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1. 发明公开

EP1540779A1 HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE 有权
标题翻译：快速和紧密连接设备
公开(公告)号：EP1540779A1
公开(公告)日：2005-06-15
申请号：EP03761284.3
申请日：2003-06-24
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： PERUGINI, Michael , SAYDAM, Erol, D. , EASTMAN, Gary, D. , LANGON, Alfred, J. , PREW, Raymond, A.
IPC分类号： H01R13/648
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

2. 发明授权

EP0139662B1 IMPROVED SOCKET TERMINAL POSITIONING METHOD AND CONSTRUCTION 失效
标题翻译：改进的插座端子定位方法和结构
公开(公告)号：EP0139662B1
公开(公告)日：1991-03-27
申请号：EP84900935.2
申请日：1984-02-06
申请人： ADVANCED INTERCONNECTIONS, INC.
发明人： MURPHY, James, V.
IPC分类号： B23P17/00 , B65D73/02
CPC分类号： B65D73/0042 , H01R4/02 , H01R12/58 , H01R12/65 , H01R43/205 , H05K3/306 , H05K2201/10333 , H05K2201/10424 , H05K2203/0195 , Y10T29/4987 , Y10T29/49876
摘要： An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.

3. 发明公开

EP1540779A4 HIGH SPEED, HIGH DENSITY INTERCONNECTION DEVICE 有权
标题翻译：快速和紧密连接设备
公开(公告)号：EP1540779A4
公开(公告)日：2010-01-06
申请号：EP03761284
申请日：2003-06-24
申请人： ADVANCED INTERCONNECTIONS
发明人： PERUGINI MICHAEL , SAYDAM EROL D , EASTMAN GARY D , LANGON ALFRED J , PREW RAYMOND A
IPC分类号： H01R13/648 , H05K9/00
CPC分类号： H01R12/716 , H01R12/52 , H01R13/187 , H01R13/405 , H01R13/514 , H01R13/6471 , H01R13/6477 , H01R13/6586 , H01R13/6591 , H01R13/6598
摘要： An intercoupling component for receiving an array of contacts within a digital or analog transmission system having an electrical ground circuit and chassis ground circuit, the intercoupling component including a segment formed of electrically insulative material and having an upper and lower surface, the segment including a plurality of holes disposed on its upper surface and arranged in a predetermined footprint and one or more a shield members formed of electrically conductive material disposed within the segment and configured to connect to the chassis ground circuit of the system. The intercoupling component may include an array of electrically conductive contacts within the plurality of holes disposed on the segment. One or more of these contacts may be configured to electrically connect with the electrical ground circuit of the system. The intercoupling component may also include a cavity located between signal contacts to adjust the differential impedance between signal contacts.

4. 发明公开

EP1247312A1 SOCKET/ADAPTER SYSTEM 审中-公开
标题翻译：修正/适配器系统
公开(公告)号：EP1247312A1
公开(公告)日：2002-10-09
申请号：EP00986522.1
申请日：2000-12-18
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： MURPHY, James, W.
IPC分类号： H01R12/00
CPC分类号： H01R12/716 , G01R1/0483 , H01R13/187 , H01R13/2421
摘要： A socket terminal assembly (10) includes a socket body (16) having an end with an opening and an opposite end configured to contact the corresponding connection region of a printed circuit board (14), a contact spring (46), disposed at the opening of the socket body, to receive and apply a frictional force sufficient to retain the lower end of a pin (56) within the opening of the socket body; and a resilient member (60), disposed within a lower end of the opening, to apply, to the pin and in response to a downward force applied to the pin, an upward force sufficient to overcome the frictional force of the contact spring. The pin has an end (55) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end configured to be inserted within the opening of the socket body. An interconnecting component includes a socket support member having holes, each hole receiving a corresponding socket terminal assembly.

5. 发明公开

EP1088371A4 SOLDER BALL TERMINAL 有权
标题翻译： STIFT MITLÖTKUGEL
公开(公告)号：EP1088371A4
公开(公告)日：2001-10-10
申请号：EP99927403
申请日：1999-06-11
申请人： ADVANCED INTERCONNECTIONS
发明人： MURPHY JAMES V
IPC分类号： H01R33/76 , H01R43/02 , H05K3/34 , H05K7/10 , H01R9/09
CPC分类号： H01R43/0235 , H05K3/3426 , H05K3/3436 , H05K3/3478 , H05K7/1084
摘要： A method of providing such an intercoupling component (10) includes positioning terminals (34) within holes (64) of an insulative support member (62) and attaching a solder ball (42) to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
摘要翻译：提供这种相互连接部件（10）的方法包括将端子（34）定位在绝缘支撑构件（62）的孔（64）内并将焊球（42）附接到每个端子。将焊球连接到端子上使用具有多个凹槽的固定装置来完成，所述凹槽位于与绝缘支撑构件中的孔的图案对应的图案中; 用焊球填充每个凹槽; 将绝缘支撑件定位在夹具上，使得每个端子的一端接触相应的焊球，焊球将焊球焊接到端子的端部，同时保持焊球的大体球形。

