专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明公开

EP1088371A4 SOLDER BALL TERMINAL 有权
标题翻译： STIFT MITLÖTKUGEL
公开(公告)号：EP1088371A4
公开(公告)日：2001-10-10
申请号：EP99927403
申请日：1999-06-11
申请人： ADVANCED INTERCONNECTIONS
发明人： MURPHY JAMES V
IPC分类号： H01R33/76 , H01R43/02 , H05K3/34 , H05K7/10 , H01R9/09
CPC分类号： H01R43/0235 , H05K3/3426 , H05K3/3436 , H05K3/3478 , H05K7/1084
摘要： A method of providing such an intercoupling component (10) includes positioning terminals (34) within holes (64) of an insulative support member (62) and attaching a solder ball (42) to each of the terminals. Attaching the solder ball to the terminals is accomplished using a fixture having a number of recesses located in a pattern corresponding to a pattern of the holes in the insulative support member; filling each of the recesses with a solder ball; positioning the insulative support member over the fixture so that an end of each of the terminals contact a corresponding solder ball soldering the solder ball to the end of the terminal while maintaining the generally spherical of the solder ball.
摘要翻译：提供这种相互连接部件（10）的方法包括将端子（34）定位在绝缘支撑构件（62）的孔（64）内并将焊球（42）附接到每个端子。将焊球连接到端子上使用具有多个凹槽的固定装置来完成，所述凹槽位于与绝缘支撑构件中的孔的图案对应的图案中; 用焊球填充每个凹槽; 将绝缘支撑件定位在夹具上，使得每个端子的一端接触相应的焊球，焊球将焊球焊接到端子的端部，同时保持焊球的大体球形。

2. 发明公开

EP1072180A4 INTEGRATED CIRCUIT INTERCOUPLING COMPONENT WITH HEAT SINK 审中-公开
标题翻译： IC-FASSUNG MITKÜHLKÖRPER
公开(公告)号：EP1072180A4
公开(公告)日：2002-05-02
申请号：EP99919895
申请日：1999-04-16
申请人： ADVANCED INTERCONNECTIONS
发明人： MURPHY JAMES V
IPC分类号： H05K7/20 , H01L23/32 , H01L23/40
CPC分类号： H01L23/32 , H01L23/4006 , H01L2023/405 , H01L2023/4062 , H01L2023/4068 , H01L2023/4087 , H01L2924/0002 , H01L2924/1433 , H01L2924/00
摘要： An intercoupling component (10) (e.g. socket or adapter) is provided for increasing the dissipation of heat generated within an integrated circuit (IC) array (12) positioned within the intercoupling component (10), while maintaining a relatively low profile. The intercoupling component (10) includes a heat sink (30) positioned within the package support member (16) and having an upper surface (45) in contact with a lower surface of the integrated circuit package (12). The package support member (16) includes contact terminals (18) disposed within associated openings (20) of the package for electrically connecting the contacting areas of the integrated circuit package (12) to the corresponding connection regions of the substrate (14). The openings (20) extend from an upper surface to an opposite lower surface of the support member (16) and are located in a pattern corresponding to a pattern of the connection contacts. The heat sink (30) may be configured to be removable and replaceable.
摘要翻译：提供互耦合部件（例如，插座或适配器），用于增加在位于相互耦合部件内的集成电路（IC）阵列内产生的热的耗散，同时保持相对低的轮廓。相互联接部件包括位于封装支撑构件内的散热器，并且具有与设置在封装支撑构件内的集成电路封装的下表面接触的上表面。封装支撑构件包括设置在封装的相关开口内的接触端子，用于将集成电路封装的接触区域电连接到衬底的相应连接区域。开口从支撑构件的上表面延伸到相对的下表面，并且位于与连接触点的图案对应的图案中。散热器可以被配置为可拆卸和可更换的。

3. 发明公开

EP1787361A4 HERMAPHRODITIC SOCKET/ADAPTER 审中-公开
标题翻译：雌雄同体/ R插座/适配器
公开(公告)号：EP1787361A4
公开(公告)日：2010-07-21
申请号：EP05784437
申请日：2005-08-09
申请人： ADVANCED INTERCONNECTIONS
发明人： GOODMAN GLENN , MURPHY JAMES V
IPC分类号： H01R24/18 , H01R12/22 , H01R13/631
CPC分类号： H01R12/714 , H01R12/716 , H01R13/631 , H01R24/84

