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1. 发明授权

EP3721680B1 ELECTRICAL CRIMP CONNECTOR WITH A TAIL 有权
公开(公告)号：EP3721680B1
公开(公告)日：2024-05-08
申请号：EP18808385.1
申请日：2018-12-04
IPC分类号： H05B3/84 , H01R3/00 , H01R4/18 , H01R4/20 , H01R43/048
CPC分类号： H01R4/02 , H01R4/184 , H05B3/84 , H01R2201/2620130101

2. 发明公开

EP3382832A1 POWER BUS CONNECTION SYSTEM WITH FUSIBLE CONDUCTIVE MATERIAL 审中-公开
公开(公告)号：EP3382832A1
公开(公告)日：2018-10-03
申请号：EP18163500.4
申请日：2018-03-23
申请人： Rockwell Automation Technologies, Inc.
发明人： PETERSON, Corey
IPC分类号： H02B1/21
CPC分类号： H01R25/162 , H01B17/00 , H01H11/06 , H01R4/02 , H02B1/20 , H02B1/21 , H02B11/06 , H02G5/00 , H02G5/002 , H02G5/005 , H05K2201/10272
摘要： A fusible conductive material can be used to electrically connect or join power distribution bus bars that are placed on opposing sides of an electrically insulating bus support. The fusible conductive material can be placed in an opening or hole in the bus support with the bus bars abutting the fusible conductive material on opposing sides. The fusible conductive material can then be ignited, such as by applying a voltage drop, to produce a localized heat source suitable to electrically join the bus bars together. By electrically connecting the bus bars in this manner, the bus bars can better conduct, be less susceptible to separation and require less maintenance with respect to connectivity.

3. 发明授权

EP2555327B1 Cable connection structure of camera module for vehicle 有权
公开(公告)号：EP2555327B1
公开(公告)日：2018-09-05
申请号：EP12174763.8
申请日：2012-07-03
申请人： LG Innotek Co., Ltd.
发明人： Sangyeal, Han , Heungsun, Kim , Bumsig, Cho
IPC分类号： H01R13/405 , H01R12/59 , H05K1/18 , G03B17/02 , G08B13/196 , H01R13/58 , H01R13/66 , H04N5/225 , H01R4/02 , H05K3/34
CPC分类号： H01R4/02 , G03B17/02 , G08B13/19634 , H01R12/59 , H01R13/405 , H01R13/5845 , H01R13/6658 , H01R13/6666 , H01R13/6683 , H01R2201/26 , H04N5/2257 , H05K1/189 , H05K3/3405 , H05K2201/10356
摘要： Disclosed is a cable connection structure of a camera module for a vehicle, the cable connection structure including a cable unit (10) having at least one wire member (11), a flexible printed circuit board FPCB (20) having a terminal (21)on one end thereof and having a connecting portion (22) on the other end, the terminal (21) being soldered (S) to a wire metal piece (11a) exposed at an end of the wire member (11) and having a number corresponding to a number of the wire member (11), the connecting portion (22) being connected to the camera module, and a molded connector (30) surrounding a joining portion between the cable unit (10) and the FPCB (20).

4. 发明公开

EP3335280A1 VERBINDER FÜR SUPRALEITFÄHIGE LEITER UND VERWENDUNG DES VERBINDERS 有权
公开(公告)号：EP3335280A1
公开(公告)日：2018-06-20
申请号：EP16756585.2
申请日：2016-08-10
申请人： Karlsruher Institut für Technologie
发明人： FIETZ, Walter , WOLF, Michael J. , HELLER, Reinhard , WEISS, Klaus-Peter
IPC分类号： H01R4/68
CPC分类号： H01R4/68 , H01B12/06 , H01R4/02 , H01R4/187 , H01R43/28
摘要： The present invention relates to a connector (100) for superconducting conductors, and also to the use of the connector (100). The connector (100), which is suitable for electrically connecting at least one first superconducting conductor (10) to at least one second superconducting conductor (20), comprises: - an electrically conductive base element (30) with a first end section (32), to which the at least first superconducting conductor (10) can be electrically contact-connected, and a second end section (34), to which the at least second superconducting conductor (20) can be electrically contact-connected; and - at least one superconducting auxiliary element (40) which is arranged, at least in regions, in the base element (30) and extends from the first end section (32) to the second end section (34) of the base element (30).