6. 发明公开

EP1787361A2 HERMAPHRODITIC SOCKET/ADAPTER 审中-公开
标题翻译：雌雄同体/ R插座/适配器
公开(公告)号：EP1787361A2
公开(公告)日：2007-05-23
申请号：EP05784437.5
申请日：2005-08-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： GOODMAN, Glenn , MURPHY, James, V.
IPC分类号： H01R12/00
CPC分类号： H01R12/714 , H01R12/716 , H01R13/631 , H01R24/84
摘要： A hermaphroditic terminal assembly (10) for connecting electrical devices includes an insulating support member (20) for supporting female sockets (22) and male pins (34), a number of female sockets (22), and a number of male pins (34). An intercoupling component (19) for connecting electrical devices includes two hermaphroditic terminal assemblies (16, 18) configured such that the first hermaphroditic terminal assembly (16) can be mated with the second hermaphroditic terminal assembly (18).

7. 发明公开

EP1072180A4 INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK 审中-公开
标题翻译： IC-FASSUNG MITKÜHLKÖRPER
公开(公告)号：EP1072180A4
公开(公告)日：2002-05-02
申请号：EP99919895
申请日：1999-04-16
申请人： ADVANCED INTERCONNECTIONS
发明人： MURPHY JAMES V
IPC分类号： H05K7/20 , H01L23/32 , H01L23/40
CPC分类号： H01L23/32 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An intercoupling component (10) (e.g. socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array (12) positioned within the intercoupling component (10), while maintaining a relatively low profile. The intercoupling component (10) includes a heat sink (30) positioned within the package support member (16) and having an upper surface (45) in contact with a lower surface of the integrated circuit package (12). The package support member (16) includes contact terminals (18) disposed within associated openings (20) of the package for electrically connecting the contacting areas of the integrated circuit package (12) to the corresponding connection regions of the substrate (14). The openings (20) extend from an upper surface to an opposite lower surface of the support member (16) and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink (30) may be configured to be removable and replaceable.
摘要翻译：提供互耦合部件（例如，插座或适配器），用于增加在位于相互耦合部件内的集成电路（IC）阵列内产生的热的耗散，同时保持相对低的轮廓。相互联接部件包括位于封装支撑构件内的散热器，并且具有与设置在封装支撑构件内的集成电路封装的下表面接触的上表面。封装支撑构件包括设置在封装的相关开口内的接触端子，用于将集成电路封装的接触区域电连接到衬底的相应连接区域。开口从支撑构件的上表面延伸到相对的下表面，并且位于与连接触点的图案对应的图案中。散热器可以被配置为可拆卸和可更换的。

8. 发明公开

EP0427560A3 Removing a multi-pin component installed in sockets on a circuit board 失效
标题翻译：拆卸安装在电路板插座上的多针组件
公开(公告)号：EP0427560A3
公开(公告)日：1991-10-16
申请号：EP90312280.2
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R13/633 , H05K13/04
CPC分类号： H01R13/633 , Y10T29/49124 , Y10T29/49821 , Y10T29/53283 , Y10T29/53883 , Y10T29/53891
摘要： An apparatus is disclosed for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongate post for providing force to a surface of the component adjacent the circuit board to remove the component from the sockets. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.

9. 发明公开

EP0427560A2 Removing a multi-pin component installed in sockets on a circuit board 失效
标题翻译：安装在电路板上的多针组件放入插座移除。
公开(公告)号：EP0427560A2
公开(公告)日：1991-05-15
申请号：EP90312280.2
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R13/633 , H05K13/04
CPC分类号： H01R13/633 , Y10T29/49124 , Y10T29/49821 , Y10T29/53283 , Y10T29/53883 , Y10T29/53891
摘要： An apparatus is disclosed for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongate post for providing force to a surface of the component adjacent the circuit board to remove the component from the sockets. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.
摘要翻译：一种装置是游离缺失盘用于去除安装在的电路板上的插座的多接触部件。该装置包括用于该组件的相邻的电路板的一个表面上提供的力从插座移除组件的至少一个细长的柱。至少一个螺钉被机械地联接到柱所以没螺杆的旋转导致所述柱的纵向运动。

10. 发明公开

EP0317310A3 Molded-in lead frames 失效
标题翻译：模压线框架
公开(公告)号：EP0317310A3
公开(公告)日：1990-07-04
申请号：EP88310851.6
申请日：1988-11-17
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V. , Murphy, Michael J.
IPC分类号： H01L23/48 , H01L23/50 , H05K7/10
CPC分类号： H01L23/49827 , H01L23/495 , H01L23/49537 , H01L23/49551 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L2224/4899 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H05K3/326 , H05K7/1023 , H05K7/1061 , H05K7/1092 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： This invention features lead frames, molded lead frames and adapters (10) and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements (12). The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin (26) through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.

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