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81. 发明公开

EP3163602A2 METHOD OF PRODUCING A SEMICONDUCTOR DEVICE BY BONDING SILVER ON A SURFACE OF A SEMICONDUCTOR ELEMENT WITH SILVER ON A SURFACE OF A BASE IN AIR OR IN AN OXYGEN ENVIRONMENT 审中-公开
标题翻译：法生产半导体器件通过将银与银的半导体元件的表面上的碱在空气或氧气环境中的表面
公开(公告)号：EP3163602A2
公开(公告)日：2017-05-03
申请号：EP16002297
申请日：2010-01-20
申请人： NICHIA CORP
发明人： KURAMOTO MASAFUMI , OGAWA SATORU , NIWA MIKI
IPC分类号： H01L21/58 , H01L21/60 , H01L33/40 , H01L33/48 , H01L33/62 , H01S5/022
CPC分类号： H01L33/44 , H01L23/08 , H01L23/293 , H01L23/49579 , H01L23/49582 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/83 , H01L33/62 , H01L2224/05568 , H01L2224/16 , H01L2224/16225 , H01L2224/2712 , H01L2224/2745 , H01L2224/275 , H01L2224/29023 , H01L2224/2908 , H01L2224/29083 , H01L2224/29101 , H01L2224/29111 , H01L2224/29139 , H01L2224/29187 , H01L2224/2919 , H01L2224/29339 , H01L2224/32225 , H01L2224/45144 , H01L2224/73265 , H01L2224/83048 , H01L2224/83055 , H01L2224/83075 , H01L2224/83201 , H01L2224/83203 , H01L2224/83205 , H01L2224/83207 , H01L2224/83439 , H01L2224/83487 , H01L2224/8383 , H01L2224/8384 , H01L2224/83894 , H01L2224/83895 , H01L2224/83896 , H01L2224/83907 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01063 , H01L2924/01064 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01105 , H01L2924/0132 , H01L2924/01322 , H01L2924/014 , H01L2924/04941 , H01L2924/0541 , H01L2924/0665 , H01L2924/09701 , H01L2924/12035 , H01L2924/12036 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/1576 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/201 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/3025 , H01L2933/0066 , H01S5/0226 , H01L2924/00015 , H01L2924/00 , H01L2924/3512 , H01L2224/48 , H01L2224/05599
摘要： An object of the invention is to provide a method for producing a conductive member having low electrical resistance, and the conductive member is obtained using a low-cost stable conductive material composition that does not contain an adhesive. Disclosed is a method for producing a semiconductor device in which silver (520, 620, 720) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a base (500, 600, 700) and silver (140, 240, 340) formed by silver sputtering, silver vapour deposition or silver plating and provided on a surface of a semiconductor element (100, 200, 300) are bonded, the method comprising the steps of arranging the semiconductor element (100, 200, 300) on the base (500, 600, 700) such that said silver (140, 240, 340) provided on a surface of the semiconductor element (100, 200, 300) is in contact with said silver (520, 620, 720) provided on a surface of the base (500, 600, 700), temporarily bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying a pressure or an ultrasonic vibration to the semiconductor element (100, 200, 300) or the base (500, 600, 700), and permanently bonding the semiconductor element (100, 200, 300) and the base (500, 600, 700) by applying heat having a temperature of 150 to 900°C to the semiconductor element (100, 200, 300) and the base (500, 600, 700) in air or in an oxygen environment. The step of temporarily bonding and the step of permanently bonding may be performed simultaneously. The semiconductor element (100, 200, 300) and the base (500, 600, 700) may be heated in advance at 150 to 900°C before the step of temporarily bonding. A pressure of 5 to 50 MPa may be applied before the step of temporarily bonding. The semiconductor element (100, 200, 300) may be a light emitting semiconductor element.
摘要翻译：本发明的一个目的是提供一种用于生产具有低电阻的导电性构件的方法，所述导电构件是用一种低成本的稳定的导电材料组合物并不含有获得，在粘接剂。公开了一种用于生产，其中银以银溅射，银蒸镀或银电镀形成，并且设置在基座（500，600，700）和银的表面上的半导体器件（520，620，720）的方法（140， 240，340）所形成由银溅射，银蒸镀或电镀银并提供了一种半导体元件（100，200,300）的表面上的键合，该方法包括配置半导体元件（100，200的步骤，300 ）基体（500,600，700），检查这就是说，340设置在半导体元件（100，200,300）的表面上的银（140，240）是与所述银（520，620，720接触）上设置在基座（500，600，700），通过施加压力或超声波振动到半导体元件暂时的半导体元件（100，200，300）和基部（500，600，700）接合（的表面上 100，200，300）或所述基部（500，600,700），和永久地接合半导体元件（100，200,300）和第 E型灯头（500，600，700）通过施加具有150〜900℃的半导体元件（100，200，300），并在空气中或在氧气环境中的基站（500,600，700）的热。的暂时接合步骤和永久地结合的步骤可以同时进行。半导体元件（100，200，300）和基部（500，600，700）可以预先在150的临时粘结步骤之前被加热到900℃。 5至50MPa的压力可能暂时结合步骤之前施加。半导体元件（100，200，300）可以是半导体发光元件。

