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1. 发明公开

EP3158835A4 MODULAR PRINTED CIRCUIT BOARD 审中-公开
公开(公告)号：EP3158835A4
公开(公告)日：2018-06-13
申请号：EP15809672
申请日：2015-05-08
申请人： INTEL CORP
发明人： WELLS KEVIN E , STAMEY RICHARD C
IPC分类号： H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/42 , H05K3/46
CPC分类号： G06F1/16 , H01L2924/0002 , H05K1/115 , H05K1/141 , H05K3/3436 , H05K3/421 , H05K3/4694 , H05K2201/041 , H05K2201/09972 , H05K2201/10159 , H05K2201/10719 , Y02P70/613 , Y10T29/49128 , H01L2924/00
摘要： Described are apparatuses for modular printed circuit boards (PCB) and methods for producing modular PCBs. An apparatus may include a first PCB module with a first pattern of routing structures on one or more layers of the first PCB module. The apparatus may further include a second PCB module with a second pattern of routing structures on one or more layers of the second PCB module. The second pattern of routing structures may be aligned with and electrically coupled to the first pattern of routing structures without connectors. Other embodiments may be described and/or claimed.

2. 发明公开

EP3082330A1 MAINBOARD STRUCTURE AND TERMINAL 审中-公开
标题翻译： KEY PLATINUM结构及终端
公开(公告)号：EP3082330A1
公开(公告)日：2016-10-19
申请号：EP14880363.8
申请日：2014-01-26
申请人： Huawei Device Co., Ltd.
发明人： LIANG, Huanbing , LI, Quanli , LI, Chao , ZHU, Guangyao
IPC分类号： H04N5/225 , H04M1/02 , H01R12/50
CPC分类号： H04M1/0277 , H01L23/13 , H01L23/5385 , H01L2224/16225 , H04N5/2257 , H05K1/141 , H05K1/182 , H05K2201/09072 , H05K2201/10189 , H05K2201/10719 , H05K2201/10962
摘要： Embodiments of the present invention relate to the field of communications, and disclose a mainboard structure and a terminal, in which an overall thickness of the terminal is reduced. A specific solution is as follows: A mainboard structure includes a printed circuit board PCB mainboard, where at least one hollow zone is arranged on the PCB mainboard; and the mainboard structure further includes: a land grid array LGA module one-to-one corresponding to the hollow zone, where an area of a first surface of the LGA module is greater than an area of the hollow zone corresponding to the LGA module; the first surface of the LGA module includes a first region and a second region, where the first region corresponds to the hollow zone, and is used for arranging a key-height component thereon; and the second region is electrically connected to a first surface of the PCB mainboard.

