏障，形成嵌入式互连冶金系统抗蚀剂层。在通过图像曝光和显影定义所需的抗蚀剂图案之后，通过在含氟环境中的溅射蚀刻将图像复制到势垒中，随后通过氧反应离子蚀刻进入基底层，然后通过橡皮布金属蒸发最后通过在剥离层的解聚温度下进行短暂热处理，并进行短暂的溶剂浸泡。

7. 发明公开

EP0134938A2 Dry process for forming metal patterns on a surface 失效
标题翻译：用于在表面上产生金属带图案的干法工艺。
公开(公告)号：EP0134938A2
公开(公告)日：1985-03-27
申请号：EP84107435.4
申请日：1984-06-28
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Araps, Constance Joan , Lotsko, Catherine Agnes
IPC分类号： H01L21/312 , H01L21/00 , G03F7/02
CPC分类号： G03F7/039 , C23C14/042 , G03F7/36
摘要： The process for forming a desired metal pattern on a substrate (35) comprises forming a mask of a thermally depolymerizable polymer (40) on the substrate (35) with a pattern of openings (70) complementary to the desired metal pattern, blanket coating the substrate (35) and the mask (40) with a metal (60), heating the substrate (35) to depolymerize the depolymerizable polymer (40), cooling the surface of the metal (60) to thereby delaminate the metal coated in areas where thermally depolymerizable polymer (40) is present, removing the delaminated metal where necessary, and optionally plasma etching the depolymerized polymer, if residue thereof remains, to remove the same from said substrate.
摘要翻译：用于形成在基片所需的金属图案（35）的方法包括将开口的图案形成在基板（35）一个热解聚聚合物（40）的掩模（70）互补的所需的金属图案，毯涂覆基板（35）和所述掩模（40）与金属（60），加热所述基板（35）解聚的解聚的聚合物（40），冷却所述金属（60）的表面，从而分层涂覆在所在区域的金属热解聚的聚合物（40）存在时，去除所述分层金属在必要时，和任选的等离子体蚀刻所述解聚的聚合物，如果其残基仍然存在，从所述基板去除所述相同。

8. 发明公开

EP0342141A3 Compliant thermally conductive compound 失效
标题翻译：合格的导电化合物
公开(公告)号：EP0342141A3
公开(公告)日：1990-01-31
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253
摘要： A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semi-conductor chips. The compound has chemically stable thermal conduction and viscosity properties, is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

9. 发明公开

EP0237700A2 Method of bonding inorganic particulate material, particularly for multilayer ceramic substrates 失效
标题翻译： Verfahren zum Verbinden anorganischer Partikel，insbesonderefürMehrlagen-Keramiksubstrate。
公开(公告)号：EP0237700A2
公开(公告)日：1987-09-23
申请号：EP87100210.1
申请日：1987-01-09
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Araps, Constance Joan , Divakaruni, Renuka Shastri , Sachdev, Krishna Gandhi , Zalar, Stoyan Mathias , Kirby, Daniel Patrick , Wolffnufer, Robert , Sachdev, Harbans Singh , Suryanarayana, Darbha
IPC分类号： C04B35/00 , C03C10/00 , H01L21/48 , H05K3/46
CPC分类号： C04B35/6342 , C03C10/00 , C04B35/195 , C04B35/6264 , C04B35/6268 , C04B35/628 , C04B35/6281 , C04B35/62821 , C04B35/6316 , C04B35/6325 , C04B35/634 , C04B35/638 , C04B2235/3232 , C04B2235/449 , C04B2235/6021 , C04B2235/6562 , C04B2235/658 , C04B2235/6582 , C04B2235/6584 , C04B2235/9661 , H01L21/4807 , H05K1/0306
摘要： In a process for forming elements from a slurry that includes particulate ceramic and/or glass, an organic binder resin, and a solvent for the resin, where the element is shaped from the slurry, and the element heated to remove the organic materials of the slurry and subsequently fuse the ceramic and/or glass particles, the improvement comprised of coating the ceramic and/or glass particles prior to forming the slurry with a surface modification compound selected from the group consisting of organo silanes, organo silazanes, titanium chelates, titanium esters, and mixtures thereof.
摘要翻译：制备方法。包括（a）形成细分的cpd。其包括陶瓷颗粒的颗粒，（b）用可热分解的表面改性有机化合物涂覆颗粒。（I）选自有机硅烷，有机硅氮烷，钛螯合物和钛酯，（c）组合并混合细分的cpd的包衣颗粒。用有机树脂粘合剂和粘合剂的溶剂形成浆料，（d）使浆料成形以形成所需元素，加热元件以除去涂层，粘合剂和溶剂，以及（e）继续加热以熔化颗粒细碎的cpd。

10. 发明公开

EP0164675A3 Lift-off process 失效
标题翻译：提升过程
公开(公告)号：EP0164675A3
公开(公告)日：1987-06-16
申请号：EP85106842
申请日：1985-06-03
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Sachdev, Harbans Singh , Sachdev, Krishna Gandhi
IPC分类号： G03F07/10
CPC分类号： H01L21/7688 , G03F7/039 , H01L21/0272 , H05K3/048 , Y10S438/951
摘要： An improved lift-off process for multilevel metal structure in the fabrication of integrated circuits by employing lift-off layer formed from polymers which undergo clean depolymerization under the influence of heat or radiation and allow rapid and residue-free release of an "expendable mask". An embedded interconnection metallurgy system is formed by application of the lift-off layer of this invention over a cured polymer film or on an oxygen RIE barrier layer previously deposited on organic or inorganic substrate, followed by another barrier over which is then coated a radiation sensitive resist layer. After definition of the desired resist pattern by imagewise exposure and development, the image is replicated into the barrier by sputter etching in a fluorine containing ambient and subsequently into the base layer down to the substrate by oxygen reactive ion etching which is followed by blanket metal evaporation and finally the lift-off by brief heat treatment at the depolymerization temperature of the lift-off layer, and brief solvent soak.
摘要翻译：通过使用由在热或辐射的影响下经历清洁解聚的聚合物形成的剥离层，并且允许快速和无残留地释放“消耗性掩模”，在多层金属结构制造集成电路中改进了多层金属结构的剥离工艺，。通过将本发明的剥离层施加在固化的聚合物膜上或预先沉积在有机或无机基底上的氧RIE阻挡层上，随后再涂覆有辐射敏感的另一个屏障，形成嵌入式互连冶金系统抗蚀剂层。在通过图像曝光和显影定义所需的抗蚀剂图案之后，通过在含氟环境中的溅射蚀刻将图像复制到势垒中，随后通过氧反应离子蚀刻进入基底层，然后通过橡皮布金属蒸发最后通过在剥离层的解聚温度下进行短暂热处理，并进行短暂的溶剂浸泡。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式