82. 发明公开

EP3157051A2 ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGE WITH HEATSINK OPENING, AND METHODS OF MANUFACTURE THEREOF 有权
标题翻译：连同其产生热量SINK开幕和方法封装的半导体部件容
公开(公告)号：EP3157051A2
公开(公告)日：2017-04-19
申请号：EP16190003.0
申请日：2016-09-21
申请人： NXP USA, Inc.
发明人： Abdo, David , Jones, Jeffrey Kevin
IPC分类号： H01L23/31 , H01L21/56 , H01L23/433
CPC分类号： H03F1/301 , H01L21/56 , H01L23/3107 , H01L23/36 , H01L23/4334 , H01L23/481 , H01L23/4824 , H01L23/5223 , H01L23/5227 , H01L23/66 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/83 , H01L2223/6644 , H01L2224/291 , H01L2224/29139 , H01L2224/2929 , H01L2224/293 , H01L2224/32245 , H01L2224/32258 , H01L2224/3303 , H01L2224/83801 , H01L2224/8384 , H01L2224/83851 , H01L2924/1304 , H01L2924/141 , H01L2924/1421 , H01L2924/1815 , H03F1/0288 , H03F1/565 , H03F3/193 , H03F3/195 , H03F2200/222 , H03F2200/387 , H03F2200/447 , H01L2924/014 , H01L2924/00014 , H01L2924/00012
摘要： Embodiments include packaged semiconductor devices and methods of manufacturing packaged semiconductor devices. A semiconductor die includes a conductive feature coupled to a bottom surface of the die. The conductive feature only partially covers the bottom die surface to define a conductor-less region that spans a portion of the bottom die surface. The die is encapsulated by attaching the encapsulant material to the bottom die surface (e.g., including over the conductor-less region). The encapsulant material includes an opening that exposes the conductive feature. After encapsulating the die, a heatsink is positioned within the opening, and a surface of the heatsink is attached to the conductive feature. Because the heatsink is attached after encapsulating the die, the heatsink sidewalls are not directly bonded to the encapsulant material.
摘要翻译：实施例包括封装半导体器件和制造封装半导体器件的方法。它包括一个导电特征的半导体耦合到所述管芯的底表面上。导电特征仅部分地覆盖底部的表面，以限定导体少区域确实跨越底表面的一个部分，所述。模具是由密封材料附着到底，表面（例如，包括在导体少区域）包封。该封装材料包括开幕确实暴露传导特征。包封模具后，散热器在所述开口内定位，并且散热器的表面附接至所述导电部件。因为散热器封装模具后附接时，散热器侧壁不直接键合到密封剂材料。

