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1. 发明公开

EP0717418A2 Composition containing a polymer and conductive filler and use thereof 失效
标题翻译：组合物包含聚合物和导电填料并使用相同
公开(公告)号：EP0717418A2
公开(公告)日：1996-06-19
申请号：EP95118610.5
申请日：1995-11-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Angelopoulos, Marie , Brusic, Vlasta A. , Graham, Teresita Ordonez , Purushothaman, Sampath , Roldan, Judith Marie , Saraf, Ravi F. , Shaw, Jane Margaret , Viehbeck, Alfred
IPC分类号： H01B1/22 , H01B1/12 , H05K3/14
CPC分类号： H05K9/0083 , C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855 , C08L2666/04
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof.
Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections.
In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.
摘要翻译：提供了一种包含聚合物基质和导电填料组分的组合物。导电填料组分包括选自下组的导电性粒子和高分子由...组成substituiertem和unsubstituiertem聚苯胺，substituiertem和unsubstituiertem polyparaphenylenevinylenes，substituiertem和unsubstituiertem聚噻吩，substituiertem和unsubstituiertem polyazines，substituiertem和unsubstituiertem polyparaphenylenes，substituiertem和unsubstituiertem polyfuranes，substituiertem和unsubstituiertem聚吡咯，substituiertem和unsubstituiertem聚硒吩，substituiertem和unsubstituiertem聚对亚苯基硫醚和substiututed和unsubstituiertem聚乙炔，以及它们的混合物，和它们的共聚物。作为腐蚀保护层，用于静电放电保护，电磁干扰屏蔽金属基板的本发明的组合物是有用的，并作为粘合剂用于互连技术作为替代焊料互连。另外，聚苯胺膜已如腐蚀保护层具有或不具有导电金属颗粒是有用的。

2. 发明公开

EP0180090A2 System and method for automatically monitoring and maintaining desired concentrations of metal plating baths 失效
标题翻译：系统和方法，用于自动监测和遵守在镀浴所需浓度。
公开(公告)号：EP0180090A2
公开(公告)日：1986-05-07
申请号：EP85113091.4
申请日：1985-10-15
申请人： International Business Machines Corporation
发明人： Arbach, Gary Vincent , Bindra, Perminder Singh , Light, David Noel , Rath, David Lee , Roldan, Judith Marie
IPC分类号： G01N27/56 , G01N27/46 , G01N27/42 , G01D21/02 , C23C18/16 , C25D21/12
CPC分类号： C23C18/1617 , C25D21/12
摘要： A system for the automatic, on-line analysis and control of additives in chemical processing solutions in manufacturing processes is disclosed.
The automatic control system embodiment includes a sensing system such as measuring a cell (10) in which appropriate sensors are located. For electrochemical measurements, a three electrode cell with a rotating disk sensor is employed to control agitation of the sample solution. Other sensors on electrodes are used to measure pH and a thermometer is provided to monitor temperature. The sensing process, like the sampling process, is automatically controlled by a controller (18).
The system, in addition to the sensing means and controller, further includes a plating tank (20), a mixing tank (22), a pump or control valve (24) and a reservoir (26). The measuring cell (10) may be disposed in the bath in a standard plating tank in which the plating bath solution is contained. Alternatively, a flow through tank may be used in which the plating solution may flow into and from as desired.
When the sensing means so determines, a replenishment bath from the reservoir can be pumped into the mixing tank by means of the pump or control valve means under the command of signals from the controller which in turn receives output signals from the measuring cell.
摘要翻译：一种用于自动，在线添加剂在化学处理解决方案在生产过程分析和控制系统被游离缺失盘。自动控制系统实施例包括感测系统：如测量哪个合适的传感器所位于的小区（10）。电化学测定，具有旋转盘传感器的三个电极电池用于控制样品溶液的搅拌。上电极以外的传感器用于测量pH值，并且设置一个温度计监测温度。感测方法，像采样过程时，自动由控制器（18）控制。该系统中，除了感测装置和控制器，还包括一个镀槽（20），一个混合槽（22），泵或控制阀（24）和储存器（26）。测量单元（10）可在浴中在其中容纳电镀浴溶液中的标准电镀槽被布置。可替代地，流过罐可以使用其中电镀液可以流入和从任意的。当感测装置，从而确定性地雷，从贮存补给浴可以通过泵或控制阀装置的手段从控制器而这又从测量小区接收输出信号的信号的命令下被泵入混合罐中。

