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    • 3. 发明公开
    • System and method for shielding during PECVD deposition processes
    • 系统与Verfahren zur AbschirmungwährendPECVD-Abscheidungsprozessen
    • EP1921658A2
    • 2008-05-14
    • EP07115859.6
    • 2007-09-06
    • Applied Materials, Inc.
    • Stowell, Michael W.
    • H01J37/32
    • H01J37/32321H01J37/32357H01J37/3244H01J37/32449H01J37/32623H01J2237/3321
    • A system and method for plasma enhanced chemical vapor deposition is described. One embodiment includes a process chamber (150); a substrate support (120) positioned inside the process chamber, the substrate support configured to support a substrate (125) on which a film will be deposited; an antenna (110) located inside the process chamber; a radical shield (145) partially surrounding the antenna, the radical shield having an inner volume; a support gas inlet (155) positioned to supply support gas to the inner volume of the radical shield; a precursor gas inlet configured to supply a precursor gas to the inside of the process chamber; at least one aperture (160) in the radical shield, the aperture positioned to enable radicals to escape the inner volume of the radical shield and collide with the precursor gas.
    • 描述了等离子体增强化学气相沉积的系统和方法。 一个实施例包括处理室(150); 位于所述处理室内部的衬底支撑件(120),所述衬底支撑件构造成支撑其上将沉积膜的衬底(125); 位于处理室内的天线(110); 部分围绕天线的基本屏蔽(145),所述基部屏蔽具有内部容积; 支撑气体入口(155),其定位成将支撑气体供应到自由基屏蔽的内部体积; 前体气体入口,构造成将前体气体供应到处理室的内部; 基部护罩中的至少一个孔(160),该孔定位成使得自由基能够逃离基底屏蔽的内部体积并与前体气体碰撞。