83. 发明公开

EP3150680A1 THERMOCONDUCTIVE ELECTROCONDUCTIVE ADHESIVE COMPOSITION 审中-公开
标题翻译： ÄRMELEITENDEELEKTRISCH LEITENDE KLEBSTOFFZUSAMMENSETZUNG
公开(公告)号：EP3150680A1
公开(公告)日：2017-04-05
申请号：EP15799331.2
申请日：2015-05-28
申请人： Tanaka Kikinzoku Kogyo K.K.
发明人： ABE, Shintaro , FURUSHO, Rikia
IPC分类号： C09J163/00 , C09J9/02 , C09J11/04 , C09J11/06 , C09J121/00
CPC分类号： C09J9/02 , C08G59/5033 , C08G59/504 , C08G59/621 , C08K2003/0806 , C09J11/04 , C09J11/06 , C09J11/08 , C09J121/00 , C09J163/00 , C09J163/04 , C09K5/14 , H01B1/02 , H01B1/22 , H01L23/3737 , H01L24/29 , H01L2224/2929 , H01L2224/29339 , H01L2924/0665 , H01L2924/07811 , H01L2924/2075 , H01L2924/20751 , C08L63/00 , C08K2201/001
摘要： The present invention relates to a thermally and electrically conductive adhesive composition, which includes (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent, and (D) a curing agent, wherein the electrically conductive filler (A) is a silver powder having an average particle diameter of 1 to 10 µm, the epoxy resin (B) has two or more epoxy functional groups and aromatic rings in each molecule, the reactive diluent (C) is a compound having two or more glycidyl ether functional groups in an aliphatic hydrocarbon chain and also having a molecular weight of 150 to 600, and the curing agent (D) is a compound having two or more phenol functional groups in each molecule, a compound having two or more aniline functional groups in each molecule, or a mixture of these compounds, and the content of each of the electrically conductive filler (A), the epoxy resin (B), the reactive diluent (C), and the curing agent (D) is within a specific range. The thermally and electrically conductive adhesive composition of the present invention has high thermal conductivity and stable electrical conductivity.
摘要翻译：本发明涉及一种导热粘合剂组合物，其包括（A）导电填料，（B）环氧树脂，（C）反应性稀释剂和（D）固化剂，其中导电填料（A）是平均粒径为1〜10μm的银粉，环氧树脂（B）在各分子中具有两个以上的环氧官能团和芳香环，反应性稀释剂（C）为具有2个以上脂肪族烃链中更多的缩水甘油醚官能团，分子量为150〜600，固化剂（D）为分子中具有两个以上苯酚官能团的化合物，具有两个以上苯胺官能团的化合物每个分子中的基团或这些化合物的混合物，导电填料（A），环氧树脂（B），反应性稀释剂（C）和固化剂（D）中的每一种的含量在具体范围。本发明的导热粘合剂组合物具有高导热性和稳定的导电性。

84. 发明公开

EP3036762A4 SEMICONDUCTOR DEVICE 有权转让
标题翻译： HALBLEITERBAUELEMENT
公开(公告)号：EP3036762A4
公开(公告)日：2017-03-22
申请号：EP14837815
申请日：2014-03-26
申请人： LG ELECTRONICS INC
发明人： RHEE BYUNGJOON
IPC分类号： H01L23/48 , H01L23/492 , H01L33/62
CPC分类号： H01L33/62 , C09J9/02 , C09J2201/602 , H01L23/4828 , H01L23/4922 , H01L23/5328 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L24/91 , H01L33/36 , H01L33/38 , H01L51/5246 , H01L2224/0401 , H01L2224/1134 , H01L2224/1411 , H01L2224/2929 , H01L2224/29355 , H01L2224/29386 , H01L2224/29561 , H01L2224/29644 , H01L2224/29655 , H01L2224/81191 , H01L2224/81903 , H01L2224/83192 , H01L2224/83851 , H01L2224/9211 , H01L2225/1058 , H01L2924/12041 , H01L2924/156 , H01L2924/35 , H01L2924/36 , H01L2924/00014 , H01L2924/00 , H01L2224/81 , H01L2224/83
摘要： A semiconductor device includes an electrode including a plurality of pillars, a semiconductor element configured to be electrically-connected with the electrode, a substrate having electrode patterns, and a conductive adhesive layer located between the substrate and the electrode, the conductive adhesive layer including conductive substances configured to electrically-connect the pillars and the electrode patterns to each other, and including a body which encloses the conductive substances.
摘要翻译：一种半导体器件，包括：包括多个柱的电极;被配置为与所述电极电连接的半导体元件;具有电极图案的基板;以及位于所述基板和所述电极之间的导电粘合剂层，所述导电粘合剂层包括导电被配置为将所述柱和所述电极图案彼此电连接的物质，并且包括包围所述导电物质的主体。