3. 发明公开

EP0456963A1 Superconducting multilayer ceramic substrate 失效
标题翻译： Supraleitendes Mehrschichtkeramiksubstrat。
公开(公告)号：EP0456963A1
公开(公告)日：1991-11-21
申请号：EP91101732.5
申请日：1991-02-08
申请人： International Business Machines Corporation
发明人： Ahn, Byung Tae , Beyers, Robert Bruce , Cooper, Emanuel Israel , Giess, Edward August , O'Sullivan, Eugene John , Roldan, Judith Marie , Romankiw, Lubomyr Taras
IPC分类号： H01L39/08 , H01L21/48 , H01L39/24 , H01L23/498 , H01L21/768 , C04B41/51
CPC分类号： H01L39/2464 , H01L21/4867 , H01L23/15 , H01L23/49888 , H01L2924/0002 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/703 , Y10S505/704 , Y10T428/24917 , Y10T428/31678 , H01L2924/00
摘要： A superconducting multilayer ceramic substrate is disclosed, prepared by firing a laminate of at least two polymer bonded cast sheets of a ceramic dielectric oxide powder, at least one sheet of which has a metallization pattern provided thereon, to thereby form a superconducting oxide reaction layer at the interface between the sintered ceramic material and the embedded metallic conductor lines of the metallization pattern.
摘要翻译：公开了一种超导多层陶瓷基板，其通过烧结陶瓷电介质氧化物粉末的至少两个聚合物粘结的流延片材的层压体，其中至少一个片材具有设置在其上的金属化图案，从而形成超导氧化物反应层烧结陶瓷材料与金属化图案的嵌入式金属导体线之间的界面。

4. 发明公开

EP0374475A1 Soldering and bonding of semiconductor device contacts 失效
标题翻译： Lötenund Verbinden von Halbleiterkontakten。
公开(公告)号：EP0374475A1
公开(公告)日：1990-06-27
申请号：EP89121186.4
申请日：1989-11-16
申请人： International Business Machines Corporation
发明人： Chang, Chin-An , Koopman, Nicholas George , Roldan, Judith Marie , Strickman, Steven , Srivastava, Kamalesh Kumar , Yeh, Helen Li
IPC分类号： B23K35/14 , B23K35/24 , H01L21/60 , H01L21/58 , H01R43/02
CPC分类号： H01L24/81 , B23K35/001 , H01L2224/13111 , H01L2224/81355 , H01L2224/81801 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/0105 , H01L2924/01076 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/14 , H01R43/02 , H05K3/3436 , H05K3/3457 , H01L2224/29099
摘要： A thin, of the order of 20 to 150 nm, layer of the element palladium in solder fusion adjacent to copper operates in a reducing atmosphere to enhance the fusion at low temperature in the total absence of flux. The enhancement capability of the invention can be used in almost all fusion joining operations employing low and high temperature solders and high temperature brazing materials and is applicable in all semiconductor contact technologies including that of the use of a copper block to remove and to thereby dress-up the solder on pads when chips are to be reconnected. The palladium layer of the invention promotes the chemical reduction of any oxides back to the element metals where the oxides are in the fusion region of either the chip or the circuit element to which it is to be attached thereby radically enhancing wetting by the fusion material and effecting joining at markedly reduced temperatures.
摘要翻译：厚度为20至150nm的薄层，与铜相邻的焊料熔化元素钯层在还原气氛中运行，以在完全不存在焊剂的情况下在低温下增强熔化。本发明的增强能力可以用于几乎所有使用低温和高温焊料和高温钎焊材料的熔合接合操作中，并且可以应用于所有的半导体接触技术，包括使用铜块去除并且从而穿着 - 当芯片要重新连接时，焊盘上的焊料就可以了。本发明的钯层促进了任何氧化物的化学还原反向回到元素金属，其中氧化物在芯片或与其连接的电路元件的熔融区域中，从而从根本上增强熔融材料的润湿，在显着降低的温度下进行接合。