5. 发明公开

EP3327866A1 GLASS PLATE MODULE 审中-公开
公开(公告)号：EP3327866A1
公开(公告)日：2018-05-30
申请号：EP16827808.3
申请日：2016-07-20
申请人： Nippon Sheet Glass Company, Limited
发明人： TOKIWA, Junichi
IPC分类号： H01R4/02 , B60S1/02 , C03C17/06 , H01R12/51 , H05K3/34
CPC分类号： B60S1/02 , C03C17/06 , H01R4/02 , H01R12/51 , H05K3/34
摘要： A glass plate module includes a glass plate (1), an electrically conductive layer (21) laminated on the glass plate (1), a plurality of electrically conductive cables (52) extending from a plurality of connectors or extending from a single connector, a plurality of connection terminals (3) arranged on the electrically conductive layer at an interval, connected to the respective electrically conductive cables, and made of an electrically conductive material, lead-free solder (4) for fixing the connection terminals (3) to the electrically conductive layer (21), and a binding member (53) that binds the plurality of electrically conductive cables (52) together between the connector(s) and the connection terminals.

6. 发明公开

EP3138658A4 LEAD-FREE SOLDER ALLOY 有权
公开(公告)号：EP3138658A4
公开(公告)日：2018-04-11
申请号：EP15785689
申请日：2015-04-28
申请人： NIHON SUPERIOR CO LTD
发明人： NISHIMURA TETSURO , NISHIMURA TAKATOSHI
IPC分类号： B23K35/26 , B23K1/00 , B23K35/02 , B23K35/36 , B23K35/362 , C22C13/00 , C22C13/02
CPC分类号： B23K35/262 , B23K1/0016 , B23K35/0244 , B23K35/025 , B23K35/26 , B23K35/3613 , B23K35/362 , C22C13/00 , C22C13/02 , H01R4/02
摘要： Provided is a lead-free solder alloy and soldering capable of maintaining strong joining strength even in a high-temperature state after soldering and having high reliability and versatility. The lead-free solder alloy composition of the present invention has Sn-Cu-Ni as a basic composition, which includes 0.1 to 2.0 mass% of Cu, and 0.01 to 0.5 mass% of Ni, 0.1 to 5 mass% of Bi, and 76.0 to 99.5 mass% of Sn, such that it is possible to implement soldering with high reliability without decreasing joining strength of a soldered joint even in a state of being exposed to high temperature for a long time, as well as joining strength at the time of bonding.

7. 发明授权

EP2959544B1 WIRE TERMINATION USING FIXTURING ELEMENTS 有权
标题翻译：使用固定元件的电线终端
公开(公告)号：EP2959544B1
公开(公告)日：2018-04-11
申请号：EP13707774.9
申请日：2013-02-20
申请人： Advanced Bionics AG
发明人： WALTER, Jeryle
IPC分类号： H01R4/02 , A61N1/375 , H01R4/12 , H01R4/16 , H01R4/48 , H01R43/02
CPC分类号： H01R4/02 , A61N1/375 , H01R4/023 , H01R4/027 , H01R4/12 , H01R4/16 , H01R4/48 , H01R4/4863 , H01R4/4872 , H01R43/0214 , H01R43/0221 , H01R43/0235 , H01R43/0263 , H01R2201/12
摘要： A method for forming a connection between a wire and a pin includes placing a fixturing element over the pin, capturing the wire between an upper surface and a lower surface of the fixturing element, compressing the fixturing element to hold the wire around the pin and forming a fixed connection between the wire and the pin. A system for forming an electrical connection includes a pin, a fixturing element disposed around the pin, and a wire placed around pin and sandwiched between an upper surface and a lower surface of the fixturing element.

8. 发明公开

EP3191249A1 VERFAHREN ZUR PROZESSZEITVERKÜRZUNG BEIM LÖTEN ELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHER INDUKTIONSERWÄRMUNG 无效
标题翻译： VERFAHREN ZURPROZESSZEITVERKÜRZUNGBEIMLÖTENELEKTRISCHER ODER ELEKTRONISCHER BAUTEILE MITTELS ELEKTROMAGNETISCHERINDUKTIONSERWÄRMUNG
公开(公告)号：EP3191249A1
公开(公告)日：2017-07-19
申请号：EP15763876.8
申请日：2015-09-10
申请人： FEW Fahrzeugelektrikwerk GmbH & Co. KG
发明人： JENRICH, André
IPC分类号： B23K1/002 , B23K1/00 , B23K1/19 , H01R4/02 , B23K103/04 , B23K103/00
CPC分类号： B23K1/002 , B23K1/0016 , B23K1/19 , B23K35/262 , B23K35/264 , B23K2203/04 , B23K2203/05 , B23K2203/54 , H01R4/02 , H01R12/57 , H01R43/0207 , H05B3/84 , H05B2203/016
摘要： The invention relates to a method for shortening the process time during the soldering of electric or electronic components by means of electromagnetic induction heating, in particular the soldering of electric contact elements to solder connection surfaces that are applied to a non-metallic substrate, in particular a pane of glass. According to the invention, an electric contact element is first produced, designed as a solder foot, made of a material with an iron-nickel or iron-chromium alloy base. Subsequently, a lead-free connecting material is applied to the solder foot. After the solder foot has been positioned on the respective solder connection surface, the solder foot is inductively heated by means of high frequency energy with increased heating of the solder foot material and reduced heating of the silver-containing material of the respective solder connection surface. The soldering stage is completed after a time of
摘要翻译：本发明涉及一种用于通过电磁感应加热来缩短电气或电子部件焊接过程中的处理时间的方法，特别是电接触元件焊接到施加到非金属衬底的焊接连接表面的焊接，特别是一片玻璃。根据本发明，首先制造电接触元件，其设计为焊脚，由具有铁 - 镍或铁 - 铬合金基底的材料制成。随后，将无铅连接材料施加到焊脚。在焊脚已经定位在相应的焊料连接表面上之后，通过高频能量对焊脚进行感应加热，同时增加焊脚材料的加热并且减少相应焊料连接表面的含银材料的加热。焊接阶段在<10s的时间内完成，特别是在<4s至6s的时间内完成。本发明还涉及特殊焊脚形式的接触元件。