85. 发明公开

EP3118896A4 SEMICONDUCTOR DEVICE 有权转让
标题翻译： HALBLEITERBAUELEMENT
公开(公告)号：EP3118896A4
公开(公告)日：2017-03-15
申请号：EP15760740
申请日：2015-01-15
申请人： TOYOTA MOTOR CO LTD , DENSO CORP
发明人： KADOGUCHI TAKUYA , HIRANO TAKAHIRO , KAWASHIMA TAKANORI , FUKUTANI KEITA , OKUMURA TOMOMI , NISHIHATA MASAYOSHI
IPC分类号： H01L23/495 , H01L25/07
CPC分类号： H01L23/49513 , H01L21/4825 , H01L21/4882 , H01L21/565 , H01L23/3121 , H01L23/3142 , H01L23/4334 , H01L23/49537 , H01L23/49551 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/92 , H01L2224/29111 , H01L2224/32245 , H01L2224/33181 , H01L2224/40245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83801 , H01L2224/92165 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2224/05599
摘要： The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.
摘要翻译：该半导体装置包括半导体元件以及与半导体元件的顶面侧电极电连接且包括从侧面突出的第一接合部以及导电性第二板状部的导电性的第一板状部，所述板状部件包括从侧面突出的第二接合部。第一接合部的底面和第二接合部的顶面彼此面对，并且经由导电结合材料电连接。在第一接合部的底面和第二接合部的顶面彼此面对的区域中设置接合材料厚度确保装置，以确保导电接合材料的厚度在上部第二接头部分的前端和第一接头部分的底面。

86. 发明授权

EP2862910B1 ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE USING SAME 有权转让
标题翻译：粘合剂组合物和半导体器件
公开(公告)号：EP2862910B1
公开(公告)日：2017-03-15
申请号：EP13803841.9
申请日：2013-06-14
申请人： Hitachi Chemical Company, Ltd.
发明人： NAKAKO Hideo , TANAKA Toshiaki , NATORI Michiko , ISHIKAWA Dai , MATSUMOTO Hiroshi
IPC分类号： C08K3/08 , C09J11/04 , C08K7/00 , H01L23/495 , H01L23/00 , C09J11/00 , C09J9/02 , H01B1/22 , C09J1/00
CPC分类号： C09J11/04 , C08K3/08 , C08K7/00 , C08K2003/0806 , C08K2003/0893 , C08K2201/001 , C09J1/00 , C09J9/02 , H01B1/22 , H01L23/49579 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/83 , H01L2224/2929 , H01L2224/29318 , H01L2224/29339 , H01L2224/29499 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83203 , H01L2224/83862 , H01L2224/92247 , H01L2924/00014 , H01L2924/10253 , H01L2924/12032 , H01L2924/12041 , H01L2924/12042 , H01L2924/1301 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15788 , H01L2924/181 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
摘要： An adhesive composition comprising silver particles containing silver atoms and zinc particles containing metallic zinc, wherein the silver atom content is 90 mass% or greater and the zinc atom content is from 0.01 mass% to 0.6 mass%, with respect to the total transition metal atoms in the solid portion of the adhesive composition.