5. 发明公开

EP0708582A1 Electrically conductive paste materials and applications 失效
标题翻译： ElektrischleitfähigePastenmaterialien und Anwendungen
公开(公告)号：EP0708582A1
公开(公告)日：1996-04-24
申请号：EP95114838.6
申请日：1995-09-21
申请人： International Business Machines Corporation
发明人： Kang, Sung K. , Graham, Teresita O. , Purushothaman, Sampath , Roldan, Judith Marie , Saraf, Ravi F.
IPC分类号： H05K3/32 , H01L21/60
CPC分类号： H01L24/83 , H01L23/49883 , H01L24/29 , H01L2224/1329 , H01L2224/13347 , H01L2224/16225 , H01L2224/16227 , H01L2224/29101 , H01L2224/29111 , H01L2224/2929 , H01L2224/29347 , H01L2224/29409 , H01L2224/29411 , H01L2224/29413 , H01L2224/29499 , H01L2224/81192 , H01L2224/83101 , H01L2224/83192 , H01L2224/83851 , H01L2224/83886 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01042 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/10253 , H01L2924/14 , H01L2924/15312 , H01L2924/15787 , H01L2924/1579 , H01L2924/351 , H05K1/181 , H05K3/321 , H05K2201/0129 , H05K2201/0218 , H05K2201/10689 , H05K2201/10719 , H05K2203/0425 , H01L2924/00 , H01L2224/2919 , H01L2924/00014
摘要： A structure and method of fabrication are described. The structure is a combination of a polymeric material (36) and particles (32), e.g. Cu, having an electrically conductive coating (34), e.g. Sn. Heat is applied to fuse the coating of adjacent particles. The polymeric material (36) is a thermoplastic. The structure is disposed between two electrically conductive surfaces (40,42), e.g. chip and substrate pads, to provide electrical interconnection and adhesion between their pads.
摘要翻译：描述了一种结构和制造方法。该结构是聚合材料（36）和颗粒（32）的组合，例如 Cu，具有导电涂层（34），例如。锡。施加热量以熔化相邻颗粒的涂层。聚合材料（36）是热塑性材料。该结构设置在两个导电表面（40,42）之间，例如，芯片和衬底焊盘，以提供它们焊盘之间的电互连和粘合。

6. 发明公开

EP0180090A3 System and method for automatically monitoring and maintaining desired concentrations of metal plating baths 失效
标题翻译：用于自动监测和维护金属镀层的预期浓度的系统和方法
公开(公告)号：EP0180090A3
公开(公告)日：1987-03-18
申请号：EP85113091
申请日：1985-10-15
申请人： International Business Machines Corporation
发明人： Arbach, Gary Vincent , Bindra, Perminder Singh , Light, David Noel , Rath, David Lee , Roldan, Judith Marie
IPC分类号： G01N27/56 , G01N27/46 , G01N27/42 , G01D21/02 , C23C18/16 , C25D21/12
CPC分类号： C23C18/1617 , C25D21/12
摘要： A system for the automatic, on-line analysis and control of additives in chemical processing solutions in manufacturing processes is disclosed. The automatic control system embodiment includes a sensing system such as measuring a cell (10) in which appropriate sensors are located. For electrochemical measurements, a three electrode cell with a rotating disk sensor is employed to control agitation of the sample solution. Other sensors on electrodes are used to measure pH and a thermometer is provided to monitor temperature. The sensing process, like the sampling process, is automatically controlled by a controller (18). The system, in addition to the sensing means and controller, further includes a plating tank (20), a mixing tank (22), a pump or control valve (24) and a reservoir (26). The measuring cell (10) may be disposed in the bath in a standard plating tank in which the plating bath solution is contained. Alternatively, a flow through tank may be used in which the plating solution may flow into and from as desired. When the sensing means so determines, a replenishment bath from the reservoir can be pumped into the mixing tank by means of the pump or control valve means under the command of signals from the controller which in turn receives output signals from the measuring cell.

