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    • 8. 发明公开
    • Arc-coating process with rotating cathodes
    • 旋转阴极的电弧涂覆工艺
    • EP1357577A1
    • 2003-10-29
    • EP02008914.0
    • 2002-04-22
    • Pivot a.s.
    • Morstein, MarcusCselle, Tibor
    • H01J37/34H01J37/32
    • H01J37/32055C23C14/325H01J37/3402H01J2237/022
    • A PVD method is proposed for coating substrates (10) in a vacuum chamber (20) with at least one anode (30), a cathode (40) and a magnetic field source (42). The cathode (40) can be controlled by the magnetic field source (42) in relation to the direction of the separated material. The method is based on the additional step of effectively turning the magnetic field source before the coating process so that the particles separated from the cathode (40) by the arc can impact on a chamber wall and thus cleaning processes can be carried out in the chamber and at the cathode. It is further proposed that the coating should be carried out successively in relation to the height by moving the magnetic field source (42) upwards and downwards, wherein the magnetic field source (42) is turned relative to the cathode (40) during the upward and downward movement and thus the deposition rate is varied in relation to the height. In the upper region and in the lower region of the deposition process the magnetic field source (42) acquires a direction in which the deposition rate is higher than in the central region.
    • 提出了PVD方法用于在具有至少一个阳极(30),阴极(40)和磁场源(42)的真空室(20)中涂覆衬底(10)。 阴极(40)可以由磁场源(42)相对于分离材料的方向进行控制。 该方法基于在涂布过程之前有效地转动磁场源的附加步骤,使得通过电弧从阴极(40)分离的颗粒可以撞击腔室壁,并且因此清洁过程可以在腔室 并在阴极处。 进一步提出,通过向上和向下移动磁场源(42),涂层应该相对于高度连续地进行,其中磁场源(42)相对于阴极(40)在向上 并向下移动,因此沉积速率相对于高度而变化。 在沉积过程的上部区域和下部区域中,磁场源(42)获得沉积速率高于中心区域的方向。