87. 发明公开

EP3118896A8 SEMICONDUCTOR DEVICE 有权转让
标题翻译：半导体器件
公开(公告)号：EP3118896A8
公开(公告)日：2017-03-08
申请号：EP15760740.9
申请日：2015-01-15
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA , DENSO CORPORATION
发明人： KADOGUCHI, Takuya , HIRANO, Takahiro , KAWASHIMA, Takanori , FUKUTANI, Keita , OKUMURA, Tomomi , NISHIHATA, Masayoshi
IPC分类号： H01L23/48 , H01L25/07 , H01L25/18
CPC分类号： H01L23/49513 , H01L21/4825 , H01L21/4882 , H01L21/565 , H01L23/3121 , H01L23/3142 , H01L23/4334 , H01L23/49537 , H01L23/49551 , H01L23/49562 , H01L23/49568 , H01L23/49575 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/40 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/92 , H01L2224/29111 , H01L2224/32245 , H01L2224/33181 , H01L2224/40245 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/73215 , H01L2224/73265 , H01L2224/83801 , H01L2224/92165 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/181 , H01L2924/00012 , H01L2224/05599
摘要： The semiconductor device includes a semiconductor element, and an electro-conductive first plate-like part electrically connected to a top-face-side electrode of the semiconductor element and including a first joint part projecting from a side face, and an electro-conductive second plate-like part including a second joint part projecting from a side face. A bottom face of the first joint part and a top face of the second joint part face one another, and are electrically connected via an electro-conductive bonding material. A bonding-material-thickness ensuring means is provided in a zone where the bottom face of the first joint part and the top face of the second joint part face one another to ensure a thickness of the electro-conductive bonding material between an upper portion of a front end of the second joint part and the bottom face of the first joint part.
摘要翻译：该半导体装置包括半导体元件以及与半导体元件的顶面侧电极电连接且包括从侧面突出的第一接合部以及导电性第二板状部的导电性的第一板状部，所述板状部件包括从侧面突出的第二接合部。第一接合部的底面和第二接合部的顶面彼此面对，并且经由导电结合材料电连接。在第一接合部的底面和第二接合部的顶面彼此面对的区域中设置接合材料厚度确保装置，以确保导电接合材料的厚度在上部第二接头部分的前端和第一接头部分的底面。

88. 发明公开

EP3133105A1 HYDROSILYL-CONTAINING ORGANOPOLYSILOXANE, MAKING METHOD, ADDITION CURABLE SILICONE COMPOSITION, AND SEMICONDUCTOR PACKAGE 有权
标题翻译：水解石油醚有机硅氧烷，HERSTELLUNGSVERFAHREN，添加剂SILIKONZUSAMMENSETZUNG UNDHALBLEITERGEHÄUSE
公开(公告)号：EP3133105A1
公开(公告)日：2017-02-22
申请号：EP16179653.7
申请日：2016-07-15
申请人： Shin-Etsu Chemical Co., Ltd.
发明人： KUSUNOKI, Takayuki , TAKAMIZAWA, Yuusuke , MIZUNASHI, Tomoyuki
IPC分类号： C08G77/12 , C08G77/20 , C08L81/04 , C08L83/04 , H01L23/00 , H01L33/56 , C08G77/00
CPC分类号： C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08K5/56 , C08L81/04 , C08L83/00 , C08L83/04 , H01L23/29 , H01L23/296 , H01L24/29 , H01L33/501 , H01L33/56 , H01L2933/005
摘要： An organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule is novel. Also provided is an addition curable silicone composition comprising (A) a linear organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least 4 terminal hydrosilyl groups per molecule, and (C) a hydrosilylation catalyst.
摘要翻译：每分子具有至少4个末端氢化甲硅烷基的有机聚硅氧烷是新的。还提供了可加成固化的有机硅组合物，其包含（A）每分子具有至少两个烯基的线性有机聚硅氧烷，（B）每分子具有至少4个末端氢化甲硅烷基的有机聚硅氧烷，和（C）氢化硅烷化催化剂。