9. 发明公开

EP3157065A1 APPARATUS AND METHOD FOR ATTACHING INTERCONNECTOR OF SOLAR CELL PANEL 有权转让
标题翻译： VORRICHTUNG UND VERFAHREN ZUR BEFESTIGUNG VON VERBINDERN EINES SOLARZELLENPANEELS
公开(公告)号：EP3157065A1
公开(公告)日：2017-04-19
申请号：EP16193485.6
申请日：2016-10-12
申请人： LG Electronics Inc.
发明人： Kim, Jinsung , Lee, Hyunho , Oh, Donghae , Kang, Woojoong , Kim, Jangho , Kang, Dongju , Sim, Kyuhyeok
IPC分类号： H01L31/05
CPC分类号： H01L31/18 , B23K1/0016 , B23K1/203 , B23K3/082 , B23K35/362 , H01L31/05 , H01L31/0504 , H01R4/02 , Y02E10/50
摘要： Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.
摘要翻译：公开了一种用于连接太阳能电池板的互连器的方法。该方法包括通过喷射在互连器上喷射助熔剂来形成焊剂层，所述互连器包括形成在芯层表面上的芯层和焊料层，并且通过焊料层的焊接将互连器附接到太阳能电池在加热的同时将互连器按压到太阳能电池上。

10. 发明公开

EP3136510A1 VERBESSERUNG DER HAFTUNG VON VERBINDUNGSELEMENTEN DIE MITTELS LOTPASTE AUF EIN METALLISCHES SUBSTRAT GELÖTET WERDEN 审中-公开
标题翻译：改善紧固件BY焊料焊接的金属基板上的责任
公开(公告)号：EP3136510A1
公开(公告)日：2017-03-01
申请号：EP15002499.0
申请日：2015-08-24
申请人： Funk, Brigitta
发明人： Funk, Brigitta
IPC分类号： H01R4/02 , H01R12/57
CPC分类号： H01R4/02 , H01R4/028 , H01R9/16
摘要： Erstens wird durch eine geeignete Formgebung erreicht:
- dass sich die Flussmittelgase nicht zwischen dem Verbindungselement und dem metallischen Substrat ansammeln und sich dadurch die Haftung des Verbindungselements auf dem substrat verringert.
- dass die effektive benetzbare Lötfläche bei gleich bleibender Grundfläche vergrößert wird und sich somit die Haftung des Verbindungselements auf dem Substrat erhöht.
- dass die funktionell nicht notwendige Masse des Verbindungselements eliminiert wird, um die für die Lötung notwendige thermische Energie zu reduzieren und folglich kalte Lötstellen zu vermeiden.
Zweitens wird durch Verwendung von Verankerungen die Haftung des Verbindungselements auf dem Substrat verbessert, so dass in Folge die mechanische Belastbarkeit bezüglich Dreh- und Kippmoment erhöht wird.
摘要翻译：首先，通过的一个适当的成形实现： - 使磁通气体不会在连接元件和所述金属衬底和衬底从而减少了连接件的上的粘附之间收集。 - 所述有效可湿性焊接表面以恒定基增加，因此增加了在基板上的连接元件的粘合性。 - 所述连接元件的功能上必要的质量被消除，以减少焊接，热能所需要的时间，从而避免冷焊点。其次，连接件的粘附性通过使用锚的所述基板上的改善，以使得作为结果的机械强度相对于增加的旋转和倾斜力矩。

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