7. 发明公开

EP0805616A1 Electrically conductive compositions 失效
标题翻译： ElektrischleitfähigeZusammensetzungen
公开(公告)号：EP0805616A1
公开(公告)日：1997-11-05
申请号：EP96303162.0
申请日：1996-05-03
申请人： International Business Machines Corporation
发明人： Saraf, Ravi F. , Roldan, Judith Marie , Gaynes, Michael Anthony , Booth, Richard Benton , Ostrander, Stephen Paul , Cooper, Emanuel I. , Sambucetti, Carlos J.
IPC分类号： H05K3/32 , H01B1/22
CPC分类号： H01B1/22 , H05K3/321 , H05K3/361 , H05K2201/0129 , H05K2201/096 , H05K2201/10689 , H05K2203/0783
摘要： An electrically conductive paste composition which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses electrically conductive composite compositions which include the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
摘要翻译：公开了一种包含热塑性聚合物，导电金属粉末和有机溶剂系统的导电糊剂组合物。本发明还包括包含上述热塑性和金属的导电复合组合物，其中基于复合材料的总体积，金属占体积的至少约30体积％。复合材料在高温下由糊状物形成。该糊剂用于涉及在将糊状物转化为复合物的工艺条件下电连接电气和电子部件的方法。

8. 发明公开

EP0717418A3 Composition containing a polymer and conductive filler and use thereof 失效
标题翻译：组合物包含聚合物和导电填料并使用相同
公开(公告)号：EP0717418A3
公开(公告)日：1997-02-19
申请号：EP95118610.5
申请日：1995-11-27
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Angelopoulos, Marie , Brusic, Vlasta A. , Graham, Teresita Ordonez , Purushothaman, Sampath , Roldan, Judith Marie , Saraf, Ravi F. , Shaw, Jane Margaret , Viehbeck, Alfred
IPC分类号： H01B1/22 , H01B1/12 , H05K3/14
CPC分类号： H05K9/0083 , C08G61/12 , C08L33/00 , C08L65/00 , C09D5/08 , C09D5/24 , C09J9/02 , H01B1/125 , H01B1/127 , H01B1/128 , H01B1/22 , H01B1/24 , H05K3/321 , H05K9/0079 , H05K9/0088 , H05K2201/0329 , Y10S428/901 , Y10T428/24917 , Y10T428/25 , Y10T428/31529 , Y10T428/31533 , Y10T428/31605 , Y10T428/31663 , Y10T428/31678 , Y10T428/31681 , Y10T428/31692 , Y10T428/31721 , Y10T428/31725 , Y10T428/31855 , C08L2666/04
摘要： A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substiututed and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as adhesives for interconnect technology as alternatives to solder interconnections. In addition, films of polyanilines are useful as corrosion protecting layers with or without the conductive metal particles.

9. 发明授权

EP0456963B1 Superconducting multilayer ceramic substrate 失效
标题翻译：超导多层陶瓷基板
公开(公告)号：EP0456963B1
公开(公告)日：1996-01-17
申请号：EP91101732.5
申请日：1991-02-08
申请人： International Business Machines Corporation
发明人： Ahn, Byung Tae , Beyers, Robert Bruce , Cooper, Emanuel Israel , Giess, Edward August , O'Sullivan, Eugene John , Roldan, Judith Marie , Romankiw, Lubomyr Taras
IPC分类号： H01L39/08
CPC分类号： H01L39/2464 , H01L21/4867 , H01L23/15 , H01L23/49888 , H01L2924/0002 , Y10S428/901 , Y10S428/93 , Y10S505/701 , Y10S505/703 , Y10S505/704 , Y10T428/24917 , Y10T428/31678 , H01L2924/00

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