3. 发明公开

EP2852262A4 ELECTRONIC DEVICE AND LGA MODULE 审中-公开
标题翻译： ELEKTRONISCHE VORRICHTUNG UND LGA-MODUL
公开(公告)号：EP2852262A4
公开(公告)日：2015-09-02
申请号：EP13864172
申请日：2013-12-19
申请人： HUAWEI DEVICE CO LTD
发明人： HUANG BENWEI
IPC分类号： H05K1/02 , H01Q1/22 , H05K1/16
CPC分类号： H01Q1/50 , H01Q1/22 , H05K1/0243 , H05K1/111 , H05K1/141 , H05K1/16 , H05K1/18 , H05K2201/094 , H05K2201/10098 , H05K2201/10719 , Y02P70/611
摘要： Embodiments of the present invention provide an electronic apparatus and a land grid array LGA module. The electronic apparatus includes: a first printed circuit board, where a lower surface of the first printed circuit board is provided with a first radio frequency pad and a first non-radio frequency pad; a motherboard, including a second printed circuit board, where an upper surface of the second printed circuit board is provided with a second radio frequency pad and a second non-radio frequency pad, where the first radio frequency pad is connected to the second radio frequency pad, and the first non-radio frequency pad is connected to the second non-radio frequency pad; and an antenna, located on the motherboard and connected to the second radio frequency pad, where a size of the first radio frequency pad is less than a size of the first non-radio frequency pad, a size of the second radio frequency pad is less than a size of the second non-radio frequency pad, and the first radio frequency pad and the second radio frequency pad are configured to transmit, between the LGA module and the motherboard, a radio frequency signal transmitted by the antenna. Because the radio frequency pad of the LGA module does not occupy space of a top surface of the LGA module, effective layout space of the LGA module is increased.
摘要翻译：本发明的实施例提供一种电子设备和陆地网格阵列LGA模块。电子设备包括：第一印刷电路板，其中第一印刷电路板的下表面设置有第一射频焊盘和第一非射频焊盘; 主板，包括第二印刷电路板，其中第二印刷电路板的上表面设置有第二射频焊盘和第二非射频焊盘，其中第一射频焊盘连接到第二射频并且第一非射频焊盘连接到第二非射频焊盘; 以及天线，其位于母板上并连接到第二射频焊盘，其中第一射频焊盘的尺寸小于第一非射频焊盘的尺寸，第二射频焊盘的尺寸较小与第二非射频焊盘的尺寸相比，第一射频焊盘和第二射频焊盘被配置为在LGA模块和主板之间传输由天线发射的射频信号。由于LGA模块的射频焊盘不占用LGA模块的上表面的空间，因此LGA模块的有效布局空间增加。

5. 发明公开

EP2225802A4 SEPARABLE ELECTRICAL CONNECTORS USING ISOTROPIC CONDUCTIVE ELASTOMER INTERCONNECT MEDIUM 审中-公开
标题翻译：可分离的电连接器上的人员的BASIS各向同性ELASTOMER JOINT MEDIA
公开(公告)号：EP2225802A4
公开(公告)日：2011-04-27
申请号：EP08863567
申请日：2008-12-17
申请人： R & D CIRCUITS INC
发明人： RUSSELL JAMES V
IPC分类号： H01R4/58
CPC分类号： H01R13/2414 , H01R4/58 , H01R13/03 , H05K3/245 , H05K3/326 , H05K2201/0314 , H05K2201/10719

6. 发明公开

EP1262782A3 Mounting spring elements on semiconductor devices, and wafer-level testing methodology 失效
标题翻译：弹簧元件上的半导体器件和晶片测试方法装配
公开(公告)号：EP1262782A3
公开(公告)日：2009-06-17
申请号：EP02014918.3
申请日：1995-11-15
申请人： FormFactor, Inc.
发明人： Khandros, Igor Y. , Mathieu, Gaetan L. , Eldridge, Benjamin N. , Grube, Gary W.
IPC分类号： G01R1/073 , H01L21/66 , G01R31/28
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0483 , G01R31/2863 , H01L21/288 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05082 , H01L2224/05644 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45644 , H01L2224/4824 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2224/48744 , H01L2924/20751 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
摘要： The invention provides a method of testing semiconductor devices (702, 704), prior to their being singulated from a semiconductor wafer. Said method comprises the following steps: permanently mounting a plurality of resilient contact structures (708) directly to a plurality of first terminals on at least one semiconductor device (702, 704) which is resident on a semiconductor wafer, each of said resilient contact structures having a tip and extending from a surface of the semiconductor device; urging a substrate (710) having a plurality of second terminals (712) towards the surface of the semiconductor device to effect a plurality of electrical connections between respective ones of the second terminals and tips of the resilient contact structures; and providing signals to the second terminals of the substrate to exercise the semiconductor device.