4. 发明公开

EP1787362A4 DOUBLE-POGO CONVERTER SOCKET TERMINAL 有权
标题翻译： DOPPELTE POGO-UMWANDLERBUCHSE
公开(公告)号：EP1787362A4
公开(公告)日：2007-12-05
申请号：EP05785719
申请日：2005-08-09
申请人： ADVANCED INTERCONNECTIONS
发明人： GOODMAM GLENN , MURPHY JAMES V
IPC分类号： H01R13/24
CPC分类号： H01R13/2421 , H01R12/714
摘要： A socket terminal assembly (18) includes a socket body (40) having a first end (41) with a first opening to receive a contact element (200) and a second opening at a second end to receive a pin (54). A contact element (200), located in the first opening, is configured to contact the corresponding connection region of a printed circuit board (14); a pin has an end (59) adapted to contact an electrical contacting area of an integrated circuit package (12) and an opposite end (58) configured to be inserted within the opening of the socket body (40). A contact spring (46) in the second opening receives the pin (54) and applies a frictional force sufficient to retain the lower end (56) of the pin (54) within the opening of the socket body. A resilient member (60) is disposed within the opening between the contact element (200) and the contact spring (46). The resilient member (60) applies to the pin and contact element (200), in response to a downward force applied to the pin (54) or an upward force applied to the contact element (200), a force sufficient to overcome the frictional force of the contact spring (46). An intercoupling component (16) includes a socket support member having holes (20), each hole (20) receiving a corresponding socket terminal assembly (18).
摘要翻译：插座端子组件（18）包括具有第一端（41）的插座主体（40），该第一端具有用于接收接触元件（200）的第一开口和用于接收销（54）的第二端处的第二开口。位于所述第一开口中的接触元件（200）构造成接触印刷电路板（14）的相应连接区域; 销具有适于接触集成电路封装（12）的电接触区域的端部（59）和构造成插入插座主体（40）的开口内的相对端部（58）。第二开口中的接触弹簧（46）接收销（54）并施加足以将销（54）的下端（56）保持在插座主体的开口内的摩擦力。弹性构件（60）设置在接触元件（200）和接触弹簧（46）之间的开口内。响应于施加到销（54）的向下的力或施加到接触元件（200）的向上的力，弹性构件（60）施加到销和接触元件（200）的力足以克服摩擦力接触弹簧（46）的力。互连部件（16）包括具有孔（20）的插座支撑构件，每个孔（20）接收对应的插座端子组件（18）。

5. 发明公开

EP0139662A4 IMPROVED SOCKET TERMINAL POSITIONING METHOD AND CONSTRUCTION. 失效
标题翻译：结构与方法与布什定位连接。
公开(公告)号：EP0139662A4
公开(公告)日：1987-04-14
申请号：EP84900935
申请日：1984-02-06
申请人： ADVANCED INTERCONNECTIONS
发明人： MURPHY JAMES V
IPC分类号： B23P19/02 , B23P19/00 , B23P21/00 , B65D73/00 , H01R4/02 , H01R43/20 , H05K3/30 , H05K3/34 , H05K13/04 , B23P17/00 , B65D73/02
CPC分类号： B65D73/0042 , H01R4/02 , H01R12/58 , H01R12/65 , H01R43/205 , H05K3/306 , H05K2201/10333 , H05K2201/10424 , H05K2203/0195 , Y10T29/4987 , Y10T29/49876
摘要： An improved method and construction for positioning a plurality of socket terminals (34) on an electrical circuit board (22) in a predetermined configuration prior to the solder connection thereto. A sheet of electrically insulative, flexible, resinous plastic material (30, 30a) is provided with a plurality of holes (32, 32a) in an array conforming to the desired positioning of the sockets on the circuit boards. The socket terminals are provided with an enlarged generally cylindrical head (50) including an intermediate groove (68) such that the heads extend into the holes (32, 32a) and are adapted for frictional snap engagement with the sheet (30, 30a). The sheet with the array of sockets temporarily held thereby is positioned on the circuit board which is then conventionally soldered so as to electrically and mechanically fix the sockets to the boards. Thereafter, the sheet may be removed. The enlarged head (50) of the circuit terminal is provided with leading edge sheet contacting surface (66) to enable the terminals to be push positioned into the holes without injuring the sheet.

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式