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1. 发明公开

EP0427563A2 Apparatus and method for installation of multi-pin components on circuit boards 失效
标题翻译： Gerätund Verfahren zum Montieren von Mehrstiftskomponenten auf Schaltungsplatten。
公开(公告)号：EP0427563A2
公开(公告)日：1991-05-15
申请号：EP90312283.6
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R9/09 , H05K7/10
CPC分类号： H01R12/52 , Y10T29/49153 , Y10T29/53183
摘要： An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets or posts mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets or posts. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. In the circuit board socket arrangement, each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.
摘要翻译：公开了一种用于在多针组件的销和安装在电路板上的插座或柱之间进行连接的装置和方法。多个转换器元件安装在部件销和插座或柱之间。每个转换器元件包括用于与多针销组件的销匹配的接收器。接收器的尺寸适合于在粗糙的直径范围内接合具有任何直径的销。在电路板插座布置中，每个转换器元件还包括用于与电路板上的插座配合的精密销。精密销的直径保持在公差，使其在直径的精确范围内。精度范围内的直径变化小于粗径范围内的变化。

2. 发明公开

EP0427560A3 Removing a multi-pin component installed in sockets on a circuit board 失效
标题翻译：拆卸安装在电路板插座上的多针组件
公开(公告)号：EP0427560A3
公开(公告)日：1991-10-16
申请号：EP90312280.2
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R13/633 , H05K13/04
CPC分类号： H01R13/633 , Y10T29/49124 , Y10T29/49821 , Y10T29/53283 , Y10T29/53883 , Y10T29/53891
摘要： An apparatus is disclosed for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongate post for providing force to a surface of the component adjacent the circuit board to remove the component from the sockets. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.

3. 发明公开

EP0427560A2 Removing a multi-pin component installed in sockets on a circuit board 失效
标题翻译：安装在电路板上的多针组件放入插座移除。
公开(公告)号：EP0427560A2
公开(公告)日：1991-05-15
申请号：EP90312280.2
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R13/633 , H05K13/04
CPC分类号： H01R13/633 , Y10T29/49124 , Y10T29/49821 , Y10T29/53283 , Y10T29/53883 , Y10T29/53891
摘要： An apparatus is disclosed for removing a multi-contact component installed in sockets on a circuit board. The apparatus includes at least one elongate post for providing force to a surface of the component adjacent the circuit board to remove the component from the sockets. At least one screw is mechanically coupled to the post so that rotation of the screw causes longitudinal movement of the post.
摘要翻译：一种装置是游离缺失盘用于去除安装在的电路板上的插座的多接触部件。该装置包括用于该组件的相邻的电路板的一个表面上提供的力从插座移除组件的至少一个细长的柱。至少一个螺钉被机械地联接到柱所以没螺杆的旋转导致所述柱的纵向运动。

4. 发明公开

EP0317310A3 Molded-in lead frames 失效
标题翻译：模压线框架
公开(公告)号：EP0317310A3
公开(公告)日：1990-07-04
申请号：EP88310851.6
申请日：1988-11-17
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V. , Murphy, Michael J.
IPC分类号： H01L23/48 , H01L23/50 , H05K7/10
CPC分类号： H01L23/49827 , H01L23/495 , H01L23/49537 , H01L23/49551 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L2224/4899 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H05K3/326 , H05K7/1023 , H05K7/1061 , H05K7/1092 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： This invention features lead frames, molded lead frames and adapters (10) and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements (12). The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin (26) through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.

5. 发明公开

EP0427563A3 Apparatus and method for installation of multi-pin components on circuit boards 失效
标题翻译：在电路板上安装多引脚组件的装置和方法
公开(公告)号：EP0427563A3
公开(公告)日：1991-07-31
申请号：EP90312283.6
申请日：1990-11-09
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V.
IPC分类号： H01R9/09 , H05K7/10
CPC分类号： H01R12/52 , Y10T29/49153 , Y10T29/53183
摘要： An apparatus and method are disclosed for making connections between the pins of a multi-pin component and sockets or posts mounted on a circuit board. A plurality of converter elements are installed between the component pins and sockets or posts. Each converter element includes a receptor for mating with a pin of the multiple pin component. The receptor is sized to engage a pin having any diameter within a coarse range of diameters. In the circuit board socket arrangement, each converter element also includes a precision pin for mating with a socket on the circuit board. The diameter of the precision pin is held to a tolerance so that it is within a precision range of diameters. The variation in diameter within the precision range is less than the variation within the coarse range of diameters.

6. 发明公开

EP0317310A2 Molded-in lead frames 失效
标题翻译： Eingegossene Verdrahtungsleiter。
公开(公告)号：EP0317310A2
公开(公告)日：1989-05-24
申请号：EP88310851.6
申请日：1988-11-17
申请人： ADVANCED INTERCONNECTIONS CORPORATION
发明人： Murphy, James V. , Murphy, Michael J.
IPC分类号： H01L23/48 , H01L23/50 , H05K7/10
CPC分类号： H01L23/49827 , H01L23/495 , H01L23/49537 , H01L23/49551 , H01L23/49861 , H01L24/48 , H01L24/49 , H01L2224/4899 , H01L2224/49109 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15312 , H01L2924/19041 , H01L2924/30107 , H01L2924/3025 , H05K3/326 , H05K7/1023 , H05K7/1061 , H05K7/1092 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： This invention features lead frames, molded lead frames and adapters (10) and sockets produced by molding these lead frames. In general, the lead frames comprise a frame and a circuit, wherein the circuit comprises a plurality of electrical conducting elements (12). The elements are held in position by the frame, and each element comprises an area within the element suitable for positioning a pin (26) through the element to electrically connect the element with the board. The lead frame can be molded in plastic and trimmed to remove the frame to leave each element electrically separate from each other element.
摘要翻译：本发明的特征在于引线框架，模制引线框架和适配器（10）以及通过模制这些引线框而产生的插座。通常，引线框架包括框架和电路，其中电路包括多个导电元件（12）。元件通过框架保持就位，并且每个元件包括适于将销（26）定位穿过元件的元件内的区域，以将元件与板电连接。引线框架可以塑料模制并修整以移除框架，以使每个元件与彼此元件电气分离。

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