8. 发明公开

EP1749334A1 FLEXIBLE SCRUB RING CONTACT 有权
标题翻译：柔性擦洗圈接触
公开(公告)号：EP1749334A1
公开(公告)日：2007-02-07
申请号：EP05755116.0
申请日：2005-05-27
申请人： MOLEX INCORPORATED
发明人： NODA, Atsuhito , HOSHIKAWA, Shigeyuki , IKEDA, Hiroshi
IPC分类号： H01R4/02 , H01R13/24
CPC分类号： H01R4/028 , H01L23/49811 , H01L24/12 , H01L24/16 , H01L24/81 , H01L2224/05573 , H01L2224/13011 , H01L2224/13099 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/81012 , H01L2224/81815 , H01L2924/00013 , H01L2924/00014 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01R12/52 , H01R12/57 , H01R12/714 , H01R13/2407 , H01R13/2464 , H05K3/325 , H05K2201/0311 , H05K2201/10265 , H05K2201/10719 , H05K2201/10946 , H01L2224/29099 , H01L2224/05599
摘要： Multiple small conductive and flexible hollow rings (10), each of which is made from a pliable material, provide a flexible connection medium for use between a substrate (23, 80, 82) and a microelectronic device package (88). Each ring is formed to have at least one protuberance (20) on the a ring's exterior surface. The protuberance has an apex (22) or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.
摘要翻译：多个小的导电且柔性的空心环（10），每个都由柔韧材料制成，提供用于基底（23,80,82）和微电子器件封装（88）之间的柔性连接介质。每个环形成为在环的外表面上具有至少一个突起（20）。突起具有顶点（22）或顶点，当顶着表面放置时，当环被径向作用在环上的力压缩时，它将擦洗或刮擦表面。通过擦洗与顶点的接触表面，可以去除可能干扰电信号的表面污染物和分层材料。

9. 发明公开

EP1441232A2 Method for connecting electronic components 失效
标题翻译： Verfahren zur Verbindung von Elektronischen Bauelementen
公开(公告)号：EP1441232A2
公开(公告)日：2004-07-28
申请号：EP04005887.7
申请日：1995-11-15
申请人： FormFactor, Inc.
发明人： Khandros, Igor Y. , Mathieu, Gaetan L. , Eldridge, Benjamin N. , Grube, Gary W.
IPC分类号： G01R1/073
CPC分类号： H05K7/1069 , B23K1/0016 , B23K20/004 , B23K2201/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/0483 , G01R31/2863 , H01L21/288 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L21/67138 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/05082 , H01L2224/05644 , H01L2224/1134 , H01L2224/1147 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13582 , H01L2224/13639 , H01L2224/13644 , H01L2224/13647 , H01L2224/13655 , H01L2224/13657 , H01L2224/16145 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/4554 , H01L2224/45644 , H01L2224/4824 , H01L2224/48465 , H01L2224/48644 , H01L2224/48699 , H01L2224/48844 , H01L2224/49109 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2224/85205 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01R12/52 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K3/4092 , H05K2201/0397 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10378 , H05K2201/10719 , H05K2201/10734 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , H01L2924/00 , H01L2224/48 , H01L2924/20752 , H01L2924/20753 , H01L2224/48744 , H01L2924/20751 , H01L2924/20755 , H01L2924/20756 , H01L2924/20757 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754
摘要： A method of making a temporary connection between a first electronic component and a second electronic component, and subsequently making a permanent connection between the first electronic component and a third electronic component, comprising permanently mounting a plurality of resilient contact structures to a surface of the first electronic component; urging the first electronic component against the second electronic component to effect a temporary connection between the first electronic component and the second electronic component; removing the second electronic component; and mounting the first electronic component to the third electronic component.
摘要翻译：一种在第一电子部件和第二电子部件之间进行临时连接的方法，并且随后在第一电子部件和第三电子部件之间进行永久连接，包括将多个弹性接触结构永久性地安装到第一电子部件的表面上电子元器件; 推动所述第一电子部件抵靠所述第二电子部件以实现所述第一电子部件和所述第二电子部件之间的临时连接; 去除第二电子部件; 以及将所述第一电子部件安装到所述第三电子部件。

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