89. 发明公开

EP3128540A1 THERMOSETTING RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND ELECTRICAL/ELECTRONIC COMPONENT 有权
标题翻译： ÄRMEHÄRTENDEHARZZUSAMMENSETZUNG，HELLBLEITERBAUEMENTMENT ELEKTRISCHE / ELEKTRONISCHE KOMPONENTE
公开(公告)号：EP3128540A1
公开(公告)日：2017-02-08
申请号：EP14888419.0
申请日：2014-04-04
申请人： KYOCERA Corporation
发明人： FUJIWARA, Masakazu , SATAKE, Yu , NITANAI, Yuya
IPC分类号： H01L21/52
CPC分类号： H01L24/29 , H01L21/52 , H01L24/26 , H01L24/83 , H01L33/641 , H01L2224/2929 , H01L2224/29339 , H01L2224/29391 , H01L2224/8321 , H01L2224/8384 , H01L2224/83862 , H01L2924/0665 , H01L2924/10272 , H01L2924/1033 , H01L2924/12041
摘要： There are provided a thermosetting resin composition for semiconductor bonding and a thermosetting resin composition for light emitting device which have high thermal conductivity and an excellent heat dissipation property and are capable of reliable pressure-free bonding of a semiconductors element and a light emitting element to a substrate. A thermosetting resin composition comprising: (A) silver fine particles ranging from 1 mn to 200 nm in thickness or in minor axis; (B) a silver powder other than the (A), the silver powder having an average particle size of more than 0.2 µm and 30 µm or less; (C) resin particles; and (D) a thermosetting resin, wherein an amount of the (C) is 0.01 to 1 part by mass and an amount of the (D) is 1 to 20 parts by mass, to 100 parts by mass being a total amount of the silver fine particles (A) and the silver powder (B), a semiconductor device using the resin composition as a die attach paste, and an electrical/electronic component using the resin composition as a material for heat dissipation member bonding.
摘要翻译：提供了一种半导体结合用热固性树脂组合物和用于发光器件的热固性树脂组合物，其具有高导热性和优异的散热性能，并且能够将半导体元件和发光元件可靠地无压力地结合到基质。一种热固性树脂组合物，其包含：（A）厚度为1μm至200nm的银微粒或短轴; （B）除（A）以外的银粉，平均粒径大于0.2μm，30μm以下的银粉末; （C）树脂颗粒; 和（D）热固性树脂，其中（C）的量为0.01〜1质量份，（D）的量为1〜20质量份，相对于100质量份银微粒（A）和银粉（B），使用树脂组合物作为管芯贴附膏的半导体器件，以及使用该树脂组合物作为散热构件接合材料的电气电子部件。

90. 发明公开

EP2546869A4 SEMICONDUCTOR DEVICE, AND PROCESS FOR MANUFACTURE OF SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件及其制造方法半导体器件
公开(公告)号：EP2546869A4
公开(公告)日：2017-01-25
申请号：EP11844936
申请日：2011-09-08
申请人： FUJI ELECTRIC CO LTD
发明人： ONISHI KAZUNAGA , TAKAMIYA YOSHIKAZU , FUNAKOSHI TAKAAKI , KODAIRA YOSHIHIRO
IPC分类号： H01L21/52 , H01L21/60 , H01L23/12 , H01L25/04 , H01L25/18 , H05K3/34
CPC分类号： H01L24/32 , H01L23/3735 , H01L23/49811 , H01L23/49838 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/85 , H01L24/92 , H01L25/072 , H01L2224/26175 , H01L2224/291 , H01L2224/32225 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48647 , H01L2224/48747 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2224/73265 , H01L2224/83051 , H01L2224/83447 , H01L2224/85447 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01079 , H01L2924/0132 , H01L2924/014 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/15787 , H01L2924/19107 , H01L2924/30107 , H01L2924/3512 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： Reliability is improved while curbing manufacturing cost. A semiconductor device (100) includes a substrate (110), an insulating substrate (141 and 142) mounted on the substrate (110), a metal pattern (152 and 155) formed on the insulating substrate (141 and 142), an electronic part mounted on the metal pattern (152 and 155) across a bond, and a wire member (201 to 206), separate from a wiring wire, which contains a material repellent to the bond and is formed on the metal pattern (152 and 155) and around the electronic part.

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