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    • 2. 发明公开
    • Semiconductor device structure including a dielectrically-isolated insulated-gate transistor
    • Halbleiteranordnung mit dielektrisch isoliertem Feldeffekttransistor mit isoliertem Gate。
    • EP0144654A2
    • 1985-06-19
    • EP84112589.1
    • 1984-10-18
    • GENERAL ELECTRIC COMPANY
    • Baliga, Bantval JayantChow, Tat-Sing Paul
    • H01L29/72H01L27/12H01L21/76
    • H01L29/7394H01L21/76297H01L27/1203
    • An insulated-gate transistor is dielectrically isolated from other semiconductor devices in a monolithic semiconductor device structure. The insulated-gate transistor, in one form, includes, in successively adjoining relationship, a source region, a base region, a voltage-supporting region and a minority carrier injection region. The interfaces between selected, adjacent pairs of these device regions are oriented in their entireties orthogonal to a major surface of the semiconductor device structure that is planar. As a consequence, the insulated-gate transistor achieves a high current capacity as well as high voltage operation without the need for electric field rings. The insulated-gate transistor, in another form, constitutes a bidirectional device with the interfaces, between adjacent device regions being oriented as in the foregoing insulated gate transistor so as to also achieve the same advantages.
    • 绝缘栅晶体管在单片半导体器件结构中与其它半导体器件介电隔离。 一种形式的绝缘栅晶体管以相继的邻接关系包括源极区域,基极区域,电压支撑区域和少数载流子注入区域。 这些器件区域的选定的相邻对之间的界面整体上取向于平坦的半导体器件结构的主表面。 因此,绝缘栅晶体管实现高电流容量以及高电压操作,而不需要电场环。 另一种形式的绝缘栅晶体管构成具有界面的双向器件,相邻器件区域之间的定向与上述绝缘栅极晶体管相同,以达到相同的优点。
    • 5. 发明公开
    • Semiconductor wafer with an electrically-isolated semiconductor device
    • Halbleitersubstrat mit einer elektrisch isolierten Halbleiteranordnung。
    • EP0144865A2
    • 1985-06-19
    • EP84114126.0
    • 1984-11-22
    • GENERAL ELECTRIC COMPANY
    • Wildi, Eric JosephChow, Tat-Sing Paul
    • H01L21/76H01L29/06H01L29/36
    • H01L21/761
    • A semiconductor wafer having a substrate with an epitaxial layer thereon includes a semiconductor device electrically isolated from the substrate as well as from any other devices in the wafer by electrical isolation structure comprising semiconductor material. The semiconductor device can accordingly be operated at high voltage with respect to the wafer substrate. The isolation structure in one form of the wafer comprises an N+ high voltage tub included in the wafer and a P+ ground region situated in the expitaxial layer, adjoining the substrate, and horizontally circumscribing the N+ high voltage tub and being spaced therefrom by a minimum lateral extent of a portion of the epitaxial layer that is of N conductivity type. The N+ high voltage tub comprises an N+ high voltage region situated in the epitaxial layer and surrounding a device region in which the semiconductor device is at least partially contained and, further, an N+ buried layer underlying the N+ high voltage region and the entirety of the device region.
    • 具有其上具有外延层的衬底的半导体晶片包括与衬底以及通过包括半导体材料的电隔离结构与晶片中的任何其它器件电隔离的半导体器件。 因此,相对于晶片衬底,半导体器件可以以高电压工作。 晶片的一种形式的隔离结构包括晶片中包括的N +高压电池和位于外延层中的毗邻衬底的P +接地区域,并且水平地围绕N +高压电池并与其隔开最小的侧向 具有N导电类型的外延层的一部分的程度。 N +高电压槽包括位于外延层中的N +高电压区域,并且包围至少部分地包含半导体器件的器件区域,并且还包括N +高电压区域下面的N +掩埋层和整个 设备区域。