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1. 发明公开

EP0342141A2 Compliant thermally conductive compound 失效
标题翻译： WeichewärmeleistungsfähigeZuammensetzung。
公开(公告)号：EP0342141A2
公开(公告)日：1989-11-15
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253
摘要： A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semi-conductor chips. The compound has chemically stable thermal conduction and viscosity properties, is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.
摘要翻译：兼容导热的，优选介电的化合物，其增强诸如双极VLSI半导体芯片的大功率电气部件的功率耗散能力。该化合物具有化学稳定的热传导和粘度特性，在使用过程中不会进行相分离，并可以以小间隙施加，以使热传导最大化。该化合物优选包括其中分散有热填料颗粒的液体载体和具有与热填料颗粒的煅烧表面反应的官能团的偶联剂，以及在自缩合下优先润湿热填料颗粒的官能团。另外的添加剂如热解法二氧化硅和聚异丁烯增强了在功能使用期间遇到的导热化合物的热机械剪切力降解的相位稳定性和抗性，例如波动的功率循环。

2. 发明公开

EP0342141A3 Compliant thermally conductive compound 失效
标题翻译：合格的导电化合物
公开(公告)号：EP0342141A3
公开(公告)日：1990-01-31
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253
摘要： A compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semi-conductor chips. The compound has chemically stable thermal conduction and viscosity properties, is not subject to phase separation during use and may be applied in small gaps to maximize thermal conduction. The compound preferably comprises a liquid carrier having thermal filler particles dispersed therein and a coupling agent having a functionality which is reactive with the calcined surface of the thermal filler particles, and a functionality having preferential wetting of the thermal filler particles over self-condensation. Additional additives such as fumed silica and polyisobutylene enhance the phase stability and resistance to thermo-mechanical shear force degradation of the thermally conductive compound encountered during functional usage, e.g., fluctuating power cycles.

3. 发明公开

EP0805616A1 Electrically conductive compositions 失效
标题翻译： ElektrischleitfähigeZusammensetzungen
公开(公告)号：EP0805616A1
公开(公告)日：1997-11-05
申请号：EP96303162.0
申请日：1996-05-03
申请人： International Business Machines Corporation
发明人： Saraf, Ravi F. , Roldan, Judith Marie , Gaynes, Michael Anthony , Booth, Richard Benton , Ostrander, Stephen Paul , Cooper, Emanuel I. , Sambucetti, Carlos J.
IPC分类号： H05K3/32 , H01B1/22
CPC分类号： H01B1/22 , H05K3/321 , H05K3/361 , H05K2201/0129 , H05K2201/096 , H05K2201/10689 , H05K2203/0783
摘要： An electrically conductive paste composition which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses electrically conductive composite compositions which include the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包含热塑性聚合物，导电金属粉末和有机溶剂系统的导电糊剂组合物。本发明还包括包含上述热塑性和金属的导电复合组合物，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料在高温下由糊状物形成。该糊剂用于涉及在将糊状物转化为复合物的工艺条件下电连接电气和电子部件的方法。

4. 发明授权

EP0342141B1 Compliant thermally conductive compound 失效
标题翻译：合格的导电化合物
公开(公告)号：EP0342141B1
公开(公告)日：1993-08-18
申请号：EP89480042.4
申请日：1989-03-14
申请人： International Business Machines Corporation
发明人： Anderson, Herbert Rudolph, Jr. , Booth, Richard Benton , David, Lawrence Daniel , Neisser, Mark Oliver , Sachdev, Harbans Singh , Takacs, Mark Anthony
IPC分类号： C09K5/00
CPC分类号： C09K5/08 , F28F13/00 , F28F2013/006 , H01L2224/16225 , H01L2224/73253

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